Mask set for variable mask field exposure
View Patent ↗A method of fabricating integrated circuits according to a first design. One first pattern is common with a second design, and one second pattern is unique to the first design. The first pattern is imaged using a first mask having first patterns formed in a block thereon. No other patterns of the first and second designs are formed on the first mask. The second patterns are imaged on the substrate using a second mask having second patterns formed in a block thereon. At least one third layer pattern is formed on the second mask.
1. A mask set for a first integrated circuit design, the mask set comprising:
a first mask having only a block of a first number of first vertical layer patterns of the first integrated circuit design, where the first number is less than a plurality of integrated circuits formed on a substrate, and the first vertical layer patterns on the first mask are formed at a size that is larger than a size at which corresponding first vertical layer patterns are imaged on the substrate, and the first vertical layer patterns are common between the first integrated circuit design and at least one other integrated circuit design, and
a second mask having a block of a second number of second vertical layer patterns of the first integrated circuit design, where the second number is less than the plurality of integrated circuits formed on the substrate, and the second vertical layer patterns on the second mask are formed at a size that is larger than a size at which corresponding second vertical layer patterns are imaged on the substrate, and the second vertical layer patterns are unique to the first integrated circuit design,
the second mask also having a block of a third number of third vertical layer patterns of the first integrated circuit design, where the third number is less than the plurality of integrated circuits formed on the substrate, and the third vertical layer patterns on the second mask are formed at a size that is larger than a size at which corresponding third vertical layer patterns are imaged on the substrate, and the third vertical layer patterns are unique to the first integrated circuit design.
2. The mask set of claim 1 , wherein the first number of first vertical layer patterns is greater than the second number of second vertical layer patterns.
3. The mask set of claim 1 , wherein the block of the first number of the first vertical layer patterns is imaged using a wide field mode on an exposure tool.
4. The mask set of claim 1 , wherein the block of the second number of the second vertical layer patterns is imaged using a narrow field mode on an exposure tool.
5. The mask set of claim 1 , wherein the second mask includes separate blocks of all unique layer patterns required for the first integrated circuit design.