Methods and apparatuses for transferring heat from stacked microfeature devices
Apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.
1. A microfeature device assembly, comprising:
a support member having terminals;
a first microelectronic die carried by the support member, the first die including integrated circuitry and first external contacts operatively coupled to the terminals on the support member;
an underfill between the support member and the first die;
a second microelectronic die including integrated circuitry and second external contacts electrically coupled to the first external contacts of the first die, wherein the first die is between the support member and the second die; and
a heat transfer unit between the first die and the second die, the heat transfer unit including a first portion, a second portion, and a gap between at least a section of the first and second portions such that the first external contacts of the first die and the second external contacts of the second die are aligned with the gap.
2. The assembly of claim 1 wherein the individual first and second portions comprise a first region and a second region integrally connected with the first region.
3. The assembly of claim 1 wherein the individual first and second portions comprise a base and a fin integrally connected with the base, and wherein the fin extends generally normal to the base.
4. The assembly of claim 1 wherein:
the first portion comprises a plurality of discrete first bases spaced apart from each other and arranged in a desired pattern, the individual first bases including first fins; and
the second portion comprises a plurality of second bases spaced apart from each other and arranged in a pattern corresponding to the pattern of first bases, the individual second bases including second fins.
5. The assembly of claim 1 wherein the individual first and second portions comprise a base, a fin integrally connected with the base, and a non-planar feature on the base.
6. The assembly of claim 1 wherein the individual first and second portions comprise a base, a fin integrally connected with the base, and a plurality of non-planar features including protrusions and/or ridges on the base.
7. The assembly of claim 1 wherein the heat transfer unit is secured to the first and second dies using an adhesive and/or a thermally conductive paste.
8. The assembly of claim 1 wherein the heat transfer unit is secured to the first and second dies using an adhesive, and wherein the adhesive is a passivation layer electrically insulating the dies from the heat transfer unit.
9. The assembly of claim 1 wherein the heat transfer unit comprises Si-28, Si, Cu, Al, and/or other thermally conductive materials.
10. The assembly of claim 1 wherein the first die has a first edge and a second edge facing opposite the first edge and the heat transfer unit has a third edge and a fourth edge facing opposite the third edge, and wherein the third edge of the heat transfer unit extends outwardly beyond the first edge of the first die and the fourth edge of the heat transfer unit extends outwardly beyond the second edge of the first die.
11. The assembly of claim 1 wherein:
the first external contacts comprise a first contact pad at a front side of the first die, a second contact pad at a back side of the first die and a first interconnect extending through the first die electrically coupling the first contact pad to the second contact pad; and
the second external contacts comprise a third contact pad at a front side of the second die, a fourth contact pad at a back side of the second die and a second interconnect extending through the second die electrically coupling the third contact pad to the fourth contact pad.
12. The assembly of claim 1 wherein the heat transfer unit is a first heat transfer unit, and the assembly further comprises:
a third microelectronic die comprising integrated circuitry and third external contacts electrically coupled to the second external contacts of the second die, and wherein the second die is between the first die and the third die; and
a second heat transfer unit between the second and third dies, the second heat transfer unit including a third portion, a fourth portion, and a gap between the third and fourth portions such that the second external contacts of the second die and the third external contacts of the third die are aligned with the gap.
13. The assembly of claim 1 wherein the first die and the second die have different configurations.
14. The assembly of claim 1 wherein the first die and the second die have a thickness of approximately 100 μm to 250 μm.
15. The assembly of claim 1 wherein the heat transfer unit has a thickness of approximately 50 μm to 500 μm.
16. The assembly of claim 1 wherein:
the first die and the second die have a thickness of approximately 100 μm to 250 μm; and
the heat transfer unit has a thickness of approximately 50 μm to 500 μm.
