IP Library › Granted Patent US 7,579,824
Granted Patent B2
US 7,579,824 · App. 11/536,769 · Granted Aug 25, 2009

High-precision Rogowski current transformer

Assignee: GM Global Technology Operations, Inc.
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Quick Facts
Patent No.
US 7,579,824
App. No.
11/536,769
Granted
Aug 25, 2009
Kind
B2
Abstract

A high-precision Rogowski current transformer, the Rogowski coil is realized in a single printed circuit board while maintaining both the outside field rejection of a traditional Rogowski coil, and the increased output voltage similar to the multiple printed circuit board Rogowski coil arrangements.

Claims (30)

1. An apparatus for measuring the current in a conductor, comprising:

a printed circuit board having at least three discrete substrate layers stacked together;

a first coil wound around at least three of the discrete substrate layers; and

a second coil traversing a center of the first coil, wherein the second coil is coaxially wound with the first coil.

2. The apparatus according to claim 1 wherein the second coil is wound around at least one of the discrete substrate layers.

3. The apparatus according to claim 1 , further comprising an aperture formed in the printed circuit board and adapted to receive at least one conductor.

4. An apparatus for measuring current in a conductor, comprising:

a printed circuit board having a plurality of stacked discrete substrate layers;

an outer coil wound around at least three of the substrate layers;

an inner coil wound around at least one of the substrate layers, wherein the inner coil is coaxially wound with the outer coil; and

an aperture formed in the printed circuit board about which the outer coil and the inner coil extend.

5. The apparatus according to claim 4 , wherein the printed circuit board includes four of the discrete substrate layers.

6. The apparatus according to claim 5 , wherein the outer coil is constructed by disposing conductive traces on a first surface layer and a second surface layer of the discrete subsurface layers, and connecting said traces using plated holes that traverse the discrete substrate layers.

7. The apparatus according to claim 4 , wherein the inner coil is constructed by disposing conductive traces across a first inner layer and a second inner layer of the discrete subsurface layers, and connecting said traces using plated holes that traverse the first inner layer and the second inner layer.

8. The apparatus according to claim 4 , wherein the outer coil and the inner coil are wound in electrically opposite directions.

9. The apparatus according to claim 4 , wherein the inner coil has a higher turn density than the outer coil.

10. The apparatus according to claim 4 , further comprising an integrator circuit electrically connected to the inner coil and the outer coil.

11. The apparatus according to claim 4 , wherein the aperture is elongated.

12. An apparatus for measuring the current in a conductor comprising:

a printed circuit board having discrete substrate layers including a first surface layer, a first inner layer, a second inner layer, and a second surface layer;

an outer coil disposed on the first surface layer and the second surface layer, and traversing the first surface layer, the first inner layer, the second inner layer, and the second surface layer; and

an inner coil disposed on the first inner layer and the second inner layer, and traversing the first inner layer and a second inner layer.

13. The apparatus according to claim 12 , further comprising an aperture formed in the printed circuit board about which the outer coil and the inner coil extend.

14. The apparatus according to claim 12 , wherein the aperture is adapted to receive a conductor through which a current to be measured flows.

15. The apparatus according to claim 12 , wherein the outer coil and the inner coil are wound in electrically opposite directions.

16. The apparatus according to claim 12 , wherein the inner coil traverses the first inner layer and the second inner layer through a plurality of plated holes.

17. The apparatus according to claim 12 , wherein the outer coil traverses the first surface layer, the second surface layer, the first inner layer, and the second inner layer through a plurality of holes.

18. The apparatus according to claim 12 , wherein the inner coil has a higher turn density than the outer coil.

19. The apparatus according to claim 12 , further comprising an integrator circuit electrically linked to the inner coil and outer coil.

20. The apparatus according to claim 12 , further comprising an aperture formed in the printed circuit board and the inner coil and the outer coil extending about the aperture.

Assignments (12)
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2014
From: WILMINGTON TRUST COMPANY
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 034184/0001 →
CHANGE OF NAME Recorded Feb 10, 2011
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 025781/0001 →
SECURITY AGREEMENT Recorded Nov 8, 2010
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: WILMINGTON TRUST COMPANY
Reel/Frame 025327/0041 →
RELEASE OF SECURITY INTEREST Recorded Nov 5, 2010
From: UAW RETIREE MEDICAL BENEFITS TRUST
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025314/0946 →
RELEASE OF SECURITY INTEREST Recorded Nov 4, 2010
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025245/0656 →
SECURITY AGREEMENT Recorded Aug 28, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UAW RETIREE MEDICAL BENEFITS TRUST
Reel/Frame 023162/0140 →
SECURITY AGREEMENT Recorded Aug 27, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 023156/0264 →
RELEASE OF SECURITY INTEREST Recorded Aug 21, 2009
From: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023155/0663 →
RELEASE OF SECURITY INTEREST Recorded Aug 20, 2009
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023124/0563 →
SECURITY AGREEMENT Recorded Apr 16, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
Reel/Frame 022553/0540 →
SECURITY AGREEMENT Recorded Feb 3, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 022195/0334 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2006
From: REA, DAVID; KAYE, KENNETH L.; ZAWISA, MICHAEL F.
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 018327/0315 →
Continuity (1)
Related Publication 20080079418A1 · Apr 3, 2008