Thermally enhanced molded package for semiconductors
An integrated circuit package ( 50 ) is provided which comprises a substrate ( 20 ), an integrated circuit ( 12 ) mounted on the substrate, and a compressive, thermally conductive interposer ( 52 ) mounted on the integrated circuit.
1. An integrated circuit package, comprising:
a substrate;
an integrated circuit mounted on said substrate;
a first an essentially z-shaped, compressive, thermally conductive interposer mounted on said integrated circuit;
a heat spreader mounted on said first interposer, and
a molding compound disposed between said heat spreader and said substrate.
2. The integrated circuit package of claim 1 , wherein said package comprises thermally conductive material in the form of shaped sheets.
3. The integrated circuit package of claim 1 , wherein said package comprises a metal or metal alloy.
4. The integrated circuit package of claim 1 , wherein said package comprises a non-compressive, thermally conductive section attached to a compressive section.
5. The integrated circuit package of claim 4 , further comprising a second non-compressive, thermally conductive interposer attached to a side of said thermally conductive, deformable interposer.
6. The integrated circuit package of claim 1 , wherein one side of the first interposer is exposed to the outside of said integrated circuit package.
7. The integrated circuit package of claim 6 , wherein said integrated circuit has an active side and a non-active side, wherein said active side faces the substrate, and wherein said non-active side faces the first interposer.
8. The integrated circuit package of claim 7 , wherein said first interposer is mounted to the non-active side of the integrated circuit by means of a thermally conductive adhesive.
9. The integrated circuit package of claim 7 , wherein said first interposer is mounted to the non-active side of the integrated circuit by means of a thermally conductive paste.
10. The integrated circuit package of claim 6 , wherein said integrated circuit has an active side and a non-active side, wherein said non-active side is facing the substrate, and wherein the active side faces the first interposer.
11. The integrated circuit package of claim 10 wherein said first interposer is mounted to the active side of the integrated circuit by means of a thermally conductive adhesive.
12. The integrated circuit package of claim 10 , wherein said thermally conductive adhesive is not electrically conductive.
13. The integrated circuit package of claim 12 , wherein said thermally conductive, non-electrically conductive adhesive is in the form of a tape adhesive.
14. The integrated circuit package of claim 5 , wherein said integrated circuit has an active side and a non-active side, and wherein said second interposer is sandwiched between the first interposer and the active side of the integrated circuit.
15. The integrated circuit package of claim 14 , wherein said second interposer is affixed to the active side of the integrated circuit with a thermally conductive, non-electrically conductive adhesive, and wherein said second interposer is affixed to the compressive interposer with thermally conductive adhesive.
16. An integrated circuit package, comprising:
a substrate;
an integrated circuit attached to said substrate; and
a an essentially z-shaped, compressive, thermally conductive interposer which is mounted on said integrated circuit, and which comprises a non-compressive, thermally conductive layer;
wherein said non-compressive, thermally conductive layer has at least one surface exposed to the outside of the integrated circuit package.
17. The integrated circuit package of claim 16 , wherein said integrated circuit has an active side and a non-active side, wherein said active side faces the substrate, and wherein said non-active side faces the compressive, thermally conductive interposer.
18. The integrated circuit package of claim 17 , wherein said compressive, thermally conductive interposer is mounted to the non-active side of the integrated circuit by means of a thermally conductive adhesive.
19. The integrated circuit package of claim 17 , wherein said compressive, thermally conductive interposer is mounted to the non-active side of the integrated circuit by means of a thermally conductive paste.
20. The integrated circuit package of claim 16 , wherein said integrated circuit has an active side and a non-active side, wherein the non-active side faces the substrate, and wherein the active side faces the compressive, thermally conductive interposer.
21. The integrated circuit package of claim 20 , wherein said compressive, thermally conductive interposer is mounted to the active side of the integrated circuit by means of a thermally conductive adhesive.
22. The integrated circuit package of claim 21 , wherein said thermally conductive adhesive is not electrically conductive.
23. The integrated circuit package of claim 17 , wherein said thermally conductive, non-electrically conductive adhesive is present as an adhesive tape.
24. The integrated circuit package of claim 20 , wherein said thermally conductive, non-compressive interposer layer is sandwiched between the compressive, thermally conductive interposer and the active side of the integrated circuit.
25. The integrated circuit package of claim 24 , wherein said non-compressive interposer layer is affixed to the active side of the integrated circuit with thermally conductive, non-electrically conductive adhesive, and wherein said non-compressive interposer layer is affixed to the compressive interposer with thermally conductive adhesive.
26. An integrated circuit package, comprising:
an integrated circuit which generates heat;
a heat spreader;
a first, non-compressive interposer disposed between said integrated circuit and said heat spreader; and
a second an essentially z-shaped, compressive, thermally conductive interposer disposed between said heat spreader and said first interposer;
wherein said compressive, thermally conductive interposer forms a thermally conductive path between the integrated circuit and an exterior surface of the package.
27. The integrated circuit package of claim 26 , further comprising a molding compound disposed between said heat spreader and said first interposer.