Base pad polishing pad and multi-layer pad comprising the same
Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine pores, it is possible to prevent permeation of polishing slurry and water and to avoid non uniformity of physical properties. Thereby, it is possible to lengthen the lifetime of the polishing pad.
1. A base pad of a chemical mechanical polishing pad, which does not include fine pores and has a hardness of 10-100 Shore D and compressibility of 1-10%,
wherein the base pad is produced in such a manner that at least one compound is selected from the group consisting of polyurethane, PVC, polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyethylene oxide, maleic acid copolymer, methylcellulose, and carboxymethylcellulose, is reacted in a first reactor to first produce a prepolymer, and
the prepolymer is reacted with a substance having either a polyol reaction group in weight ratio of 3:1-2:1 or an ammonia reaction group in a weight ratio of 3:1-2:1 in a second step so as to achieve complete hardening.
2. The base pad as set forth in claim 1 , wherein the base pad is 500-2500 micrometers in thickness.
3. A multilayer polishing pad which is produced using a base pad including no fine pores and having hardness of 10-100 Shore D and compressibility of 1-10%,
wherein the base pad is produced in such a manner that at least one compound selected from the group consisting of polyurethane, PVC, polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyethylene oxide, maleic acid copolymer, methylcellulose, and carboxymethylcellulose, is reacted in a first reactor to first produce a prepolymer, and
the prepolymer is reacted with a substance having either a polyol reaction group in a weight ratio of 3:1-2:1 or an ammonia reaction group in a weight ratio of 3:1-2:1 in a second step so as to achieve complete hardening.
4. The multilayer polishing pad as set forth in claim 3 , comprising a polishing pad having a polishing layer for polishing, and a base pad for supporting the polishing pad.
5. The multilayer polishing pad as set forth in claim 3 , wherein the multilayer polishing pad has a thickness of 2000-4000 micrometers, in which the base pad has a thickness of 500-2500 micrometers.