Device for liquid treatment of wafer-shaped articles
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shaped article by capillary forces.
1. Process for liquid treatment of a defined area of a wafer-shaped article (W) comprising the following successive steps:
bringing the wafer-shaped article (W) into proximity of a mask, which mask in form and size corresponds to the defined area which is to be treated with the liquid, wherein a gap between wafer-shaped article (W) and the mask is formed and a distance between the mask and the wafer-shaped article (W) is selected small enough, so that liquid is held within the gap through capillary forces;
bringing liquid into the gap between the wafer-shaped article (W) and the mask;
increasing the distance between the wafer-shaped article and the mask until a liquid film in the gap tears; and
removing the liquid residues from the wafer-shaped article surface.
2. Process according to claim 1 , whereby the liquid is applied on the side of the wafer, which is turned away from the mask.
3. Process according to claim 1 , whereby wafer-shaped article rotates during the liquid treatment.
4. Process according to claim 1 , whereby liquid residues are rinsed off.
5. Process according to claim 1 , whereby liquid residues are blown off.
6. Process according to claim 1 , whereby liquid residues are spun off.
7. Process for liquid treatment of a defined area of a wafer-shaped article (W) comprising the following successive steps:
bringing the wafer-shaped article (W) into proximity of a mask, which mask is in the form of a flat ring having an outer diameter greater than an outer diameter of the wafer-shaped article (W) and an inner diameter less than an outer diameter of the wafer-shaped article (W), said wafer-shaped article (W) being positioned above and parallel to and concentric with said mask, such that a peripheral region of the wafer-shaped article (W) overlying said mask defines an area to be treated with the liquid, wherein a gap between wafer-shaped article (W) and the mask is formed and a distance between the mask and the wafer-shaped article (W) is selected small enough, so that liquid is held within the gap through capillary forces;
bringing liquid into the gap between the wafer-shaped article (W) and the mask;
increasing the distance between the wafer-shaped article and the mask until a liquid film in the gap tears; and
removing the liquid residues from the wafer-shaped article surface.