IP Library › Granted Patent US 7,820,007
Granted Patent B2
US 7,820,007 · App. 10/599,440 · Granted Oct 26, 2010

Silicon electrode plate for plasma etching with superior durability

Assignees: Sumco Corporation; Mitsubishi Materials Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,820,007
App. No.
10/599,440
Granted
Oct 26, 2010
Kind
B2
Abstract

This silicon electrode plate for plasma etching is a silicon electrode plate for plasma etching with superior durability including silicon single crystal which, in terms of atomic ratio, contains 3 to 11 ppba of boron, and further contains a total of 0.5 to 6 ppba of either or both of phosphorus and arsenic.

Claims (2)

1. A silicon electrode plate for plasma etching with superior durability, the silicon electrode plate comprising silicon single crystal which, in terms of atomic ratio, contains 3 to 11 ppba of boron, and further contains a total of 0.5 to 6 ppba of either or both of phosphorus and arsenic.

2. A silicon electrode plate according to claim 1 , wherein said silicon single crystal comprises Si raw material with a purity of 11N, and boron, and either or both of phosphorus and arsenic.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2006
From: FUJIWARA, HIDEKI; IKEZAWA, KAZUHIRO; TAGUCHI, HIROAKI; ISHII, TOSHINORI; KOMEKYU, TAKASHI; IWAMOTO, NAOFUMI
To: SUMCO CORPORATION; MITSUBISHI MATERIALS CORPORATION
Reel/Frame 018346/0660 →
Priority Claims (2)
JP 2004-108731 · Apr 1, 2004 · national
JP 2004-234961 · Aug 12, 2004 · national
Continuity (1)
Related Publication 20070181868A1 · Aug 9, 2007