17. A microfeature device assembly, comprising:
a support member having an array of terminals;
a first microelectronic die having a front side, a back side, a plurality of first contact pads at the front side electrically coupled to corresponding terminals, an integrated circuit in electrical contact with the first contact pads, a plurality of second contact pads at the back side, and first interconnects extending through the first die electrically coupling the first contact pads to corresponding second contact pads;
an underfill between the support member and the first die;
a second microelectronic die having a front side, a back side, a plurality of third contact pads at the front side electrically coupled to corresponding second contact pads of the first die, an integrated circuit in electrical contact with the third contact pads, a plurality of fourth contact pads at the back side, and second interconnects extending through the second die electrically coupling the third contact pads to corresponding fourth contact pads, wherein the first die is between the support member and the second die; and
a heat transfer unit between the first die and the second die, the heat transfer unit including a first portion, a second portion, and a gap between the first and second portions such that the second contact pads at the back side of the first die and the third contact pads at the front side of the second die are aligned with the gap.
18. The assembly of claim 17 wherein the individual first and second portions comprise a first region and a second region integrally connected with the first region.
19. The assembly of claim 17 wherein the individual first and second portions comprise a base and a fin integrally connected with the base, and wherein the fin extends generally normal to the base.
20. The assembly of claim 17 wherein:
the first portion comprises a plurality of discrete first bases spaced apart from each other and arranged in a desired pattern, the individual first bases including first fins; and
the second portion comprises a plurality of second bases spaced apart from each other and arranged in a pattern corresponding to the pattern of first bases, the individual second bases including second fins.
21. The assembly of claim 17 wherein the individual first and second portions comprise a base, a fin integrally connected with the base, and a non-planar feature on the base.
22. The assembly of claim 17 wherein the individual first and second portions comprise a base, a fin integrally connected with the base, and a plurality of non-planar features including protrusions and/or ridges on the base.
23. The assembly of claim 17 wherein the heat transfer unit is secured to the first and second dies using an adhesive and/or a thermally conductive paste.
24. The assembly of claim 17 wherein the heat transfer unit is secured to the first and second dies using an adhesive, and wherein the adhesive is a passivation layer electrically insulating the dies from the heat transfer unit.
25. The assembly of claim 17 wherein the heat transfer unit comprises Si-28, Si, Cu, Al, and/or other thermally conductive materials.
26. The assembly of claim 17 wherein the first die has a first edge and a second edge facing opposite the first edge and the heat transfer unit has a third edge and a fourth edge facing opposite the third edge, and wherein the third edge of the heat transfer unit extends outwardly beyond the first edge of the first die and the fourth edge of the heat transfer unit extends outwardly beyond the second edge of the first die.
27. The assembly of claim 17 wherein the heat transfer unit is a first heat transfer unit and the gap is a first gap, and wherein the assembly further comprises:
a third microelectronic die having a front side, a back side, a plurality of fifth contact pads at the front side coupled to corresponding fourth contact pads of the second die, an integrated circuit in electrical contact with the fifth contact pads, a plurality of sixth contact pads at the back side, and third interconnects extending through the third die electrically coupling the fifth contact pads to corresponding sixth contact pads, and wherein the second die is between the first die and the third die; and
a second heat transfer unit between the second and third dies, the second heat transfer unit including a third portion, a fourth portion, and a second gap between the third and fourth portions such that the fourth contact pads at the back side of the second die and the fifth contact pads at the front side of the third die are aligned with the second gap.
28. The assembly of claim 17 wherein the first die and the second die have different configurations.
29. The assembly of claim 17 wherein the first die and the second die have a thickness of approximately 100 μm to 250 μm.
30. The assembly of claim 17 wherein the heat transfer unit has a thickness of approximately 50 μm to 500 μm.
31. The assembly of claim 17 wherein:
the first die and the second die have a thickness of approximately 100 μm to 250 μm; and
the heat transfer unit has a thickness of approximately 50 μm to 500 μm.
32. A microfeature device assembly, comprising:
a support member having a plurality of terminals;
a first microelectronic die on the support member, the first die having a front side, a back side, and first external contacts electrically coupled to the terminals on the support member;
an underfill between the support member and the first die;
a second microelectronic die stacked on the first die, the second die having a front side, a back side, and second external contacts electrically coupled to the first external contacts; and
a thermally conductive interlayer between the first and second dies, the thermally conductive interlayer including a first portion and a second portion spaced apart from the first portion by a gap elongated along a medial portion of the interlayer, wherein the first external contacts of the first die and the second external contacts of the second die are aligned with the gap.
