Method for chemical reduction of an oxidized contamination material, or reducing oxidation of a contamination material and a conditioning system for doing the same

1. A method of reducing an amount of oxides in an apparatus, the apparatus comprising a chamber containing an amount of contamination material and an amount of the oxides, the oxides being oxides of the contamination material, the method comprising:

providing a hydrogen containing gas in at least part of the chamber;

establishing a predetermined minimum partial hydrogen gas pressure in the at least part of the chamber;

establishing a predetermined maximum partial oxidants gas pressure in the at least part of the chamber; and

maintaining a temperature in the at least part of the chamber such that the temperature as maintained is at least higher than a temperature at which, in thermodynamic equilibrium given the predetermined maximum partial oxidants and minimum partial hydrogen gas pressures as established, the amount of contamination material is at least 10 times higher than the amount of oxides.

2. A method according to claim 1 , wherein the partial oxidants gas pressure as established is at least about 100 times lower than the partial hydrogen pressure as established.

3. A method according to claim 1 , wherein the partial oxidant gas pressure is selected from a range of 10 −8 -10 −1 bar and the partial hydrogen gas pressure is selected from a range of 10 −4 -10 1 bar.

4. A device manufacturing method for manufacturing a device in a lithographic apparatus, the lithographic apparatus comprising a chamber containing an amount of contamination material and an amount of the oxides, the oxides being oxides of the contamination material, the method comprising:

providing a hydrogen containing gas in at least part of the chamber;

establishing a predetermined minimum partial hydrogen gas pressure in the at least part of the chamber;

establishing a predetermined maximum partial oxidants gas pressure in the at least part of the chamber;

maintaining a temperature in the at least part of the chamber such that the temperature as maintained is at least higher than a temperature at which, in thermodynamic equilibrium given the predetermined maximum partial oxidants and minimum partial hydrogen gas pressures as established, the amount of contamination material is at least 10 times higher than the amount of oxides; and

projecting a patterned beam of radiation onto a substrate at least partially covered by a layer of radiation sensitive material.

5. A method of removing a deposition of a contamination material on an element provided in a chamber of an apparatus, the chamber containing an amount of the contamination material and an amount of the oxides, the oxides being oxides of the contamination material, the method comprising:

providing a hydrogen containing gas in at least part of the chamber;

establishing a predetermined minimum partial hydrogen gas pressure in the least part of the chamber;

establishing a predetermined maximum partial oxidants gas pressure in the at least part of the chamber;

maintaining a temperature in the at least part of the chamber such that the temperature as maintained is at least higher than a temperature at which, in thermodynamic equilibrium given the predetermined partial oxidants and partial hydrogen gas pressures as established, the amount of contamination material is at least 10 times higher than the amount of oxides; and

providing a halogen containing gas for removing at least part of the deposition on the element.

6. A method according to claim 5 , wherein providing a hydrogen containing gas and providing a halogen containing gas are performed simultaneously.

7. A method according to claim 5 , wherein the partial oxidants gas pressure as established is at least about 100 times lower than the partial hydrogen pressure as established.

8. A method according to claim 5 , wherein the partial oxidants gas pressure is selected from a range of 10 −8 -10 −1 bar and the partial hydrogen gas pressure is selected from a range of 10 −4 -10 1 bar.

9. A method according to claim 5 , wherein the halogen containing gas is a iodine containing gas.

10. A method of reducing an amount of tin oxides in a gas mixture in a lithographic apparatus, the lithographic apparatus comprising a chamber containing the gas mixture, the gas mixture containing an amount of tin material and an amount of the tin oxides, the method comprising:

providing hydrogen gas in at least part of the chamber;

establishing a predetermined minimum partial hydrogen gas pressure in the at least part of the chamber;

establishing a predetermined maximum partial oxidants gas pressure in the at least part of the chamber; and

maintaining a temperature in the at least part of the chamber such that the temperature as maintained is at least higher than a temperature at which, in thermodynamic equilibrium given the predetermined partial oxidants and partial hydrogen gas pressures as established, the amount of tin material is at least 10 times higher than the amount of tin oxides.

11. A method according to claim 10 , wherein the partial oxidants gas pressure is selected a factor of at least about 100 times lower than the partial hydrogen pressure.

12. A method according to claim 10 , wherein the partial oxidants gas pressure is selected from a range of 10 −8 -10 −1 bar and the partial hydrogen gas pressure is selected from a range of 10 −4 -10 1 bar.