IP Library Granted Patent US 7,553,444
Granted Patent B2
US 7,553,444 · App. 11/443,487 · Granted Jun 30, 2009

Heat mold device and a method of making a guide wire by using the same heat mold device

Assignee: Asahi Intecc Co., Ltd.
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Quick Facts
Patent No.
US 7,553,444
App. No.
11/443,487
Granted
Jun 30, 2009
Kind
B2
Abstract

In a heat mold device 1 for a guide wire 9 , the metallic mold body 2 is made from the material, the thermal expansional coefficient of which is the same of a metallic coiled wire 91 to stabilize a shape-forming configuration 94 . A plurality of the mold bodies 2 are arranged in a mold frame 6 A to make the reverse side 22 of one mold body 2 tightly contact with the obverse side 21 of other mold body 2 among the neighboring mold bodies 2 . A jig arm 7 A sandwiches an array of metallic mold bodies 2 and the side plate 63 to serve as a securement member 7 . Upon manufacturing the guide wire 9 well-suited to the medical field, the heat mold device 1 renders it possible to make a high quality guide wire with a high productivity.

Claims (23)

1. A heat mold device in which a guide wire formed by a metallic coiled wire has an arcuated portion provided at a predetermined portion of said guide wire by means of a thermal treatment so as to serve as a shape-formed configuration; said heat mold device comprising:

a tabulate metallic mold body, an outer surface of which has a mold groove forming an open-ended portion at an elevational side of said metallic mold body;

a lid body placed on said outer surface of said metallic mold body;

said metallic mold body being made from a material having both thermal expansional coefficient and thermal conductivity which are the same as said metallic coiled wire has; and

said lid body having a lid plate to be in contact with said outer surface of said metallic mold body, and further having a pushing member which is slidably fit into said metallic mold body to urgingly push said metallic mold body against said lid plate so as to hold said metallic mold body in place.

2. The heat mold device according to claim 1 , wherein said mold groove includes an open-ended portion at both elevational sides of said metallic mold body, and said mold groove extending from said open-ended portion along a path corresponding to said shape-formed configuration.

3. The heat mold device according to claim 1 , wherein said mold groove is defined on both the obverse and reverse sides of said metallic mold body.

4. The heat mold device according to claim 1 , wherein a plurality of said mold grooves are aligned in parallel with each other.

5. The heat mold device according to claim 1 , wherein said pushing member has a side plate extended from both sides of said lid plate in the reverse direction of said metallic mold body, and further having an end plate extended from both the sides of said lid plate to urgingly engage with the reverse side of said metallic mold body.

6. The heat mold device according to claim 5 , wherein said pushing member has a protrusion directed toward the obverse side of said metallic mold body.

7. The heat mold, device according to claim 5 , wherein said pushing member bends said lid body into a curved configuration with said end plate set inside said lid plate.

8. The heat mold device according to claim 7 , wherein said lid plate has a protrusion directed opposite to said end plate.

9. A heat mold device in which a guide wire formed by a metallic coiled wire has an arcuated portion provided at a predetermined portion of said guide wire by means of a thermal treatment so as to serve as a shape-formed configuration; said heat mold device comprising:

a tabulate mold body, an obverse side of which has a mold groove forming an open-ended portion at an elevational side of said metallic mold body;

a lid body placed on said obverse side of said metallic mold body;

said metallic mold body being made from a material having both thermal expansional coefficient and thermal conductivity which are the same as said metallic coiled wire has;

a plurality of said metallic mold bodies being contiguously arranged to mutually overlap so as to make a reverse side of one metallic mold body tightly contact with said obverse side of other metallic mold body among said neighboring metallic mold bodies;

a face plate provided to engage with said obverse side of said metallic mold body positioned at one end side among the plurality of said metallic mold bodies; and

a securement member provided to fixedly secure said face plate to said metallic mold body.

10. The heat mold device according to claim 9 , wherein said mold groove includes an open-ended portion at both elevational sides of said metallic mold body, and said mold groove extending from said open-ended portion along a path corresponding to said shape-formed configuration.

11. The heat mold device according to claim 9 , wherein a plurality of said mold grooves are aligned in parallel with each other.

12. The heat mold device according to claim 9 , wherein each of said metallic mold bodies has a ventilation hole.

13. The heat mold device according to claim 9 , wherein said securement member has a jig arm to fixedly sandwich said metallic mold body and said face plate together, said jig arm having a predetermined length corresponding to a total thickness of each of said metallic mold bodies and said face plate including a total number of the metallic mold bodies.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2006
From: KATO, TOMIHISA
To: ASAHI INTECC CO., LTD.
Reel/Frame 018092/0625 →
Priority Claims (1)
JP 2005-166188 · Jun 6, 2005 · national
Continuity (1)
Related Publication 20060272751A1 · Dec 7, 2006