Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

1. A wiring board comprising:

a substrate consisting of an insulation material and wired by a conductive material;

wherein a plurality of electrodes are formed on a surface of the substrate and include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and

an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.

2. The wiring board as claimed in claim 1 ,

wherein the electrodes are formed on both surfaces of the substrate;

all of the electrodes formed on a first surface of the substrate are the non-Au electrodes; and

all of the electrodes formed on a second surface of the substrate are the Au electrodes.

3. The wiring board as claimed in claim 2 ,

wherein all of or a part of the non-Au electrodes have plan areas less than 0.049 mm 2 ; and

all of the Au electrodes have plan areas equal to or greater than 0.049 mm 2 .

4. An electronic circuit board comprising:

a wiring board including a substrate consisting of an insulation material and wired by a conductive material, wherein a plurality of electrodes are formed on a surface of the substrate; and

a plurality of electronic parts having contact electrodes configured to connect to the electrodes formed on the surface of the substrate, the electronic parts being surface-mounted on the wiring board;

wherein the electrodes formed on the surface of the substrate of the wiring board include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and

an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.

5. The electronic circuit board as claimed in claim 4 ,

wherein at least one of the electronic parts has an Au electrode having an Au surface layer as the contact electrode;

the Au surface layer has a flat contact surface with an area greater than the area of a side surface of the Au surface layer; and

the contact surface is soldered to the non-Au electrode of the wiring board.

6. An electronic circuit board comprising:

a wiring board including a substrate consisting of an insulation material and wired by a conductive material, wherein a plurality of electrodes are formed on a surface of the substrate; and

a plurality of electronic parts having contact electrodes configured to connect to the electrodes formed on the surface of the substrate, the electronic parts being surface-mounted on the wiring board,

wherein the electrodes formed on the surface of the substrate of the wiring board include non-Au electrodes not having Au surface layers and Au electrodes having the Au surface layers as the electrodes,

at least one of the electronic parts has an Au electrode having an Au surface layer as the contact electrode of the electronic part, the Au surface layer of the contact electrode of the electronic part having a flat contact surface with an area greater than the area of a side surface of the Au surface layer,

the contact surface is soldered to the non-Au electrode of the wiring board, and

an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.

7. The electronic circuit board as claimed in claim 6 ,

wherein a distance between a part mounting surface of the wiring board and an electrode forming surface of one of the electronic parts, for which one electrode part a plan area of the contact electrode is smallest among the plan areas of the contact electrodes of the electronic parts, is equal to or less than 70 μm.

8. The electronic circuit board as claimed in claim 7 ,

wherein a distance between the contact electrodes in an area of a periphery edge part of the electrode forming surface of the one electronic part for which one electronic part the plan area of the contact electrode is smallest is equal to or greater than 500 μm; and

an underfill is provided between the electrode forming surface and the part mounting surface.

9. The electronic circuit board as claimed in claim 6 ,

wherein at least one of the electronic parts is flip chip mounted so that an integrated circuit forming surface faces the wiring board.

10. The electronic circuit board as claimed in claim 6 ,

wherein the electrodes are formed on both surfaces of the substrate;

all of the electrodes formed on a first surface of the substrate are non-Au electrodes; and

all of the electrodes formed on a second surface of the substrate are Au electrodes.

11. An electronic apparatus comprising:

an electronic circuit board including

a wiring board including a substrate consisting of an insulation material and wired by a conductive material, wherein a plurality of electrodes are formed on a surface of the substrate; and

a plurality of electronic parts having contact electrodes configured to connect to the electrodes formed on the surface of the substrate, the electronic parts being surface-mounted on the wiring board; and

a housing covering the electronic circuit board;

wherein the electrodes formed on the surface of the substrate of the wiring board include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and

an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.

12. An electronic apparatus, comprising:

an electronic circuit board, including

a wiring board including a substrate consisting of an insulation material and wired by a conductive material, wherein a plurality of electrodes are formed on a surface of the substrate; and

a plurality of electronic parts having contact electrodes configured to connect to the electrodes formed on the surface of the substrate, the electronic parts being surface-mounted on the wiring board; and

a housing covering the electronic circuit board;

wherein the electrodes formed on the surface of the substrate of the wiring board of the electronic circuit board include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and

an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.

13. A manufacturing method of an electronic circuit board where a plurality of electronic parts are surface-mounted on a wiring board including a substrate consisting of an insulation material and wired by a conductive material, the method comprising the steps of:

printing a paste lump made of a paste containing a conductive connection material on a plurality of electrodes formed on the substrate consisting of the insulation material;

mounting the electronic parts on the wiring board via the paste lump; and

connecting the electrodes of the wiring board to the corresponding contact electrodes of the electronic parts by melting the conductive connect material in the paste lump;

wherein the electrodes are formed on a surface of the substrate and include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and

an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.

14. The manufacturing method of an electronic circuit board as claimed in claim 13 ,

wherein the paste lump printed on the electrodes of the wiring board in the printing step has a thickness whereby a distance between a part mounting surface of the wiring board and an electrode forming surface of one of the electronic parts, for which one electrode part a plan area of the contact electrode is smallest among the plan areas of the contact electrodes of the electronic parts, is equal to or less than 70 μm.

15. The manufacturing method of the electronic circuit board as claimed in claim 14 ,

wherein a distance between the contact electrodes in an area of a periphery edge part of the electrode forming surface of the one electronic part for which one electronic part the plan area of the contact electrode is smallest is equal to or greater than 500 μm; and

an underfill step is implemented after the connecting step so that an underfill material flows from a space between the area of the part of the periphery edge part of the electrode forming surface and the part mounting surface to a part under the electrode forming surface.

16. The manufacturing method of an electronic circuit board as claimed in claim 15 ,

wherein the underfill step is implemented without cleaning an area of the part mounting surface facing the electrode forming surface.

17. The wiring board of claim 1 , wherein the flux is formed by liquefying a rosin made of an aliphatic carboxylic acid in a solvent.