IP Library Granted Patent US 7,887,692
Granted Patent B2
US 7,887,692 · App. 11/711,516 · Granted Feb 15, 2011

Palladium plating solution

Assignee: Electroplating Engineers of Japan Limited
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Quick Facts
Patent No.
US 7,887,692
App. No.
11/711,516
Granted
Feb 15, 2011
Kind
B2
Abstract

The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.

Claims (5)

1. A palladium plating solution consisting essentially of:

a germanium compound consisting of a soluble germanium salt having a concentration ranging from 1 mg/l to 1000 mg/l in terms of a reduced value of palladium metal;

a soluble palladium salt comprising one or more of dichloroethylenediamine palladium (II), palladium chloride, dichlorodiamine palladium (II), dinitrodiamine palladium (II), tetraamine palladium (II) nitrate, tetraamine palladium (II) sulfate, oxalatodiamine palladium (II), tetraamine palladium (II) oxalate and tetraamine palladium (II) chloride, said soluble palladium salt having a concentration ranging from 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal; and

an electrically conductive salt which is at least one selected from the group consisting of an ammonium salt, a sodium salt, and a potassium salt of hydrochloric acid, nitric acid, sulfuric acid, phosphoric acid, and citric acid, said electrically conductive salt having a concentration ranging from 10 g/l to 400 g/l.

2. A method of palladium plating, comprising plating palladium with a plating solution according to claim 1 , wherein said plating is performed at a plating solution temperature of 25 to 70° C., a pH of 6.0 to 10.0 and a current density of 0.10 A/dm 2 to 5.00 A/dm 2 .

Assignments (2)
CHANGE OF NAME Recorded Oct 13, 2022
From: ELECTROPLATING ENGINEERS OF JAPAN LIMITED
To: EEJA LTD.
Reel/Frame 061411/0007 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2007
From: WATANABE, SHINGO; OHNISHI, JUNJI; WACHI, HIROSHI; SONE, TAKAYUKI
To: ELECTROPLATING ENGINEERS OF JAPAN LIMITED
Reel/Frame 019080/0670 →
Priority Claims (2)
JP 2006-057797 · Mar 3, 2006 · national
JP 2007-027861 · Feb 7, 2007 · national
Continuity (1)
Related Publication 20070205109A1 · Sep 6, 2007