Methods for depth profiling in semiconductors using modulated optical reflectance technology
Methods of obtaining dopant and damage depth profile information are disclosed using modulated optical reflectivity (MOR) measurements. In one aspect, the depth profile is constructed using information obtained from various measurements such as the junction depth, junction abruptness and dopant concentration. In another aspect, a full theoretical model is developed. Actual measurements are fed to the model. Using an iterative approach, the actual measurements are compared to theoretical measurements calculated from the model to determine the actual depth profile.
1. A method for generating a depth profile of a junction formed in a dopant implanted semiconductor wafer comprising the steps of:
measuring the modulated optical reflectivity of the wafer and generating output signals in response thereto, said measurements being obtained by periodically exciting the wafer with an intensity modulated pump beam having an energy and modulation frequency sufficient to create thermal and plasma waves that effect the reflectivity of the wafer and monitoring the modulated optical reflectivity changes with a separate probe beam;
comparing the measurement results to calibration samples to determine the junction depth, active dopant concentration and profile abruptness;
constructing a junction depth profile based on the determined junction depth, active dopant concentration and abruptness; and
displaying or storing the depth profile.
2. A method as recited in claim 1 , wherein the modulated optical reflectivity measurements are taken at a plurality of different separations between the pump beam and probe beam spots on the wafer.
3. A method as recited in claim 1 , wherein the modulated optical reflectivity measurements are taken at a plurality of different probe beam wavelengths.
4. A method as recited in claim 1 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region of maximum interference between plasma and thermal waves generated in the wafer.
5. A method as recited in claim 1 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region wherein the output signals are primarily plasma driven.
6. A method as recited in claim 1 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region wherein the output signals are primarily thermally driven.
7. A method for generating a damage depth profile in an ion implanted semiconductor wafer comprising the steps of:
measuring the modulated optical reflectivity of the wafer and generating output signals in response thereto, said measurements being obtained by periodically exciting the wafer with an intensity modulated pump beam having an energy and modulation frequency sufficient to create thermal and plasma waves that effect the reflectivity of the wafer and monitoring the modulated optical reflectivity changes with a separate probe beam;
comparing the measurement results to calibration samples to determine the amorphous layer thickness;
determining the amorphization threshold and amorphous layer depth based on the implantation species and implantation energies;
constructing a damage depth profile based on the determined amorphous layer thickness, amorphization threshold and amorphous layer depth; and
displaying or storing the depth profile.
8. A method as recited in claim 7 , wherein the modulated optical reflectivity measurements are taken at a plurality of different separations between the pump beam and probe beam spots on the wafer.
9. A method as recited in claim 7 , wherein the modulated optical reflectivity measurements are taken at a plurality of different probe beam wavelengths.
10. A method as recited in claim 7 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region of maximum interference between plasma and thermal waves generated in the wafer.
11. A method as recited in claim 7 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region wherein the output signals are primarily plasma driven.
12. A method as recited in claim 7 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region wherein the output signals are primarily thermally driven.
13. A method for generating a parameter depth profile of a semiconductor wafer comprising the steps of:
measuring the modulated optical reflectivity of a test wafer and generating output signals in response thereto, said measurements being obtained by periodically exciting the wafer with an intensity modulated pump beam having an energy and modulation frequency sufficient to create thermal and plasma waves that effect the reflectivity of the wafer and monitoring the modulated optical reflectivity changes with a separate probe beam, said measurements being obtained for at least two different separations between the pump and probe beam spots on the wafer;
creating a theoretical model of the wafer;
calculating an optical response of the model using an initial set of parameters and comparing the calculated optical response to the generated output signals and iterating the parameters of the model until the differences between the calculated optical response and the output signals is minimized;
determining a parameter depth profile based on the results of the iteration; and
displaying or storing the depth profile.
14. A method as recited in claim 13 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region of maximum interference between the plasma and thermal waves.
15. A method as recited in claim 13 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region wherein the output signals are primarily plasma driven.
16. A method as recited in claim 13 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region wherein the output signals are primarily thermally driven.
17. A method as recited in claim 13 , further including the step of obtaining additional measurements at different probe beam wavelengths and using the measurements to determine the parameter depth profile.
18. A method as recited in claim 13 , further including the step of obtaining additional measurements at different pump beam modulation frequencies and using the measurements to determine the parameter depth profile.
19. A method for generating a parameter depth profile of an implanted semiconductor wafer comprising the steps of:
measuring the modulated optical reflectivity of a test wafer and generating output signals in response thereto, said measurements being obtained by periodically exciting the wafer with an intensity modulated pump beam having an energy and modulation frequency sufficient to create thermal and plasma waves that effect the reflectivity of the wafer and monitoring the modulated optical reflectivity changes with a separate probe beam and wherein the multiple measurements are taken with different probe beam wavelengths;
creating a theoretical model of the wafer;
calculating an optical response of the model using an initial set of parameters and comparing the calculated optical response to the generated output signals and iterating the parameters of the model until the differences between the calculated optical response and the output signals is minimized;
determining a parameter depth profile based on the results of the iteration; and
displaying or storing the depth profile.
20. A method as recited in claim 19 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region of maximum interference between the plasma and thermal waves.
21. A method as recited in claim 19 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region wherein the signals are primarily plasma driven.
22. A method as recited in claim 19 , wherein the modulated optical reflectivity measurements are obtained under conditions corresponding to a region wherein the signals are primarily thermally driven.
23. A method as recited in claim 19 , further including the step of obtaining additional measurements at lateral separations between the probe beam and pump beam spots on the wafer and using the measurements to determine the parameter depth profile.
24. A method as recited in claim 19 , further including the step of obtaining additional measurements at different pump beam modulation frequencies and using the measurements to determine the parameter depth profile.