Wafer stacked package having vertical heat emission path and method of fabricating the same
A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and a coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.
1. A wafer stacked semiconductor package (WSP) having a vertical heat emission path, comprising:
a substrate;
at least two semiconductor chips vertically stacked on the substrate, the at least two semiconductor chips including a lowest semiconductor chip and a second semiconductor chip stacked on the lowest semiconductor chip;
an evaporation unit positioned on the lowest semiconductor chip;
a cooling through-hole penetrating the second and any subsequent semiconductor chips stacked on the evaporation unit;
a condensation unit positioned on a top of an uppermost semiconductor chip of the at least two semiconductor chips and sealing an upper part of the cooling through-hole;
a plurality of micro holes contacting the cooling through-hole and having a smaller diameter than the cooling through-hole; and
a coolant filling a cooling path sealed by the evaporation unit, the cooling through-hole, the micro holes, and the condensation unit.
2. The WSP of claim 1 , wherein the at least two semiconductor chips further comprise a via contact which is electrically connected to the substrate and penetrates the semiconductor chips.
3. The WSP of claim 1 , further comprising sealing resin for sealing an upper part of the substrate and the stacked semiconductor chips.
4. The WSP of claim 1 , further comprising a solder ball attached below the substrate.
5. The WSP of claim 3 , wherein the condensation unit has its upper surface exposed outside the sealing resin.
6. The WSP of claim 5 , further comprising:
a thermal interface material (TIM) layer formed on the condensation unit; and
a cooling device formed on the TIM layer.
7. The WSP of claim 6 , wherein the cooling device is one of a heat spreader, a heat sink, a material producing a Peltier effect, and a cooling fan.
8. The WSP of claim 1 , wherein the cooling through-hole is formed in an area where significant heat is generated in the stacked semiconductor chips.
9. The WSP of claim 1 , wherein the coolant is a liquid capable of evaporation and condensation.
10. The WSP of claim 1 , wherein the space between the semiconductor chips through which the cooling through-hole is formed is sealed by metal connection.
11. The WSP of claim 1 , wherein the semiconductor chips through which the cooling through-hole is formed and the condensation unit are sealed by metal connection.
12. The WSP of claim 1 , wherein the space between the semiconductor chips through which the cooling through-hole is formed is sealed by a bridge ring comprising an insulating material.
13. The WSP of claim 1 , wherein the semiconductor chips through which the cooling through-hole is formed and the condensation unit are sealed by a bridge ring comprising a metal.