Bypass gas feed system and method to improve reactant gas flow and film deposition
View Patent ↗A method and reactant gas bypass system for carrying out a plasma enhanced chemical vapor deposition (PECVD) process with improved gas flow stability to avoid unionized reactant precursors and thickness non-uniformities the method including providing a semiconductor process wafer having a process surface within a plasma reactor chamber for carrying out at least one plasma process; supplying at least one reactant gas flow at a selected flow rate to bypass the plasma reactor chamber for a period of time to achieve a pre-determined flow rate stability; and, redirecting the at least one reactant gas flow into the plasma reactor chamber to carry out the at least one plasma process.
1. A bypass gas feed system for improving a plasma enhanced chemical vapor (PECVD) deposition process comprising:
a plasma reactor chamber for carrying out a PECVD process including an exhaust line; and,
at least one gas feed line in gaseous communication with at least one gas source and the plasma reactor chamber said at least one gas feed line including at least one gas flow rate control means for controlling a gas source flow rate and at least one gas flow control valve disposed downstream of the at least one gas flow rate control means for redirecting a gas source flow pathway between a bypass gas flow pathway to bypass the plasma reactor chamber and a gas flow pathway into the plasma reactor chamber, wherein a second exhaust line is provided for communicating with the bypass gas flow pathway.
2. The bypass gas feed system of claim 1 , wherein the at least one gas flow control valve comprises a first gas flow control valve upstream of the bypass gas flow pathway, a second gas flow control valve communicating with the bypass gas flow pathway, and a third gas flow control valve downstream of the bypass gas flow pathway and upstream of the plasma reactor chamber.
3. The bypass gas feed system of claim 1 , wherein the gas flow rate control means and the at least one gas flow control valve are in electrical communication with a controller for automated selective control respectively of a gas flow rate and a gas control valve state.
4. The bypass gas feed system of claim 1 , wherein the gas flow rate control means comprises a mass flow controller.
5. The bypass gas feed system of claim 1 , wherein the at least one gas feed line is in communication with at least two gas sources each gas source selectively supplied by a first gas flow rate control means for controlling a gas flow disposed upstream of a second gas flow rate control means for controlling a gas flow rate into one of the bypass gas flow pathway and the gas flow pathway into the plasma reactor chamber.
6. The bypass gas feed system of claim 1 , wherein the gas flow pathway into the plasma reactor chamber is disposed in at least one of a top portion, a side portion, and a bottom portion of the plasma reactor chamber.
7. The bypass gas feed system of claim 1 , wherein the at least one gas flow control valve comprises a three-way gas flow redirecting valve for redirecting at least two gas flow pathways and forming closed state for redirecting the gas source flow pathway.
8. The bypass gas feed system of claim 7 , wherein the at least one gas flow control valve further comprises a second gas flow control valve downstream of the three-way gas flow redirecting valve and bypass gas flow pathway for forming one of an open or closed gas flow pathway into the plasma reactor chamber.
9. The bypass gas feed system of claim 1 , wherein the bypass gas flow pathway bypasses the plasma reactor chamber to communicate with the exhaust line.
10. The bypass gas feed system of claim 9 , wherein the bypass gas flow pathway communicates with the exhaust line between a first pumping means and a second pumping means.
11. A method for carrying out a plasma enhanced chemical vapor deposition (PECVD) process with improved gas flow stability to avoid unionized reactant precursors and thickness non-uniformities comprising the steps of:
providing a semiconductor process wafer having a process surface within a plasma reactor chamber for carrying out at least one plasma process;
supplying at least one reactant gas flow at a selected flow rate to bypass the plasma reactor chamber for a period of time to achieve a predetermined flow rate stability; and,
redirecting the at least one reactant gas flow into the plasma reactor chamber to carry out the at least one plasma process.
12. The method of claim 11 , further comprising repeating the step of supplying during the step of redirecting prior to carrying out a subsequent step of redirecting for carrying out a subsequent plasma process.
13. The method of claim 11 , wherein a plasma is formed and maintained during the steps of supplying and redirecting.
14. The method of claim 12 , wherein the at least one plasma process comprises a first sputter cleaning process and the subsequent plasma process comprises a PECVD process.
15. The method of claim 14 , wherein the PECVD process comprises depositing silicon nitride wherein the at least one reactant gas flow comprises silane (SiH 4 ).
16. The method of claim 14 , wherein the sputter cleaning process comprises ammonia (NH 3 ) gas.
17. The method of claim 15 , wherein the process surface comprises exposed copper containing semiconductor features.
18. The method of claim 11 , wherein the step of supplying at least one reactant gas flow at a selected flow rate comprises a flow rate within about 10 percent of a beginning gas flow rate of the plasma process.
19. The method of claim 18 , wherein following the step of redirecting the at least one reactant gas flow rate is varied over the course of the plasma process.