Exposure method, exposure system, and substrate processing apparatus

1. An exposure method, comprising:

pre-measuring a mark formed on a substrate before transferring the substrate into an exposure apparatus which exposes the substrate, the pre-measuring being performed on every substrate to be exposed by the exposure apparatus;

notifying waveform data of the mark measured in said pre-measuring to at least one device among said exposure apparatus, an analyzing device provided separately from the exposure apparatus, and a management device positioned higher than the exposure apparatus and the analyzing device for managing at least one of the exposure apparatus and the analyzing device; and

aligning and exposing the substrate in the exposure apparatus based on the waveform data of the mark notified in said notifying to at least one device among said exposure apparatus, said analyzing device and said management device, wherein

said pre-measuring and said aligning are performed in parallel as pipeline processing.

2. The exposure method as set forth in claim 1 , further comprising:

evaluating the mark measured in said pre-measuring based on a predetermined evaluation criterion; wherein

said notifying is capable of selecting notification of said waveform data and prohibition of the notification in accordance with an evaluation result in said evaluating.

3. The exposure method as set forth in claim 2 , wherein said notifying notifies said evaluation result in the case of not notifying of said waveform data, and said aligning and exposing are performed based on at least one of said waveform data and said evaluation result notified in said notifying.

4. The exposure method as set forth in claim 1 , further comprising selecting a mark from a plurality of marks formed on the substrate as an optimal mark to be measured for use for alignment of the substrate in said exposure apparatus based on at least one of said waveform data and said evaluation result notified in said notifying.

5. The exposure method as set forth in claim 1 , further comprising selecting a measurement condition as an optimal measurement condition at the time of measuring the mark for use for alignment of the substrate in said exposure apparatus based on at least one of said waveform data and said evaluation result notified in said notifying.

6. The exposure method as set forth in claim 1 , wherein said marks formed on said substrate include at least one of a pre-alignment mark or a contour characteristic part of the substrate for preliminarily aligning said substrate, a fine alignment mark for accurately aligning the substrate, and a search alignment mark for searching the fine alignment mark of the substrate.

7. The exposure method as set forth in claim 5 , wherein said measurement condition includes the number of marks to be used for aligning said substrate in said exposure apparatus, a mark arrangement, a focus offset, an illumination condition used for the measurement and a statistic processing mode.

8. The exposure method as set forth in claim 2 , wherein said evaluating generates an evaluation result made to be a score based on said predetermined evaluation criterion.

9. The exposure method as set forth in claim 1 , further comprising:

main measuring a mark formed on said substrate after the substrate is transferred into said exposure apparatus; and

matching a mark evaluation criterion of a measurement device used for measuring in said pre-measuring and that of a measurement device used for measuring in said main measuring based on a measurement result of said main measuring and at least one of said waveform data and said evaluation result notified in said notifying step.

10. The exposure method as set forth in claim 1 , wherein said pre-measuring is performed by a measurement device provided in a coating/developing device connected in-line to said exposure apparatus.

11. The exposure method as set forth in claim 1 , wherein said pre-measuring is performed by a measurement device provided separately from said exposure apparatus.

12. An exposure system, comprising:

a pre-measurement device which measures marks formed on a substrate before transferring the substrate to an exposure apparatus, the pre-measurement device being configured to measure marks on every substrate to be exposed by the exposure apparatus;

a notification device which notifies waveform data of the marks measured in said pre-measurement device to at least one device among said exposure apparatus, an analyzing device provided separately from the exposure apparatus, and a management device positioned higher than the exposure apparatus and the analyzing device which manages at least one of the exposure apparatus and the analyzing device, wherein

the exposure apparatus aligns and exposes the substrate based on the waveform data of the mark notified by said notification device to at least one device among said exposure apparatus, said analyzing device and said management device, and

said pre-measurement device and said exposure apparatus perform said pre-measurement, and said alignment and exposure in parallel as pipeline processing.

13. The exposure system as set forth in claim 12 , further comprising:

an evaluation device which evaluates the marks measured in said pre-measurement device based on a predetermined evaluation criterion; wherein

said notification device is capable of selecting notification of said pre-measurement result and/or said waveform data and prohibition of the notification in accordance with an evaluation result by said evaluation device.