Edge connector including internal layer contact, printed circuit board and electronic module incorporating same

1. An edge connector, comprising:

a substrate including a plurality of conductive layers, a first major exterior surface, a second major exterior surface, and a minor exterior surface located at terminal ends of the first and second major exterior surfaces; and

at least one conductive contact coupled to a first internal conductive layer and extending from a portion of the minor exterior surface, wherein at least a portion of the substrate extends outward from the minor exterior surface and the at least one conductive contact is affixed thereon.

2. The edge connector, as recited in claim 1 , wherein the at least one conductive contact forms a continuous contact by extending along the portion extending from the minor exterior surface.

3. The edge connector, as recited in claim 1 , further comprising a second internal conductive layer, at least another portion of the minor exterior surface extending inward from the minor exterior surface and including at least another conductive contact coupled to the second internal conductive layer.

4. The edge connector, as recited in claim 3 , wherein at least one of the at least one conductive contact and the at least another conductive contact forms a continuous contact along the minor exterior surface.

5. The edge connector, as recited in claim 1 , further comprising a second internal conductive layer coupled to at least another conductive contact extending from the minor exterior surface.

6. The edge connector, as recited in claim 5 , wherein the at least one conductive contact and the at least another conductive contact occupy only a portion of the minor exterior surface.

7. A printed circuit board, comprising:

a substrate including a plurality of conductive layers electrically insulated from each other and further including a first major exterior surface, a second major exterior surface, and a minor exterior surface located at terminal ends of the first and second major exterior surfaces;

a plurality of integrated circuit pads formed on at least one of the first major exterior surface and the second major exterior surface of the substrate for electrically interfacing with at least one integrated circuit; and

an edge connector formed on one edge of the substrate, the edge connector including at least one conductive contact coupled to a first internal conductive layer of the plurality of conductive layers and extending from a portion of the minor exterior surface, wherein at least a portion of the substrate extends outward from the minor exterior surface and the at least one conductive contact is affixed thereon.

8. The printed circuit board, as recited in claim 7 , wherein the at least one conductive contact forms a continuous contact by extending along the portion extending from the minor exterior surface.

9. The printed circuit board, as recited in claim 7 , further comprising a second internal conductive layer, at least another portion of the minor exterior surface extending inward from the minor exterior surface and including at least another conductive contact coupled to the second internal conductive layer.

10. The printed circuit board, as recited in claim 9 , wherein at least one of the at least one conductive contact and the at least another conductive contact forms a continuous contact along the minor exterior surface.

11. The printed circuit board, as recited in claim 7 , further comprising a second internal conductive layer coupled to at least another conductive contact extending from the minor exterior surface.

12. The printed circuit board, as recited in claim 11 , wherein the at least one conductive contact and the at least another conductive contact occupy only a portion of the minor exterior surface.

13. An electronic module, comprising:

a printed circuit board, including:

a substrate including a plurality of conductive layers electrically insulated from each other and further including a first major exterior surface, a second major exterior surface, and a minor exterior surface substantially orthogonal to at least one of the first and second major exterior surfaces;

a plurality of integrated circuit pads formed on at least one of the first major exterior surface and the second major exterior surface of the substrate for electrically interfacing with at least one integrated circuit; and

an edge connector formed on one edge of the substrate, the edge connector including at least one conductive contact coupled to a first internal conductive layer of the plurality of conductive layers and extending from a portion of the minor exterior surface, wherein at least a portion of the substrate extends outward from the minor exterior surface and the at least one conductive contact is affixed thereon;

at least one integrated circuit attached to at least one of the first major exterior surface and the second major exterior surface of the substrate.

14. An electronic system, comprising:

a processor;

at least one of an input device, output device, storage device, and electronic module operationally coupled to the processor; and

wherein at least one of the at least one input device, output device, storage device, and electronic module includes at least one edge connector formed on one end of a substrate including a plurality of conductive layers electrically insulated from each other and further including a first major exterior surface, a second major exterior surface and a minor exterior surface located at terminal ends of the first and second major exterior surfaces, the edge connector including at least one conductive contact coupled to a first internal conductive layer of the plurality of conductive layers and extending from a portion of the minor exterior surface, wherein at least a portion of the substrate extends outward from the minor exterior surface and the at least one conductive contact is affixed thereon.