Three-dimensional semiconductor device provided with interchip interconnection selection means for electrically isolating interconnections other than selected interchip interconnections
View Patent ↗In a three-dimensional semiconductor device in which a plurality of semiconductor circuit chips are stacked and that is provided with a plurality of interchip interconnections for signal transmission between these semiconductor circuit chips, when transmitting signals, only one interchip interconnection that serves for signal transmission is selected and other interchip interconnections are electrically isolated by means of switches that are provided between the interchip interconnections and signal lines. Interchip interconnection capacitance relating to the charge and discharge of interconnections is thus minimized.
1. A three-dimensional semiconductor device in which a plurality of semiconductor circuit chips are stacked with an interface chip for realizing signal transmission from the semiconductor circuit chips, wherein each of said semiconductor circuit chips is divided into a plurality of sub-circuit regions, and comprises a plurality of interchip interconnections for realizing signal transmission between each of said semiconductor circuit chips are provided in each of the sub-circuit regions that are in the same position on each of said semiconductor circuit chips, the device comprising:
an interchip interconnection selection means is provided on said interface chip for, when transmitting a signal with one sub-circuit region among said plurality of sub-circuit regions, selecting from among said plurality of interchip interconnections an interchip interconnection that is to be the signal transmission path when transmitting the signal and electrically isolating interchip interconnections other than the selected interchip interconnection from the selected interchip interconnection; and
on said interface chip, an in-plane interconnection isolation means for electrically isolating in-plane interconnections that are connected to interchip interconnections other than the interchip interconnection that has been selected by said interchip interconnection selection means from in-plane interconnections that are connected to the interchip interconnection that has been selected by said interchip interconnection selection means.
2. The three-dimensional semiconductor device according to claim 1 , wherein said interchip interconnection selection means comprises:
a plurality of first switches that are provided to correspond to each of said plurality of interchip interconnections for switching electrical connections between the interchip interconnections and signal lines, and
a first decoder for generating a first control signal for turning ON only the first switch that is provided for the interchip interconnection to the sub-circuit region in which signal transmission is to be carried out.
3. The three-dimensional semiconductor device according to claim 2 , wherein said plurality of stacked semiconductor circuit chips are memory cell array chips in which a plurality of memory cells are formed, and signals that are transmitted on said plurality of interchip interconnections are data to be written to said plurality of memory cells or data to be read from said plurality of memory cells.
4. The three-dimensional semiconductor device according to claim 3 , wherein said first control signals for selecting and isolating interchip interconnections are signals generated from a row decoder and a column decoder for selecting memory cells.
5. The three-dimensional semiconductor device according to claim 3 , wherein said first control signals for selecting and isolating interchip interconnections are bank selection signals for selecting banks that contain memory cells that are to be activated.
6. The three-dimensional semiconductor device according to claim 1 , wherein said plurality of stacked semiconductor circuit chips are memory cell array chips in which a plurality of memory cells are formed, and signals that are transmitted on said plurality of interchip interconnections are data to be written to said plurality of memory cells or data to be read from said plurality of memory cells.
7. The three-dimensional semiconductor device according to claim 1 , further comprising:
on each of said semiconductor circuit chips, a sub-circuit region isolation means for electrically isolating an interchip interconnection that has been selected by said interchip interconnection selection means from sub-circuit regions in which signal transmission is not to be carried out.
8. The three-dimensional semiconductor device according to claim 7 , wherein said sub-circuit region isolation means comprises:
a plurality of second switches that are provided to correspond to each of said sub-circuit regions on said plurality of semiconductor circuit chips for switching electrical connections between said sub-circuit regions and interchip interconnections that are provided for the sub-circuit regions; and
a second decoder for generating a second control signal for turning ON only the second switch that is provided for the sub-circuit region in which signal transmission is to be carried out.
9. The three-dimensional semiconductor device according to claim 1 , wherein said interchip interconnections are through-vias that pass through the semiconductor substrates.