Systems and methods for depositing material onto microfeature workpieces in reaction chambers
In one embodiment, the system includes a gas supply assembly having a first gas source, a first gas conduit coupled to the first gas source, a first valve assembly, a reaction chamber, and a gas distributor carried by the reaction chamber. The first valve assembly includes first and second valves that are in fluid communication with the first gas conduit. The first and second valves are configured in a parallel arrangement so that the first gas flows through the first valve and/or the second valve.
1. A method of depositing material onto a microfeature workpiece in a reaction chamber, the method comprising:
flowing a first pulse of a first gas through a first gas conduit, a first valve, and a second gas conduit and into the reaction chamber, wherein the second gas conduit is downstream from the first valve;
flowing a second pulse of the first gas through the first gas conduit, a second valve, and the second gas conduit and into the reaction chamber without flowing the second pulse of the first gas through the first valve; and
flowing a third pulse of the first gas through the first gas conduit and a third valve into the reaction chamber.
2. A method for depositing material onto a microfeature workpiece in a reaction chamber, the method comprising:
flowing a first pulse of a first gas through a first gas passageway in a valve assembly and into a first portion of a gas distributor at the reaction chamber; and
flowing a second pulse of the first gas through a second gas passageway in the valve assembly and into a second portion of the gas distributor, wherein the first and second portions of the gas distributor are in fluid communication with each other, wherein the first and second gas passageways are configured in a parallel arrangement and are in fluid communication with a first gas conduit;
flowing a third pulse of the first gas through a third gas passageway in the valve assembly; and
flowing a fourth pulse of the first gas through a fourth gas passageway in the valve assembly, wherein the third and fourth gas passageways are configured in a parallel arrangement with the first and second gas passageways and are in fluid communication with the first gas conduit.
3. A method for depositing material onto a microfeature workpiece in a reaction chamber, the method comprising:
opening a first valve to dispense a first pulse of a first gas into the reaction chamber through a first downstream main line;
closing the first valve;
opening a second valve to dispense a second pulse of the first gas into the reaction chamber through the first downstream main line; and
closing the second valve, wherein the first pulse of the first gas does not pass through the second valve and the second pulse of the first gas does not pass through the first valve.
4. The method of claim 3 , further comprising:
opening a third valve to dispense a first pulse of a second gas into the reaction chamber through a second downstream main line;
closing the third valve;
opening a fourth valve to dispense a second pulse of the second gas into the reaction chamber through the second downstream main line; and
closing the fourth valve, wherein the first pulse of the second gas does not pass through the fourth valve and the second pulse of the second gas does not pass through the third valve.
5. The method of claim 3 wherein closing the first valve occurs before opening the second valve.
6. The method of claim 3 , further comprising:
opening a third valve to dispense a third pulse of the first gas into the reaction chamber through the first downstream main line after closing the second valve; and
closing the third valve.