IP Library › Granted Patent US 7,443,344
Granted Patent B2
US 7,443,344 · App. 10/568,010 · Granted Oct 28, 2008

Antenna arrangement and a module and a radio communications apparatus having such an arrangement

Assignee: NXP B.V.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,443,344
App. No.
10/568,010
Granted
Oct 28, 2008
Kind
B2
Abstract

An antenna arrangement for a radio communications apparatus such as a mobile phone, comprises a substantially planar patch conductor having a first feed connection point for connection to radio circuitry and a second feed connection point for connection to a ground plane, a first, differential slot in the patch conductor between the first and second connection points and a second, dual band slot located in the patch conductor outside the area between the first and second connection points. The length of the first slot is greater than a quarter wavelength, and provides a third resonant frequency increasing the bandwidth of the antenna. The width of the patch conductor between the first and the second slots is selected to obtain a low impedance transformation and thereby a low antenna resistance causing detuning the antenna. A user holding the phone increases the antenna resistance thereby tuning the antenna.

Claims (7)

1. An antenna arrangement comprising a substantially planar patch conductor having a first feed connection point for connection to radio circuitry and a second feed connection point or connection to a ground plane, a first, differential slot in the patch conductor between the first and second connection points and a second, dual band slot located in the patch conductor outside the area between the first and second connection points, wherein the length of the first slot is such as to provide an additional resonance, and the width of the patch conductor between the first and the second slots is selected to give an impedance less than a system impedance.

2. An antenna arrangement as claimed in claim 1 , wherein the length of the first slot is greater than a quarter wavelength.

3. An antenna arrangement as claimed in claim 1 , wherein the length of the first slot is such that the additional resonance combines with an adjacent resonance.

4. A module comprising a printed circuit board providing a ground plane, radio circuitry mounted on the PCB, and an antenna arrangement, the antenna arrangement comprising a substantially planar patch conductor having a first feed connection point for connection to the radio circuitry and a second feed connection point for connection to the ground plane, a first, differential slot in the patch conductor between the first and second connection points and a second, dual band slot located in the patch conductor outside the area between the first and second connection points, wherein the length of the first slot is such as to provide an additional resonance, and the width of the patch conductor between the first and the second slots is selected to give an impedance less than a system impedance.

5. A module as claimed in claim 4 , wherein the length of the first slot is greater than a quarter wavelength.

6. A module as claimed in claim 4 , wherein the length of the first slot is such that the additional resonance combines with an adjacent resonance.

7. A radio communications apparatus comprising a casing containing a printed circuit board providing a ground plane, radio circuitry mounted on the printed circuit board, and an antenna arrangement, the antenna arrangement comprising a substantially planar patch conductor having a first feed connection point for connection to the radio circuitry and a second feed connection point for connection to the ground plane, a first, differential slot in the patch conductor between the first and second connection points and a second, dual band slot located in the patch conductor outside the area between the first and second connection points, wherein the length of the first slot is such as to provide an additional resonance, and the width of the patch conductor between the first and the second slots is selected to give an impedance less than a system impedance.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043955/0001 →
CHANGE OF NAME Recorded Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0436 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2006
From: BOYLE, KEVIN R.
To: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
Reel/Frame 017574/0146 →
Priority Claims (1)
GB 0319211.9 · Aug 15, 2003 · national
Continuity (1)
Related Publication 20060290569A1 · Dec 28, 2006