Radial block copolymers and adhesives based thereon with improved die-cutting performance
View Patent ↗Improved adhesives are provided through the use of styrenic radial block copolymers, containing at least 40 wt % diblock copolymers, the adhesives have improved adhesive properties and a reduced elastic behavior under die-cutting conditions. Compared to conventional linear block copolymers of similar molecular weight, radial copolymers offer higher holding power and lower melt viscosity for the adhesive. They therefore contribute to an improved balance between processability and end-use properties.
1. A mixture of radial styrenic block copolymer and styrenic diblock copolymer comprising from 55 wt % to 10 wt % of radial styrenic block copolymer and from 45 wt % to 90 wt % of a styrene diene diblock copolymer and wherein the mixture has a styrene content of 10 wt % to 27 wt %; and wherein the radial styrenic block copolymer consists of i) a polystyrene block segment and ii) is a polyisoprene block segment having an end which comprises butadiene, wherein the block copolymer is characterized by the formula:
(pS-pI-pB)n X
pS being polystyrene, pI being polyisoprene, pB being polybutadiene, X being the residue of a multifunctional coupling agent used in the production of the radial block copolymer and n being a number greater than or equal to 3 and representing the average number of branches appended to X, and further wherein the pS component is present in an amount of at least 10 parts to 35 parts per 100 parts by weight of the radial block copolymer; and wherein the weight amount of polybutadiene in the pI-pB segment is less than or equal to 5%.
2. A mixture according to claim 1 wherein the average number molecular weight (Mw) of the polystyrene component is between 10,000 and 15,000 g/mol.
3. A mixture according to claim 1 wherein n is predominately 4.
4. A mixture according to claim 1 in which the radial block copolymer has a molecular weight (Mw) from 200,000 to 500,000 g/mole.
5. A mixture according to claim 1 in which the styrenic radial copolymer has a molecular weight from 240,000 to 400,000 g/mole.
6. A mixture according to claim 1 in which the diblock copolymer is a styrene isoprene diblock copolymer.
7. A mixture according to claim 1 in which the diblock material is a styrene-butadiene diblock material of molecular weight from 50,000 to 150,000 g/mole.
8. An adhesive system comprising a tackifier and a mixture of radial styrenic block copolymer and styrenic diblock copolymer comprising from 55 wt % to 10 wt % of radial styrenic block copolymer and from 45 wt % to 90 wt % of a styrene diene diblock copolymer and wherein the mixture has a styrene content of 10 wt % to 27 wt % %; and wherein the radial styrenic block copolymer consists of i) a polystyrene block segment and ii) is a polyisoprene block segment having an end which comprises butadiene, wherein the block copolymer is characterized by the formula:
(pS-pI-pB)n X
pS being polystyrene, pI being polyisoprene, pB being polybutadiene, X being the residue of a multifunctional coupling agent used in the production of the radial block copolymer and n being a number greater than or equal to 3 and representing the average number of branches appended to X, and further wherein the pS component is present in an amount of at least 10 parts to 35 parts per 100 parts by weight of the radial block copolymer; and wherein the weight amount of polybutadiene in the pI-pB segment is less than or equal to 5%.
9. An adhesive according to claim 8 in which the radial block copolymer comprises a four-arm radial copolymer.
10. An adhesive according to claim 8 in which the radial block copolymer has a molecular weight (Mw) from 200,000 to 500,000 g/mole.
11. An adhesive according to claim 8 in which the diblock copolymer is a styrene isoprene diblock copolymer.
12. An adhesive according to claim 8 in which the styrenic radial copolymer has a molecular weight from 240,000 to 400,000 g/mole.
13. An adhesive according to claim 8 in which the diblock material is a styrene-butadiene diblock material of molecular weight from 50,000 to 150,000 g/mole.
14. An adhesive according to claim 8 in which the tackifier is at least one of a hydrocarbon resin, an aliphatic C5 resin, an aromatic resin, an aromatic/aliphatic C5/C6 resin.
15. An adhesive according to claim 14 in which the resin is hydrogenated.
16. An adhesive according to claim 8 in which the tackifier is a rosin, rosin ester, or a polyterpene resin.
17. An adhesive according to claim 16 in which the tackifier is hydrogenated.
18. An adhesive according to claim 8 having a storage modulus plateau at low frequencies below 8,000 Pa, when measured at 20° C.
19. An adhesive according to claim 8 in which G′ intersects a value of 10,000 Pa at a frequency higher than 0.001 rad/s, when measured at 20° C.
20. An adhesive according to claim 8 having a loss factor Tan delta between 0.2 and 1.3 at the frequency at which the storage modulus intersects a value of 10000 Pa, when measured at 20° C.
21. An adhesive according to claim 8 further containing a plasticizing oil.
22. An adhesive according to claim 21 containing from 5 to 20 wt % of the plasticizing oil.
23. A hot melt pressure sensitive adhesive which is an adhesive according to claim 8 .
24. A process for the production of labels comprising, applying as a hot melt an adhesive, according to claim 8 , said adhesive being applied to a release liner, and subsequently laminating the coated release liner to a face stock, and converting the laminate into a label stock.
25. The mixture of claim 1 wherein the styrenic diblock copolymer content is at least 60 wt % based on the total amount of block copolymer present.
26. The mixture of claim 1 wherein the styrenic diblock copolymer content is at least 65 wt % based on the total amount of block copolymer present.
27. The mixture of claim 1 wherein the styrenic diblock copolymer content is at least 70 wt % based on the total amount of block copolymer present.
28. The adhesive of claim 8 wherein the styrenic diblock copolymer content is at least 60 wt % based on the total amount of block copolymer present.
29. The adhesive of claim 8 wherein the styrenic diblock copolymer content is at least 65 wt % based on the total amount of block copolymer present.
30. The adhesive of claim 8 wherein the styrenic diblock copolymer content is at least 70 wt % based on the total amount of block copolymer present.