IP Library › Granted Patent US 7,951,513
Granted Patent B2
US 7,951,513 · App. 12/434,021 · Granted May 31, 2011

Pellicle and method for producing pellicle

Assignee: Shin-Etsu Chemical Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,951,513
App. No.
12/434,021
Granted
May 31, 2011
Kind
B2
Abstract

A silicon single crystal film having a crystal plane as its principal plane, the crystal plane being inclined at 3 to 5° from any lattice plane belonging to {100} planes or {111} planes is used as a pellicle film. The silicon single crystal having such a crystal plane as its principal plane has effective bond density and Young's modulus thereof which are about 40% to about 50% higher than those of a silicon single crystal with <100> orientation, and therefore a cleavage and crack do not easily occur. Moreover, the silicon single crystal has a high chemical resistance such as hydrofluoric acid resistance, and hardly causes an etch pit and void. Accordingly, the present invention can provide a pellicle comprising a pellicle film for EUV having high transmission, and excellent mechanical and chemical stability, as well as having a high yield, and being practical also in cost.

Claims (26)

1. A pellicle, comprising:

a silicon single crystal film as a pellicle film,

wherein a principal plane of the silicon single crystal film is a crystal plane inclined at 3 to 5° from any lattice plane belonging to {100} planes or {111} planes,

wherein when the lattice plane belongs to a {100} plane, the crystal plane is inclined at 3 to 5° in a <111> direction.

2. The pellicle according to claim 1 , wherein the lattice plane belongs to the {111} planes, and the crystal plane is inclined at 3 to 5° in a <110> direction.

3. The pellicle according to claim 1 , wherein the silicon single crystal film is obtained by making an SOI substrate into a thin film.

4. The pellicle according to claim 1 , wherein the silicon single crystal film has an absorption coefficient of 0.005/nm or less for light having a wavelength of 13.5 nm.

5. The pellicle according to claim 1 , comprising a protection film on at least one principal plane of the silicon single crystal film.

6. The pellicle according to claim 5 , wherein the protection film has an absorption coefficient of 0.05/nm or less for light having a wavelength of 13.5 nm.

7. The pellicle according to claim 5 , wherein the protection film consists of at least one material selected from the group consisting of SiC, SiO 2 , Si 3 N 4 , SiON, Y 2 O 3 , YN, Mo, Ru, and Rh.

8. A method of producing a pellicle, comprising:

providing a pellicle film retaining portion on a top side of an SOI substrate comprising the top side and a bottom side, that has, on one principal plane, a silicon single crystal film having a crystal plane as its principal plane, the crystal plane being inclined at 3 to 5° from any lattice plane belonging to {100} planes or {111} planes; and

forming the silicon single crystal film as a pellicle film by removing a support substrate from the bottom side of the SOI substrate,

wherein when the lattice plane belongs to a {100} plane, the crystal plane is inclined at 3 to 5° in a <111> direction.

9. The method of claim 8 , further comprising forming a protection film on at least one surface of the silicon single crystal film.

10. The method of claim 9 , wherein the forming a protection film is performed by coating a film with at least one material selected from the group consisting of SiC, SiO 2 , Si 3 N 4 , SiON, Y 2 O 3 , YN, Mo, Ru, and Rh.

11. The method of claim 10 , wherein a coating method of the protection film is a gas cluster ion beam evaporation method.

12. The pellicle of claim 1 , having a thickness of 20 to 150 nm.

13. The pellicle of claim 1 , having a thickness of 20 to 70 nm.

14. The method of claim 8 , wherein the pellicle has a thickness of 20 to 150 nm.

15. The method of claim 8 , wherein the pellicle has a thickness of 20 to 70 nm.

16. The method of claim 8 , wherein the lattice plane of the pellicle belongs to the {111} planes, and the crystal plane is inclined at 3 to 5° in a <110> direction.

17. The pellicle of claim 1 , having an EUV transmittance of 50% or more.

18. The method of claim 8 , wherein the pellicle has an EUV transmittance of 50% or more.

19. The pellicle of claim 1 , wherein the lattice plane belongs to the {111} planes.

20. The method of claim 8 , wherein the lattice plane of the pellicle belongs to the {111} planes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2009
From: KUBOTA, YOSHIHIRO; AKIYAMA, SHOJI; SHINDO, TOSHIHIKO
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 022862/0205 →
Priority Claims (1)
JP 2008-120664 · May 2, 2008 · national
Continuity (1)
Related Publication 20090274962A1 · Nov 5, 2009