IP Library Granted Patent US 7,915,926
Granted Patent B2
US 7,915,926 · App. 12/772,748 · Granted Mar 29, 2011

Semiconductor chip and semiconductor device including the same

Assignee: Renesas Electronics Corporation
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Quick Facts
Patent No.
US 7,915,926
App. No.
12/772,748
Granted
Mar 29, 2011
Kind
B2
Abstract

A semiconductor chip includes a plurality of pads, input circuits or output circuits that are electrically connected to the pads, a main control unit that outputs a read access signal, the read access signal controlling reading of signals from an external circuit or an internal circuit, and activation control units that control activation of the input circuits or the output circuits that are electrically connected to the pads based on the read access signal, the pads receiving the signals from the external circuit or the internal circuit.

Claims (35)

1. A semiconductor chip comprising:

a plurality of pads;

input circuits or output circuits that are electrically connected to the pads;

a main control unit that outputs a read access signal, the read access signal controlling reading of signals from an external circuit or an internal circuit; and

activation control units that control activation of the input circuits or the output circuits that are electrically connected to the pads based on the read access signal, the pads receiving the signals from the external circuit or the internal circuit.

2. The semiconductor chip according to claim 1 , wherein

the activation control units set the input circuits or the output circuits that are electrically connected to the pads to an active state in advance based on a first read access signal, the pads receiving the signals from the external circuit or the internal circuit, and

the input circuits or the output circuits that are made active transfer signals applied to the pads from the external circuit to the internal circuit or transfer the signals applied to the pads from the internal circuit to the external circuit based on a second read access signal.

3. The semiconductor chip according to claim 1 , wherein

each of the activation control units comprises:

a logical OR circuit; and

a flip-flop that outputs an activation signal that activates the input circuit or the output circuit,

the logical OR circuit outputs logical OR between the activation signal output from the flip-flop and the read access signal output from the main control unit, and

the flip-flop latches an output signal from the logical OR circuit and outputs the activation signal.

4. The semiconductor chip according to claim 1 , further comprising a product information storage unit that stores product information, wherein

each of the activation control units controls activation of the input circuit or the output circuit that is electrically connected to a pad based on a control signal based on the product information and the read access signal, the pad receiving the signal from the external circuit or the internal circuit.

5. The semiconductor chip according to claim 1 , further comprising an operation mode judgment unit that judges operation modes of the input circuits or the output circuits, wherein

each of the activation control units controls activation of the input circuit or the output circuit that is electrically connected to a pad based on the read access signal and an operation mode judgment signal generated as a result of judgment of the operation mode, the pad receiving the signal from the external circuit or the internal circuit.

6. A semiconductor device comprising:

a semiconductor chip comprising:

a plurality of pads;

input circuits or output circuits that are electrically connected to the pads;

a main control unit that outputs a read access signal, the read access signal controlling reading of signals from an external circuit or an internal circuit; and

activation control units that control activation of the input circuits or the output circuits that are electrically connected to the pads based on the read access signal, the pads receiving the signals from the external circuit or the internal circuit; and

leads on which the semiconductor chip is mounted, the leads electrically connected to the pads.

7. A semiconductor chip comprising:

a plurality of pads;

input circuits or output circuits that are electrically connected to the pads;

a main control unit that outputs a read access signal, the read access signal controlling reading of signals from an external circuit or an internal circuit; and

activation control units that control activation of the input circuits or the output circuits that are electrically connected to the pads based on the read access signal, the pads receiving the signals from the external circuit or the internal circuit, wherein

each of the activation control units comprises:

a logical OR circuit that outputs logical OR between the read access signal output from the main control unit and an activation signal output from the flip-flop; and

a flip-flop that latches an output signal from the logical OR circuit, and outputs the activation signal that activates the input circuit or the output circuit,

the activation control units set the input circuits or the output circuits that are electrically connected to the pads to an active state in advance based on a first read access signal, the pads receiving the signals from the external circuit or the internal circuit, and

the input circuits or the output circuits which are made active transfer signals applied to the pads from the external circuit to the internal circuit or transfer signals applied to the pads from the internal circuit to the external circuit based on a second read access signal that is output subsequent to the output of the first read access signal.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025191/0985 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2010
From: ISOGAI, HIDEO; TANAKA, KENTAROU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024328/0009 →
Priority Claims (1)
JP 2009-114600 · May 11, 2009 · national
Continuity (1)
Related Publication 20100283508A1 · Nov 11, 2010