Absorbing boundary for a multi-layer circuit board structure
The invention comprises an improved PCB board design having particular utility for high frequency application, and especially useful to alleviate the problem of electromagnetic disturbance of signals switching through power and ground planes. In one embodiment, the PCB contains a magnetically loaded absorbing boundary to absorb the EM disturbances and keep them from resonating inside the cavity between the power and ground planes. The boundary is preferably placed at an edge or edges of the PCB, where it is unlikely to affect any other signals on the PCB. Exemplary materials for the boundary have a magnetic loss tangent of 1.0 to 1.5 with an attenuation constant of −20 dB/cm over frequencies of interest. Depending on whether the boundary material is solid or non-solid, it may be adhered to the edges of the PCB, or may be applied to the edge and cured. It is preferable that the boundary material span through substantially the entire height of the dielectric cavity between the power and ground planes to best absorb the electromagnetic disturbances.
1. A circuit structure having different planes, comprising:
a first signal trace at a first plane;
a power plane;
a ground plane;
a second signal trace at a second plane;
a via coupling the first signal trace to the second signal trace through the power and ground planes; and
a magnetically loaded boundary for absorbing electromagnetic radiation at at least one edge of the circuit structure, wherein the boundary is in contact with both the power and ground planes.
2. The circuit structure of claim 1 , wherein the boundary occurs at all edges of the circuit structure.
3. The circuit structure of claim 1 , wherein the boundary comprises a material having a higher loss tangent than a dielectric on the circuit structure.
4. The circuit structure of claim 1 , wherein the boundary comprises a material having a higher attenuation constant than a dielectric on the circuit structure.
5. The circuit structure of claim 1 , wherein the circuit structure comprises a printed circuit board.
6. A circuit structure, comprising:
a signal path transgressing through a via, wherein the via passes through a power plane and a ground plane;
a cavity between the power and ground planes; and
a magnetically loaded boundary for absorbing electromagnetic radiation at at least one edge of the cavity, wherein the boundary is in contact with both the power and ground planes.
7. The circuit structure of claim 6 , wherein the boundary occurs at all edges of the circuit structure.
8. The circuit structure of claim 6 , wherein the cavity comprises a dielectric material having a first loss tangent, and wherein the boundary comprises a material having a second loss tangent higher than the first loss tangent.
9. The circuit structure of claim 6 , wherein the cavity comprises a dielectric material having a first attenuation constant, and wherein the boundary comprises a material having a second attenuation constant higher than the first attenuation constant.
10. The circuit structure of claim 6 , wherein the boundary is positioned internal to an edge of the circuit structure.
11. The circuit structure of claim 6 , wherein the boundary is positioned at an external edge of the circuit structure.
12. The circuit structure of claim 6 , wherein the boundary is laterally spaced from edges of the power and ground planes.
13. The circuit structure of claim 6 , wherein the circuit structure comprises a printed circuit board.
14. A printed circuit board, comprising:
a power plane and a ground plane;
a cavity between the power and ground planes, wherein the cavity comprises a dielectric; and
a magnetically loaded boundary at at least one edge of the cavity in contact with both the power and ground planes for absorbing electromagnetic radiation, wherein the boundary imparts greater loss to electromagnetic radiation than does the dielectric.
15. The printed circuit board of claim 14 , wherein the cavity comprises a dielectric with a first loss tangent and a first attenuation constant, and wherein the material comprises a second loss tangent and a second attenuation constant, and wherein either the second loss tangent or second attenuation constant is higher than the first loss tangent or the first attenuation constant.
16. The printed circuit board of claim 14 , wherein the boundary occurs at all edges of the printed circuit board.
17. The printed circuit board of claim 14 , wherein the boundary is positioned internal to an edge of the printed circuit board.
18. The printed circuit board of claim 14 , wherein the boundary is positioned at an external edge of the printed circuit board.