Schottky-barrier mosfet manufacturing method using isotropic etch process
A method of fabricating a transistor device for regulating the flow of electric current is provided wherein the device has Schottky-barrier metal source-drain contacts. The method, in one embodiment, utilizes an isotropic etch process prior to the formation of the metal source-drain contacts to provide better control of the Schottky-barrier junction location to a channel region. The improvements from the controllability of the placement of the Schottky-barrier junction enables additional drive current and optimizes device performance, thereby significantly improving manufacturability.
1. A method of manufacturing a device for regulating a flow of electrical current, comprising:
providing a semiconductor substrate;
introducing dopants into the semiconductor substrate, wherein the dopants in a channel region between source and drain electrodes are comprised of Arsenic, Phosphorous, or Antimony;
providing a gate electrode on the semiconductor substrate;
exposing the semiconductor substrate in an area proximal to the gate electrode;
etching the semiconductor substrate on the exposed area using a partially isotropic etch;
depositing a thin film of metal in the etched area of the semiconductor substrate; and
reacting the metal with the substrate such that a Schottky or Schottky-like source electrode or drain electrode is formed;
wherein the semiconductor substrate has a channel dopant concentration that varies significantly in a vertical direction and is generally constant in a lateral direction.
2. A method of manufacturing a device for regulating a flow of electrical current, comprising:
providing a semiconductor substrate;
introducing dopants into the semiconductor substrate, wherein the dopants in a channel region between source and drain electrodes are comprised of Boron, Indium, or Gallium;
providing a gate electrode on the semiconductor substrate;
exposing the semiconductor substrate in an area proximal to the gate electrode;
etching the semiconductor substrate on the exposed area using a partially isotropic etch;
depositing a thin film of metal in the etched area of the semiconductor substrate; and
reacting the metal with the substrate such that a Schottky or Schottky-like source electrode or drain electrode is formed;
wherein the semiconductor substrate has a channel dopant concentration that varies significantly in a vertical direction and is generally constant in a lateral direction.