High precision die bonding apparatus
A die bonding apparatus and a bonding method are provided wherein the apparatus comprises a bond head movable between a supply of semiconductor dice and a die bonding site, a pick-up tool attached to the bond head for holding a die to be bonded at the die bonding site and an optical assembly positioned for viewing an orientation of the die bonding site. The bond head is configured such that an orientation of the die being held by the pick-up tool between the optical assembly and the die bonding site is viewable by the optical assembly, whereby the orientation of the die may be aligned with the orientation of the die bonding site.
1. Method for bonding a die comprising the steps of:
viewing a die bonding site with an optical assembly for determining an orientation of the die bonding site;
picking up a die from a supply of semiconductor dice with a pick-up tool attached to a bond head, wherein the bond head includes a cavity extending therethrough;
positioning the bond head such that the die is held by the pick-up tool between the optical assembly and the die bonding site;
viewing the die with the optical assembly through the cavity by aligning the cavity with the optical assembly for determining an orientation of the die while the die is between the optical assembly and the die bonding site;
aligning the orientation of the die with the orientation of the die bonding site; and thereafter
bonding the die at the die bonding site,
the optical assembly being maintained in a stationary position above the die bonding site, during a time period between the step of viewing the die bonding site and the step of viewing the die, in order to maintain high placement accuracy.
2. Method for bonding a die as claimed in claim 1 , wherein the cavity is substantially cylindrical in shape.
3. Method for bonding a die as claimed in claim 2 , wherein a longitudinal axis of the cavity is substantially normal to the plane of the die bonding site, and the step of aligning the cavity with the optical assembly comprises aligning the longitudinal axis of the cavity with a viewing axis of the optical assembly.
4. Method for bonding a die comprising the steps of:
viewing a die bonding site with an optical assembly for determining an orientation of the die bonding site;
picking up a die from a supply of semiconductor dice with a pick-up tool attached to a bond head such that portions of the die extend beyond the sides of the bond head so as to be viewable by the optical assembly;
positioning the die held by the pick-up tool between the optical assembly and the die bonding site;
viewing the die with the optical assembly by aligning the sides of the bond head with the optical assembly to view the portions of the die that extend beyond the sides of the bond head for determining an orientation of the die while the die is between the optical assembly and the die bonding site;
aligning the orientation of the die with the orientation of the die bonding site; and thereafter
bonding the die at the die bonding site,
the portions of the die having alignment patterns on them.
5. Method for bonding a die as claimed in claim 4 , wherein a width of the bond head at a location where the pick-up tool is attached is narrower than a length of the die being held by the pick-up tool along the field of view of the optical assembly.
6. Method for bonding a die as claimed in claim 5 , wherein a cross-sectional area of the bond head along a plane that is parallel to a plane of the die bonding site is substantially triangular-shaped.
7. Method for bonding a die as claimed in claim 4 , wherein the optical assembly comprises dual optical systems, and one optical system is arranged to view an end of the die simultaneously with the other optical system viewing another end of the die.
8. Method for bonding a die as claimed in claim 4 , wherein the alignment patterns are fiducial marks.
9. Method for bonding a die comprising the steps of:
viewing a die bonding site with an optical assembly for determining an orientation of the die bonding site;
picking up a die from a supply of semiconductor dice with a pick-up tool attached to a bond head such that portions of the die extend beyond the sides of the bond head so as to be viewable by the optical assembly;
positioning the die held by the pick-up tool between the optical assembly and the die bonding site;
viewing the die with the optical assembly by aligning the sides of the bond head with the optical assembly to view the portions of the die that extend beyond the sides of the bond head for determining an orientation of the die while the die is between the optical assembly and the die bonding site;
aligning the orientation of the die with the orientation of the die bonding site; and thereafter
bonding the die at the die bonding site,
the portions of the die having alignment patterns on them, the optical assembly being maintained in a stationary position above the die bonding site, during a time period between the step of viewing the die bonding site and the step of viewing the die, in order to maintain high placement accuracy.
10. Method for bonding a die comprising the steps of:
viewing a die bonding site with an optical assembly for determining an orientation of the die bonding site;
picking up a die from a supply of semiconductor dice with a pick-up tool attached to a bond head such that portions of the die extend beyond the sides of the pick-up tool so as to be viewable by the optical assembly;
positioning the die held by the pick-up tool between the optical assembly and the die bonding site;
viewing the die with the optical assembly by aligning the sides of the bond head with the optical assembly to view the portions of the die that extend beyond the sides of the pick-up tool for determining an orientation of the die while the die is between the optical assembly and the die bonding site;
aligning the orientation of the die with the orientation of the die bonding site; and thereafter
bonding the die at the die bonding site,
the portions of the die having alignment patterns on them.