IP Library › Granted Patent US 7,458,466
Granted Patent B2
US 7,458,466 · App. 11/280,161 · Granted Dec 2, 2008

Stack processing tray for integrated circuit devices

Assignee: Micron Technology, Inc.
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Quick Facts
Patent No.
US 7,458,466
App. No.
11/280,161
Granted
Dec 2, 2008
Kind
B2
Abstract

A stack processing tray for use with tray-based integrated circuit device handling systems is disclosed. The stack processing tray has a plurality of cells, each cell being configured to receive at least two integrated circuit devices in a vertically superimposed, stacked relationship. Increased efficiency in the handling and processing of integrated circuit devices is realized as the tray-based integrated circuit device handling system performs fewer tray movements, and therefore less work, to handle a given number of integrated circuit devices.

Claims (20)

1. A stack processing tray carrying a plurality of at least substantially identical integrated circuit devices, comprising:

a generally planar latticework forming a plurality of rectangular cells, each of the rectangular cells being dimensioned in length to at least substantially conform to a length of an integrated circuit device of the plurality of at least substantially identical integrated circuit devices and dimensioned in width to at least substantially conform to a width of the integrated circuit device of the plurality of at least substantially identical integrated circuit devices;

a cell base;

at least one stack of at least two vertically superimposed integrated circuit devices of the plurality of at least substantially identical integrated circuit devices positioned on the cell base in a rectangular cell of the plurality of rectangular cells; and

a lead protection element interposed between the at least two vertically superimposed integrated circuit devices.

2. The stack processing tray of claim 1 , wherein the lead protection element comprises a plate-like structure sized and configured to prevent contact between vertically adjacent integrated circuit devices received within the rectangular cell when the lead protection element is interposed therebetween.

3. The stack processing tray of claim 1 , wherein the lead protection element comprises a sleeve configured to slidably mate with a plurality of leads of one integrated circuit device of the at least two superimposed integrated circuit devices.

4. The stack processing tray of claim 1 , wherein the rectangular cell of the plurality is configured to receive at least three superimposed semiconductor devices.

5. The stack processing tray of claim 1 , wherein the plurality of rectangular cells is arranged in a two-dimensional array.

6. The stack processing tray of claim 5 , wherein the plurality of rectangular cells is arranged in a plurality of rows and a plurality of columns of rectangular cells.

7. A stack processing tray carrying a plurality of at least substantially identical integrated circuit devices, comprising:

a generally planar latticework forming a plurality of cells, each of the cells being dimensioned to at least substantially conform to a periphery of an integrated circuit device of the plurality of at least substantially identical integrated circuit devices;

a cell base;

at least two vertically stacked integrated circuit devices of the plurality of at least substantially identical integrated circuit devices positioned on the cell base in a cell of the plurality of cells; and

a lead protection element interposed between the at least two vertically stacked integrated circuit devices.

8. The stack processing tray of claim 7 , wherein the lead protection element comprises a plate-like structure sized and configured to prevent contact between the at least two stacked integrated circuit devices.

9. The stack processing tray of claim 7 , wherein the lead protection element comprises a sleeve configured to slidably mate with a plurality of leads of one integrated circuit device of the at least two stacked integrated circuit devices.

10. The stack processing tray of claim 7 , wherein the cell of the plurality is configured to receive at least three stacked semiconductor devices.

11. The stack processing tray of claim 7 , wherein the plurality of cells is arranged in a two-dimensional array.

12. The stack processing tray of claim 11 , wherein the plurality of cells is arranged in a plurality of rows and a plurality of columns of cells.

Continuity (3)
Continuation 1017213400 · Jun 14, 2002
Division 0951166000 · Feb 22, 2000
Related Publication 20060078415A1 · Apr 13, 2006