Laser assisted material deposition
A method of forming a film on a substrate includes activating a gas precursor to form a material on the substrate by irradiating the gas precursor with electromagnetic energy at a frequency tuned to an absorption frequency of the gas precursor.
1. A method for forming a film on a substrate comprising:
activating a gas to generate a precursor by irradiating the gas with electromagnetic energy at a frequency tuned to a bond energy of the gas, the electromagnetic energy sourced from a diode laser of a diode laser array, the diode laser array having at least one diode laser with a center frequency different from that of another diode laser of the laser array; and
forming a material on the substrate using the generated precursor.
2. The method of claim 1 , wherein the method includes limiting the activation of the gas to within a mean free path of the gas precursor from the substrate.
3. The method of claim 1 , wherein the method includes limiting the activation of the gas to above the substrate and within ten mean free paths of the gas from the substrate.
4. The method of claim 1 , wherein the method includes activating a second gas with electromagnetic energy having a second center frequency tuned to a bond energy of the second gas, the electromagnetic energy having the second center frequency sourced from a second diode laser of the diode laser array.
5. The method of claim 4 , wherein activating the gas and activating the second gas are performed in a common stage of processing.
6. The method of claim 4 , wherein activating the gas and activating the second gas are performed in different stages of processing.
7. The method of claim 1 , wherein the method includes controlling an amount of energy to activate the gas.
8. The method of claim 1 , wherein the method includes physically measuring the absorption frequency of the gas precursor before activating the gas.
9. The method of claim 1 , wherein the method includes forming the material in an integrated circuit on the substrate.
10. The method of claim 1 , wherein the method includes forming the material in a transistor on the substrate.
11. The method of claim 1 , wherein the method includes forming the material in a memory on the substrate.
12. The method of claim 1 , wherein the method includes forming the material in an integrated circuit on the substrate and coupling the integrated circuit to a controller.
13. The method of claim 1 , wherein coupling the integrated circuit to a controller includes coupling the integrated circuit to a processor.