IP Library › Granted Patent US 7,691,226
Granted Patent B2
US 7,691,226 · App. 11/387,813 · Granted Apr 6, 2010

Electron temperature measurement method, electron temperature measurement program for implementing the method, and storage medium storing the electron temperature measurement program

Assignee: Tokyo Electron Limited
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Quick Facts
Patent No.
US 7,691,226
App. No.
11/387,813
Granted
Apr 6, 2010
Kind
B2
Abstract

An electron temperature measurement method that enables an electron temperature as a plasma parameter to be measured precisely. A plasma is produced in a chamber 11 such that a wafer W is subjected to reactive ion etching therein. An ion energy distribution in the chamber 11 is measured. An ion energy distribution in the chamber 11 is simulated based on a set electron temperature. The measured ion energy distribution and the simulated ion energy distribution are compared. The electron temperature of the plasma is estimated based on results of the comparison mentioned above.

Claims (14)

1. An electron temperature estimation method for estimating an electron temperature of a plasma produced in a vacuum processing chamber in which an object to be processed is subjected to plasma processing, the method comprising:

step of simulating ion energy distributions corresponding to a plurality of set point electron temperatures in the said vacuum processing chamber and acquiring plurality of simulation results including primary and secondary peaks;

step of measuring an ion energy distribution in the said vacuum processing chamber;

step of comparing the measured ion energy distribution to each of a plurality of simulation results, wherein the step of comparison comprises:

comparing energy value of each secondary peak of the measured ion energy distribution to corresponding secondary peaks of each of the plurality of simulation results and determining discrepancy in each case;

estimating the electron temperature of the given processing chamber plasma as the one, corresponding to which the discrepancy is within a predetermined tolerance.

2. An electron temperature estimation method as claimed in claim 1 , wherein in said simulating ion energy distributions step, an electron temperature determined in plasma processing on a previous occasion is used as one of the plurality of set point electron temperatures.

3. A computer-readable storage medium storing a program for causing a computer to implement an electron temperature estimation method for estimating an electron temperature of a plasma produced in a vacuum processing chamber in which an object to be processed is subjected to plasma processing, the electron temperature estimation method comprising:

step of simulating ion energy distributions corresponding to a plurality of set point electron temperatures in the said vacuum processing chamber and acquiring plurality of simulation results including primary and secondary peaks;

step of measuring an ion energy distribution in the said vacuum processing chamber;

step of comparing the measured ion energy distribution to each of a plurality of simulation results, wherein the step of comparison comprises:

comparing energy value of each secondary peak of the measured ion energy distribution to corresponding secondary peaks of each of the plurality of simulation results and determining discrepancy in each case;

estimating the electron temperature of the given processing chamber plasma as the one, corresponding to which the discrepancy is within a predetermined tolerance.

4. A computer-readable storage medium as claimed in claim 3 , wherein in the simulating ion energy distributions step, an electron temperature estimated in plasma processing on a previous occasion is used as one of the plurality of set point electron temperatures.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2006
From: DENPOH, KAZUKI
To: TOKYO ELECTRON LIMITED
Reel/Frame 017954/0718 →
Priority Claims (1)
JP 2005-086285 · Mar 24, 2005 · national
Continuity (2)
Provisional Application 6066670500 · Mar 31, 2005
Related Publication 20060214593A1 · Sep 28, 2006