33. The assembly of claim 32 wherein the individual first and second portions include a generally planar base and a fin extending generally normal to the base.
34. The assembly of claim 32 wherein:
the first portion comprises a plurality of discrete first bases spaced apart from each other and arranged in a desired pattern, the individual first bases including first fins; and
the second portion comprises a plurality of second bases spaced apart from each other and arranged in a pattern corresponding to the pattern of first bases, the individual second bases including second fins.
35. The assembly of claim 32 wherein the individual first and second portions comprise a base, a fin integrally connected with the base, and a plurality of non-planar features including protrusions and/or ridges on the base.
36. The assembly of claim 32 wherein the thermally conductive interlayer is secured to the first and second dies using an adhesive and/or a thermally conductive paste.
37. The assembly of claim 32 wherein the thermally conductive interlayer comprises Si-28, Si, Cu, Al, and/or other thermally conductive materials.
38. The assembly of claim 32 wherein the first die and the second die have a thickness of approximately 100 μm to 250 μm.
39. The assembly of claim 32 wherein the thermally conductive interlayer has a thickness of approximately 50 μm to 500 μm.
40. The assembly of claim 32 wherein:
the first die and the second die have a thickness of approximately 100 μm to 250 μm; and
the thermally conductive interlayer has a thickness of approximately 50 μm to 500 μm.
41. A microfeature device assembly, comprising:
support means having terminals;
a first microelectronic die on the support means, the first die including integrated circuitry and first external contacts electrically coupled to the terminals on the support means;
an underfill between the support means and the first die;
a second microelectronic die including integrated circuitry and second external contacts electrically coupled to the first external contacts of the first die, wherein the first die is between the support means and the second die; and
heat transfer means between the first die and the second die, the heat transfer means including a first portion, a second portion spaced apart from the first portion, and a gap between the first and second portions such that the first external contacts of the first die and the second external contacts of the second die are aligned with the gap.
42. A microfeature device assembly, comprising:
a support member having terminals;
a first microelectronic die carried by the support member, the first die including integrated circuitry and first external contacts operatively coupled to the terminals on the support member;
a second microelectronic die including integrated circuitry and second external contacts electrically coupled to the first external contacts of the first die, wherein the first die is between the support member and the second die; and
a heat transfer unit between the first die and the second die, the heat transfer unit including a first portion, a second portion, and a gap between at least a section of the first and second portions such that the first external contacts of the first die and the second external contacts of the second die are aligned with the gap,
wherein the first die has a first edge and a second edge facing opposite the first edge and the heat transfer unit has a third edge and a fourth edge facing opposite the third edge, and wherein the third edge of the heat transfer unit extends outwardly beyond the first edge of the first die and the fourth edge of the heat transfer unit extends outwardly beyond the second edge of the first die.
43. A microfeature device assembly, comprising:
a support member having an array of terminals;
a first microelectronic die having a front side, a back side, a plurality of first contact pads at the front side electrically coupled to corresponding terminals, an integrated circuit in electrical contact with the first contact pads, a plurality of second contact pads at the back side, and first interconnects extending through the first die electrically coupling the first contact pads to corresponding second contact pads;
a second microelectronic die having a front side, a back side, a plurality of third contact pads at the front side electrically coupled to corresponding second contact pads of the first die, an integrated circuit in electrical contact with the third contact pads, a plurality of fourth contact pads at the back side, and second interconnects extending through the second die electrically coupling the third contact pads to corresponding fourth contact pads, wherein the first die is between the support member and the second die; and
a heat transfer unit between the first die and the second die, the heat transfer unit including a first portion, a second portion, and a gap between the first and second portions such that the second contact pads at the back side of the first die and the third contact pads at the front side of the second die are aligned with the gap,
wherein the first die has a first edge and a second edge facing opposite the first edge and the heat transfer unit has a third edge and a fourth edge facing opposite the third edge, and wherein the third edge of the heat transfer unit extends outwardly beyond the first edge of the first die and the fourth edge of the heat transfer unit extends outwardly beyond the second edge of the first die.