Method of fabricating printed circuit board having embedded multi-layer passive devices

1. A method of fabricating a printed circuit board having embedded multi-layer passive devices, comprising the steps of:

applying an insulating layer on a base substrate constituting a core layer, and then laminating a resin coated copper (RCC) having a lower electrode layer on the insulating layer;

removing an upper copper foil of the RCC, and forming an inner electrode layer;

repeating the laminating of the RCC in the applying and removing steps several times, to form a plurality of dielectric layers and a plurality of inner electrode layers; and

forming a plurality of via holes through the printed circuit board having the plurality of dielectric layers and the plurality of inner electrode layers, and plating inner walls of the via holes to electrically conductively connect the inner electrode layers.

2. The method as set forth in claim 1 , wherein the removing step includes the steps of:

removing the upper copper foil of the RCC laminated on the insulating layer;

forming a seed layer on an insulating layer of the RCC without the upper copper foil, using electroless plating; and

forming the inner electrode layer on the seed layer, using electroplating.

3. The method as set forth in claim 2 , wherein the inner electrode layer has a thickness of 0.1-5 μm.

4. A method of fabricating a printed circuit board having embedded multi-layer passive devices, comprising the steps of:

applying an insulating layer on a base substrate constituting a core layer, and forming a lower electrode layer;

forming an insulating layer and an inner electrode layer on the lower electrode layer using an ultrathin foil carrier;

processing a via hole through the printed circuit board having the insulating layer and the inner electrode layer to electrically connect inner electrode layers; and

repeating the forming and processing steps to form a plurality of insulating layers and a plurality of inner electrode layers.

5. The method as set forth in claim 4 , wherein the applying step includes the steps of:

laminating a prepreg on the base substrate constituting the core layer, to form the insulating layer; and

laminating a foil on the insulating layer, and forming the lower electrode layer using an imaging process.

6. The method as set forth in claim 4 , wherein the forming step includes the steps of:

laminating a resin coated copper (RCC), comprising an insulating layer coated with a thin film, on the lower electrode layer using the ultrathin foil carrier;

removing a carrier from the ultrathin foil carrier, to expose the thin film of the RCC; and

subjecting the thin film to the imaging process, to form the inner electrode layer.