Window type BGA semiconductor package and its substrate
A window-type BGA semiconductor package is revealed, primarily comprising a substrate with a wire-bonding slot, a chip disposed on a top surface of the substrate, and a plurality of bonding wires passing through the wire-bonding slot. A plurality of plating line stubs are formed on a bottom surface of the substrate, connect the bonding fingers on the substrate and extend to the wire-bonding slot. The bonding wires electrically connect the bonding pads of the chip to the corresponding bonding fingers of the substrate. The plating line stubs are compliant to the wire-bonding paths of the bonding wires correspondingly connected at the bonding fingers, such as parallel to the overlapped arrangement, to avoid electrical short between the plating line stubs and the bonding wires with no corresponding relationship of electrical connections.
1. A window-type BGA semiconductor package primarily comprising:
a substrate having a top surface, a bottom surface, and a wire-bonding slot, wherein the substrate includes a plurality of bonding fingers and a plurality of plating line stubs on the bottom surface, wherein the bonding fingers are close to the wire-bonding slot and the plating line stubs connect the bonding fingers and extend to the wire-bonding slot;
a chip disposed on the top surface of the substrate, wherein the chip has an active surface with a plurality of bonding pads disposed on the active surface, wherein the active surface is faced toward and attached to the substrate with the bonding pads aligned in the wire-bonding slot; and
a plurality of bonding wires passing through the wire-bonding slot and electrically connecting the bonding pads to the bonding fingers, wherein the bonding wires have a plurality of wire-bonding paths projected on the bottom surface;
wherein the plating line stubs extend in a manner to be compliant to the wire-bonding paths;
wherein the bonding wires and the compliant plating line stubs are correspondingly connected at the bonding fingers.
2. The semiconductor package as claimed in claim 1 , wherein the compliant plating line stubs are approximately parallel to or overlapped with the wire-bonding paths of the corresponding bonding wires.
3. The semiconductor package as claimed in claim 2 , wherein the compliant plating line stubs are not parallel to each other.
4. The semiconductor package as claimed in claim 1 , wherein the plating line stubs are not perpendicular to the adjacent sidewall of the wire-bonding slot.
5. The semiconductor package as claimed in claim 1 , wherein the plating line stubs and the bonding fingers are exposed from the bottom surface of the substrate.
6. The semiconductor package as claimed in claim 1 , further comprising an encapsulant completely formed in the wire-bonding slot and partially formed on the bottom surface of the substrate to encapsulate the bonding wires, the bonding fingers, and the plating line stubs.
7. The semiconductor package as claimed in claim 6 , wherein the encapsulant is further formed on the top surface of the substrate to encapsulate the chip.
8. The semiconductor package as claimed in claim 1 , wherein the substrate includes a plurality of external pads disposed on the bottom surface and formed of a same wiring layer with the plating line stubs and the bonding fingers.
9. The semiconductor package as claimed in claim 8 , further comprising a plurality of external terminals bonded on the external pads.
10. A substrate for window-type BGA semiconductor packages having a top surface, a bottom surface, and a wire-bonding slot, the substrate comprising a plurality of bonding fingers and a plurality of plating line stubs on the bottom surface, wherein the bonding fingers are close to the wire-bonding slot and the plating line stubs connect the bonding fingers and extend to the wire-bonding slot; when a chip having a plurality of bonding pads is disposed on the top surface of the substrate, the plating line stubs extend in a manner to be compliant to a plurality of straight lines on the bottom surface drawing from the bonding pads of the chip to the corresponding bonding fingers of the substrate.
11. The substrate as claimed in claim 10 , wherein the compliant plating line stubs are parallel to or overlapped with the straight lines.
12. The substrate as claimed in claim 10 , wherein the plating line stubs are not perpendicular to the adjacent sidewall of the wire-bonding slot.
13. The substrate as claimed in claim 10 , wherein the plating line stubs are not parallel to each others.
14. The substrate as claimed in claim 10 , wherein the plating line stubs and the bonding fingers are exposed from the bottom surface.
15. The substrate as claimed in claim 10 , further comprising a plurality of external pads disposed on the bottom surface and formed of a same wiring layer with the plating line stubs and the bonding fingers.