Semiconductor package having enhanced heat dissipation and method of fabricating the same
A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate. A method of fabricating the semiconductor chip package is also provided.
1. A semiconductor package, comprising:
a substrate having top and bottom surfaces;
a semiconductor chip formed on the top surface of the substrate;
a ball terminal land formed on the bottom surface of the substrate;
a first heat spreader adhered to an upper surface of the semiconductor chip and comprising; a flat metal plate, and a plurality of metal balls arranged on the flat metal plate; and,
a ball terminal adhered to the ball terminal land.
2. The semiconductor package of claim 1 , wherein the metal balls are arranged on the flat metal plate so that the metal balls form a layer.
3. The semiconductor package of claim 2 , wherein the flat metal plate is formed from a material selected from the group consisting of Al, Cu, Au, Ag, Ni and compounds thereof.
4. The semiconductor package of claim 2 , wherein the flat metal plate is adhered to the upper surface of the semiconductor chip by a non-metallic adhesive.
5. The semiconductor package of claim 1 , wherein side surfaces of the metal balls are connected to each other such that the metal balls form a single body.
6. The semiconductor package of claim 1 , wherein a diameter of each metal ball is about 0.2 mm to about 2.0 mm.
7. The semiconductor package of claim 1 , wherein a heat conductivity of each metal ball is about 20 W/mK to about 30 W/mK.
8. The semiconductor package of claim 1 , wherein the metal balls are bonded to the flat metal plate.
9. The semiconductor package of claim 1 , wherein the metal balls are adhered to the flat metal plate by an adhesive.
10. The semiconductor package of claim 1 , further comprising:
a molding material, wherein the molding material covers the semiconductor chip and the first heat spreader except at an upper surface of first heat spreader;
a heat sink plate adhered to the molding material and covering the first heat spreader; and,
a heat sink adhered to the heat sink plate.
11. The semiconductor package of claim 1 , further comprising a second heat spreader that covers side surfaces of the semiconductor chip and the first heat spreader, and an upper surface of first heat spreader, wherein the second heat spreader is a flat plate type heat spreader.
12. The semiconductor package of claim 11 , wherein an inside surface of the second heat spreader contacts a molding material, wherein the molding material covers the entire first heat spreader.
13. The semiconductor package of claim 11 , wherein the inside surface of the second heat spreader contacts a molding material, wherein the molding material covers the first heat spreader except at an upper surface of the first heat spreader.
14. The semiconductor package of claim 13 , wherein the exposed upper surface of the first heat spreader contacts an inside surface of the second heat spreader.
15. A semiconductor package module, comprising:
a plurality of semiconductor chip packages, each comprising a semiconductor chip and a first heat spreader adhered to the semiconductor chip, wherein the first heat spreader comprises a metal plate and a plurality of metal balls arranged on the metal plate;
a heat sink plate adhered to the plurality of semiconductor chip packages via the first heat spreaders associated with the plurality of chip packages; and,
a heat sink formed on the heat sink plate.
16. The semiconductor package of claim 15 , further comprising a heat conductive material interposed between the first heat spreaders and the heat sink plate.
17. A semiconductor package, comprising:
a semiconductor chip disposed on a substrate; and
a first heat spreader disposed on the semiconductor chip and comprising a metal plate and a plurality of metal balls disposed on the metal plate.
18. The semiconductor package of claim 17 , wherein the metal balls are arranged on the metal plate in a layer.
19. The semiconductor package of claim 17 , further comprising:
a molding material covering the semiconductor chip and the first heat spreader, except an exposed surface of first heat spreader;
a heat sink plate thermally connected to the exposed surface of the first heat spreader; and
a heat sink thermally connected to the heat sink plate.
20. The semiconductor package of claim 17 , further comprising:
a molding material covering the semiconductor chip and the first heat spreader, except an exposed surface of first heat spreader;
a second heat spreader disposed on the substrate to cover the semiconductor chip and thermally connected to the exposed surface of the first heat spreader.