Plasma source and plasma processing apparatus

1. A plasma processing apparatus characterized by comprising:

a process chamber;

base material holding means for arranging a base material at a predetermined position in said process chamber; and

a plasma source to selectively irradiate a base material with at least one of a plasma, charged particle, and radical,

wherein said plasma source includes at least

a chamber to which a gas should be supplied; and

a hollow cathode electrode member which is arranged on a gas flow-out side of said chamber and has a plurality of electrode holes through which the gas can flow, and

said hollow cathode electrode member comprises a plurality of stacked porous hollow cathode electrode members, to which voltage is applied independently and individually, and which are combined through dielectric porous spacers, and microcathode plasma discharge is performed in the electrode holes of said hollow cathode electrode member.

2. A plasma processing apparatus according to claim 1 , wherein the base material comprises any one of an electron device base material, optical device base material, and bio-device base material.

3. A plasma processing apparatus according to claim 1 , wherein said plasma source comprises an atmospheric-pressure plasma source.

4. A plasma processing apparatus according to claim 1 , wherein a gas is supplied into said process chamber.

5. A plasma processing apparatus according to claim 1 , wherein any one of an atmospheric-pressure plasma and reduced-pressure plasma is generated in said process chamber.

6. A plasma processing apparatus according to claim 1 , wherein a voltage to be applied to said hollow cathode electrode member is changed to irradiate the base material with not less than one type of active species selected from the group consisting of an ion, electron, and radical.

7. A plasma processing apparatus according to claim 1 , characterized by comprising:

base material holding-means for arranging a base material at a predetermined position in said process chamber; and

coating material supply means for supplying a coating material,

wherein the base material is irradiated with at least one of a plasma, neutral radical, and positive/negative ion by said plasma source, and

while the base material is irradiated with at least one of the plasma, neutral radical, and positive/negative ion, a coating layer formed of the coating material is formed on the base material.

8. A plasma processing apparatus according to claim 7 , characterized in that while the base material is irradiated with at least one of the plasma, neutral radical, and positive/negative ion, the coating material is supplied onto the base material to form the coating layer.

9. A plasma processing apparatus according to claim 7 , wherein a distance between a plasma radiation port of said plasma source and the base material to be processed with the plasma is not more than 5 mm.

10. A plasma processing apparatus according to claim 7 , wherein the coating layer is formed by spin coating.

11. A plasma processing apparatus according to claim 1 , characterized by comprising:

base material holding means for arranging a base material at a predetermined position in said process chamber; and

carbon nanotube formation material supply means for supplying a carbon nanotube formation material,

wherein the base material is irradiated with at least one of the plasma, neutral radical, and positive/negative ion, and

while the base material is irradiated with at least one of a plasma, neutral radical, and positive/negative ion, a carbon nanotube formation layer is formed on the base material.

12. A plasma processing apparatus according to claim 11 , characterized in that while the base material is irradiated with at least one of the plasma, neutral radical, and positive/negative ion, the carbon nanotube formation material is supplied onto the base material to form the carbon nanotube formation layer.