IP Library › Granted Patent US 7,363,966
Granted Patent B2
US 7,363,966 · App. 11/135,628 · Granted Apr 29, 2008

Heat dissipating device

Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd.; Foxconn Technology Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,363,966
App. No.
11/135,628
Granted
Apr 29, 2008
Kind
B2
Abstract

A heat dissipating device ( 1 ) includes a heat spreader ( 10 ), a radiator ( 2 ), at least one U-shaped heat pipe ( 12 ), a fan ( 3 ) mounted on the radiator and a pair of clips ( 4 ). The radiator includes a first heat sink ( 20 ) and a second heat sink ( 22 ). The first heat sink ( 20 ) includes a first base ( 200 ) and a plurality of fins ( 202 ) extending from a side of the first base. The second heat sink ( 22 ) includes a second base ( 220 ) and a plurality of fins ( 222 ) extending from a side of the second base. The heat pipe ( 12 ) includes an evaporating portion ( 120 ) attached to the heat spreader and a pair of condensing portions ( 122 ) extending upwardly from opposite ends of the evaporating portion. The two condensing portions are sandwiched between the first base and the second base. The heat pipe transfers heat from the heat spreader to both of the first base and second base.

Claims (32)

1. A heat dissipating device comprising:

a heat spreader;

a first heat sink comprising a first base;

a second heat sink comprising a second base; and

a heat pipe comprising a first end attached to the heat spreader, and a second end sandwiched between the first base and the second base, the heat pipe transferring heat from the heat spreader to both of the first base and the second base;

wherein the second base contacts the first base.

2. The heat dissipating device of claim 1 , wherein the first and second bases are respectively perpendicular to the heat spreader.

3. The heat dissipating device of claim 2 , wherein the first and second heat sinks each comprise a plurality of parallel fins extending laterally from a side thereof.

4. The heat dissipating device of claim 3 , wherein the fins are perpendicular to the first and second bases.

5. The heat dissipating device of claim 1 , further comprising an additional heat pipe juxtaposed to the heat pipe.

6. The heat dissipating device of claim 5 , wherein the first base forms a protrusion portion, the second base defines a recess portion, the additional heat pipe is sandwiched between the protrusion and the recess portion.

7. The heat dissipating device of claim 1 , further comprising a fan mounted on the radiator via a pair of clips.

8. The heat dissipating device of claim 7 , wherein each clip comprises a body being located on the second heat sink, and a tab perpendicularly extending from the body for fixing the fan onto the first heat sink and the second heat sink.

9. A heat dissipating device comprising:

a heat spreader;

a radiator comprising a base and a plurality of fins extending outwardly from a pair of opposite sides of the base;

a pair of clips secured to another pair of opposite sides of the base;

a fan mounted onto the radiator via the clips; and

a heat pipe transferring heat from the heat spreader to the base.

10. The heat dissipating device of claim 9 , wherein the base is positioned between the heat spreader and the fan.

11. The heat dissipating device of claim 9 , wherein the base is perpendicular to the heat spreader.

12. The heat dissipating device of claim 11 , wherein the fins are perpendicular to the base and the heat spreader.

13. The heat dissipating device of claim 9 , wherein the radiator comprises a first heat sink having a first base, and a second heat sink having a second base.

14. The heat dissipating device of claim 13 , further comprising an additional heat pipe juxtaposed to the heat pipe.

15. The heat dissipating device of claim 14 , wherein the first base forms a protrusion portion, the second base defines a recess portion, the additional heat pipe is sandwiched between the protrusion and the recess portion.

16. The heat dissipating device of claim 9 , wherein each clip comprises a body being located on the radiator, and a tab perpendicularly extending from the body for fixing the fan onto the radiator.

17. A heat dissipating device comprising:

a heat spreader adapted for contacting with a heat-generating electronic device;

a first heat sink mounted on the heat spreader and a second heat sink mounted on the heat spreader;

first and second U-shaped heat pipes each having a horizontal evaporating portion thermally connecting with the heat spreader, and two vertical condensing portions thermally connecting with the first and second heat sinks, the first and second heat sinks having fins laterally extending in opposite directions.

18. The heat dissipating device of claim 17 , wherein the heat spreader has ears extending outwardly adapted for fastening the heat dissipating device to a retainer of the heat-generating electronic device.

19. The heat dissipating device of claim 18 further comprising a pair of clips fastened to two side surfaces of one of the first and second heat sinks, and a fan mounted on the clips and be located over a top of the first and second heat sinks.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2008
From: FOXCONN TECHNOLOGY CO., LTD.
To: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.; FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 020597/0303 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2005
From: YU, GUANG; LEE, HSIEH-KUN; LU, CUI-JUN
To: FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 016606/0476 →
Priority Claims (1)
CN 2004 2 0103598 U · Dec 30, 2004 · national
Continuity (1)
Related Publication 20060144572A1 · Jul 6, 2006