IP Library Granted Patent US 7,525,136
Granted Patent B2
US 7,525,136 · App. 11/744,120 · Granted Apr 28, 2009

JFET device with virtual source and drain link regions and method of fabrication

Assignee: DSM Solutions, Inc.
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Quick Facts
Patent No.
US 7,525,136
App. No.
11/744,120
Granted
Apr 28, 2009
Kind
B2
Abstract

A junction field effect transistor comprises a semiconductor substrate. A source region of a first conductivity type is formed in the substrate. A drain region of the first conductivity type is formed in the substrate. A channel region of the first conductivity type is formed in the substrate. A gate region of a second conductivity type is formed in the substrate between the source and drain regions. A first virtual link region is formed in the substrate between the gate region and either the source region or the drain region. A dielectric material overlays the first virtual link region. A first electrode region overlays the dielectric material.

Claims (60)

1. A junction field effect transistor, comprising:

a semiconductor substrate;

a source region of a first conductivity type which is formed in the substrate;

a drain region of the first conductivity type which is formed in the substrate;

a channel region of the first conductivity type which is formed in the substrate;

a gate region of a second conductivity type formed in the substrate between the source and drain regions;

a first virtual link region formed in the substrate between the gate region and either the source region or the drain region;

a dielectric material which overlays the first virtual link region; and

a first electrode region which overlays the dielectric material;

wherein the first electrode region is operable to receive a bias voltage such that an inversion layer of impurities of the first conductivity type forms in the first virtual link region.

2. A junction field effect transistor, comprising:

a semiconductor substrate;

a source region of a first conductivity type which is formed in the substrate;

a drain region of the first conductivity type which is formed in the substrate;

a channel region of the first conductivity type which is formed in the substrate;

a gate region of a second conductivity type formed in the substrate between the source and drain regions;

a first virtual link region formed in the substrate between the gate region and either the source region or the drain region, the first virtual link region of the first conductivity type;

a dielectric material which overlays the first virtual link region;

a first electrode region which overlays the dielectric material; and

a gap region formed between the first virtual link region and the gate region;

wherein the first electrode region is operable to receive a bias voltage such that an accumulation layer of impurities of the first conductivity type forms in the first virtual link region.

3. The junction field effect transistor of claim 2 , wherein:

the first conductivity type comprises n-type and the bias voltage comprises a positive bias voltage; or

the first conductivity type comprises p-type and the bias voltage comprises a negative bias voltage.

4. The junction field effect transistor of claim 2 , wherein:

the bias voltage is applied when the transistor is in an ON-state; and

the bias voltage is not applied when the transistor is in an OFF-state.

5. The junction field effect transistor of claim 2 , wherein the accumulation layer of impurities forms a high conductivity path between the channel region and either the source region or the drain region.

6. The junction field effect transistor of claim 1 , further comprising a gap region formed between the first virtual link region and the gate region.

7. The junction field effect transistor of claim 1 , wherein the first virtual link region is either undoped or doped with impurities of the second conductivity type.

8. The junction field effect transistor of claim 1 , wherein:

the first conductivity type comprises n-type and the bias voltage comprises a positive bias voltage; or

the first conductivity type comprises p-type and the bias voltage comprises a negative bias voltage.

9. The junction field effect transistor of claim 1 , wherein:

the bias voltage is applied when the transistor is in an ON-state; and

the bias voltage is not applied when the transistor is in an OFF-state.

10. The junction field effect transistor of claim 1 , wherein the inversion layer of impurities forms a high conductivity path between the channel region and either the source region or the drain region.

11. The junction field effect transistor of claim 1 , further comprising:

a gate electrode region of a second conductivity type which overlays the semiconductor substrate; and

a gate contact region formed on the gate electrode region and in ohmic contact with the gate region.

12. The junction field effect transistor of claim 1 , further comprising:

a second virtual link region formed in the substrate between the gate region and the other of the source region or the drain region;

a dielectric material which overlays the second virtual link region; and

a second electrode region which overlays the dielectric material.

13. The junction field effect transistor of claim 1 , wherein:

the dielectric material comprises oxide; and

the first gate electrode region comprises polysilicon.

14. A junction field effect transistor, comprising:

a semiconductor substrate;

a source region of a first conductivity type which is formed in the substrate;

a drain region of the first conductivity type which is formed in the substrate;

a channel region of the first conductivity type which is formed in the substrate;

a gate region of a second conductivity type formed in the substrate between the source and drain regions;

a first virtual link region formed in the substrate between the gate region and the source region;

a dielectric material which overlays the first virtual link region;

a first electrode region which overlays the dielectric material;

a second virtual link region formed in the substrate between the gate region and the drain region;

a dielectric material which overlays the second virtual link region;

a second electrode region which overlays the dielectric material; and

wherein the first electrode region is operable to receive a bias voltage such that an inversion layer of impurities of the first conductivity type forms in the first virtual link region.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: SU VOLTA, INC.
To: MIE FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 035508/0113 →
CHANGE OF NAME Recorded Jan 6, 2010
From: DSM SOLUTIONS, INC.
To: SUVOLTA, INC.
Reel/Frame 023731/0988 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2007
From: SAHA, SAMAR K.; KAPOOR, ASHOK K.
To: DSM SOLUTIONS, INC.
Reel/Frame 019245/0655 →
Continuity (1)
Related Publication 20080272403A1 · Nov 6, 2008