Microelectronic devices and methods for manufacturing microelectronic devices
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic die, a plurality of electrical couplers projecting from the die, and a flowable material disposed on the die. The die includes an integrated circuit and a plurality of terminals operably coupled to the integrated circuit. The electrical couplers are attached to corresponding terminals on the die. The flowable material includes a plurality of spacer elements sized to space the die apart from another component. The flowable material may be a no-flow underfill, a flux compound, or other suitable material.
1. A microelectronic device at an intermediate stage of processing, comprising:
a microelectronic die having an integrated circuit and a plurality of terminals operably coupled to the integrated circuit;
a plurality of metal connectors deposited on corresponding terminals, wherein the metal connectors have a first dimension before being reflowed such that the metal connectors project from the die by a first distance before the metal connectors are reflowed; and
a flowable material disposed on the die and about the metal connectors, the flowable material includes a binder and a plurality of spacer elements distributed generally uniformly throughout the binder, the plurality of spacer elements having a second dimension less than the first dimension of the metal connectors before the metal connectors are reflowed such that after the metal connectors are reflowed the spacer elements are configured to space the die apart from a support member by a second distance corresponding to the second dimension of the spacer elements.
2. The microelectronic device of claim 1 wherein:
the metal connectors comprise a plurality of solder balls having a first diameter;
the spacer elements comprise a plurality of dielectric spherical members having a second diameter of about 40% to about 70% of the first diameter of the metal connectors;
the spherical members are distributed generally uniformly throughout the flowable material; and
the flowable material further comprises at least one of an underfill material or a flux compound.
3. The microelectronic device of claim 1 wherein the second dimension of individual spacer elements is about 40% to about 70% of the first dimension of the metal connectors.
4. The microelectronic device of claim 1 wherein the spacer elements comprise a plurality of dielectric members.
5. The microelectronic device of claim 1 wherein the individual spacer elements have a dimension greater than 37 microns.
6. The microelectronic device of claim 1 wherein the flowable material is disposed in discrete volumes arranged in an array on the die.
7. The microelectronic device of claim 1 wherein the metal connectors comprise a plurality of solder balls electrically coupled to corresponding terminals.
8. A microelectronic device at an intermediate stage of processing, comprising:
a microelectronic die having an integrated circuit and a plurality of terminals operably coupled to the integrated circuit;
a plurality of metal connectors deposited on corresponding terminals, wherein the metal connectors have a first dimension before being reflowed such that the metal connectors project from the die by a first distance before the metal connectors are reflowed; and
a flowable material disposed on the die and about the metal connectors, wherein the flowable material includes a plurality of glass spheres having a second dimension less than the first dimension of the metal connectors before the metal connectors are reflowed such that after the metal connectors are reflowed the glass spheres are configured to space the die apart from a support member by a second distance corresponding to the second dimension of the glass spheres.
9. A microelectronic device at an intermediate stage of processing, comprising:
a microelectronic die having an integrated circuit and a plurality of terminals operably coupled to the integrated circuit;
a plurality of metal connectors deposited on corresponding terminals, wherein the metal connectors have a first dimension before being reflowed such that the metal connectors project from the die by a first distance before the metal connectors are reflowed; and
a flowable material covering at least some of the terminals on the die and being disposed on the die and about the metal connectors, wherein the flowable material includes a plurality of spacer elements having a second dimension less than the first dimension of the metal connectors before the metal connectors are reflowed such that after the metal connectors are reflowed the spacer elements are configured to space the die apart from a support member by a second distance corresponding to the second dimension of the spacer elements.
10. A microelectronic device at an intermediate stage of processing, comprising:
a microelectronic die having an integrated circuit and a plurality of terminals operably coupled to the integrated circuit;
a plurality of metal connectors deposited on corresponding terminals, wherein the metal connectors have a first dimension before being reflowed such that the metal connectors project from the die by a first distance before the metal connectors are reflowed; and
a flowable material disposed on the die and about the metal connectors, wherein the flowable material includes a no-flow underfill and a plurality of spacer elements having a second dimension less than the first dimension of the metal connectors before the metal connectors are reflowed such that after the metal connectors are reflowed the spacer elements are configured to space the die apart from a support member by a second distance corresponding to the second dimension of the spacer elements.
11. A microelectronic device at an intermediate stage of processing, comprising:
a microelectronic die having an integrated circuit and a plurality of terminals operably coupled to the integrated circuit;
a plurality of metal connectors deposited on corresponding terminals, wherein the metal connectors have a first dimension before being reflowed such that the metal connectors project from the die by a first distance before the metal connectors are reflowed; and
a flowable material disposed on the die and about the metal connectors, wherein the flowable material includes a flux compound and a plurality of spacer elements having a second dimension less than the first dimension of the metal connectors before the metal connectors are reflowed such that after the metal connectors are reflowed the spacer elements are configured to space the die apart from a support member by a second distance corresponding to the second dimension of the spacer elements.
12. A microelectronic device at an intermediate stage of processing the microelectronic device, comprising:
a microelectronic component having an active side and a plurality of terminals on the active side;
a plurality of electrical couplers attached to corresponding terminals and projecting from the microelectronic component, the individual electrical couplers having a first dimension before bonding the electrical couplers to corresponding contacts of a support member; and
a flowable material disposed on the active side of the microelectronic component before bonding the electrical couplers to the corresponding contacts of the support member, the flowable material including a no-flow underfill and a plurality of spacer elements having a second dimension less than the first dimension of the electrical couplers.
13. The microelectronic device of claim 12 wherein the individual spacer elements are sized to space the microelectronic component apart from the support member after attaching the microelectronic component to the support member.
14. The microelectronic device of claim 12 wherein the spacer elements comprise a plurality of dielectric members distributed generally uniformly throughout the flowable material.
15. A microfeature workpiece at an intermediate stage of processing the microfeature workpiece, comprising:
a plurality of microelectronic dies;
a plurality of electrical couplers arranged in discrete arrays that are electrically coupled to corresponding microelectronic dies, wherein individual electrical couplers have a first dimension before bonding the electrical couplers to corresponding contacts of a support member; and
a flowable material disposed on the microelectronic dies before bonding the electrical couplers to the corresponding contacts of the support member, the flowable material including spacer elements being distributed generally uniformly throughout the flowable material and having a second dimension less than the first dimension of the electrical couplers.
16. The microfeature workpiece of claim 15 wherein the individual spacer elements have a second dimension of about 40% to about 70% of the first dimension of the electrical couplers.
17. The microfeature workpiece at an intermediate stage of processing the microfeature workpiece, comprising:
a plurality of microelectronic dies;
a plurality of electrical couplers arranged in discrete arrays that are electrically coupled to corresponding microelectronic dies, wherein individual electrical couplers have a first dimension before bonding the electrical couplers to corresponding contacts of a support member; and
a flowable material disposed on the microelectronic dies before bonding the electrical couplers to the corresponding contacts of the support member, the flowable material including a no-flow underfill and a plurality of spacer elements having a second dimension less than the first dimension of the electrical couplers.
18. The microfeature workpiece of claim 17 wherein:
the individual microelectronic dies comprise a plurality of terminals on which corresponding electrical couplers are deposited; and
the flowable material is disposed in discrete volumes covering at least some of the terminals on corresponding dies.
19. The microfeature workpiece of claim 17 wherein the flowable material is disposed in a layer covering multiple dies.
20. The microfeature workpiece of claim 15 wherein the flowable material is disposed in discrete volumes arranged in arrays on corresponding microelectronic dies.