Semiconductor package stack with through-via connection
A package stack includes at least two packages stacked on each other. Each package has a substrate, a circuit pattern positioned on the substrate, a semiconductor chip attached to the substrate, and a number of through-vias formed on a lateral surface. A number of electrical connection members are attached to the through-vias so as to electrically connect the packages to each other. The through-vias are vertically positioned on the lateral or side surface of the packages. And a solder ball is attached to the lower surface of the substrate of the lowest package.
1. A package stack comprising:
at least two packages stacked one on top of the other, each package comprising:
a substrate having a circuit pattern that extends a predetermined portion on a side surface of the substrate;
a semiconductor chip attached and electrically connected to the substrate; and
a number of through-vias formed in predetermined portions of the side surface of the package adjacent to the substrate and exposed to the outside, the lateral thickness of the respective through-vias extending from the side surface of the package to the substrate so as to expose the circuit pattern formed on the side surface of the substrate,
wherein each through-via of one package is aligned with a corresponding through-via of the other stacked package to form a continues through-via on the side surfaces of the two stacked packages;
a number of electrical connection members, each of which is attached to each continous through-via on the side surface of the two stacked packages so as to electrically connect the two packages to each other, each continuous through-vias being vertically positioned on a predetermined portion of the side surface of the stacked packages, wherein the connection members are electrically connected to the circuit pattern exposed by the through-vias; and
a solder ball attached to a lower surface of the substrate of the lowest package.
2. The package stack of claim 1 , wherein each package further comprises:
a sealant sealing the upper surface of the substrate including the semiconductor chip,
wherein the sealant is shaped on the side surfaces thereof to provide the through-vias exposed to the outside, such that each through-via is formed in the side surface of the sealant and extends from the side surface of the sealant to the substrate.
3. The package stack of claim 2 , wherein the semiconductor chip is electrically connected to the substrate by a plurality of bonding wires or solder bumps, wherein the plurality of bonding wires or solder bumps are connected to the corresponding electrode terminals formed on the substrate, and wherein portions of electrode terminals are positioned on predetermined areas of the side surface of the substrate corresponding to the continuous through-vias.
4. The package stack of claim 3 , wherein each continuous through-via has a plated surface contacting the electrode terminal.
5. The package stack of claim 4 , wherein the through-vias have a surface plated with copper.
6. The package stack of claim 1 , wherein the electrical connection members are conductive leads.
7. The package stack of claim 1 , wherein the electrical connection members are attached to the through-vias by solder.
8. The package stack of claim 1 , wherein 2-4 packages are stacked on one another.