RF pulsing of a narrow gap capacitively coupled reactor

1. An apparatus for providing a plasma etch of a layer over a wafer, comprising:

a capacitively coupled process chamber;

a gas source is in fluid connection with the capacitively coupled process chamber;

a first electrode within the process chamber;

a second electrode spaced apart and opposite from the first electrode, wherein the second electrode is spaced from the first electrode so that the space between the first electrode and the second electrode has a ratio to the diameter of the wafer of less than 1:30 and more than or equal to 1:60;

a first radio frequency power source, electrically connected to the second electrode, wherein the first radio frequency power source provides radio frequency power of between 150 kHz and 10 MHz;

a second radio frequency power source, electrically connected to the second electrode, wherein the second radio frequency power source provides a radio frequency power of between 12 MHz and 200 MHz;

a first modulation control connected to the first radio frequency power source, to provide a controlled modulation of the first radio frequency power source at a frequency of between 1 kHz to 100 kHz; and

a second modulation control connected to the second radio frequency power source, to provide a controlled modulation of the second radio frequency power source at a frequency of between about 1 kHz to about 100 kHz, wherein the second electrode forms a substrate holder or supporting a wafer and wherein the first radio frequency power source and the second radio frequency power source are electrically connected to the second electrode, wherein first modulation control and the second modulation control provide frequency modulation to the second electrode.

2. The apparatus, as recited in claim 1 , wherein the second electrode is spaced apart from the first electrode by between about 0.5 and 4 cm.

3. The apparatus, as recited in claim 1 , further comprising at least one confinement ring within the process chamber, wherein the at least one confinement ring defines a plasma volume.

4. The apparatus, as recited in claim 1 , further comprising a controller controllably connected to the first modulation control and the second modulation control.

5. The apparatus, as recited in claim 1 , wherein the second radio frequency is greater than ten times the first radio frequency.

6. An apparatus for providing a plasma etch of a layer over a wafer, comprising:

a capacitively coupled process chamber;

a gas source is in fluid connection with the capacitively coupled process chamber;

a first electrode within the process chamber;

a second electrode spaced apart and opposite from the first electrode, wherein the second electrode is spaced apart from the first electrode forming a gap, and wherein the wafer is mountable between the first and second electrodes and wherein an aspect ratio of a wafer diameter to gap size is less than 30:1 and more than or equal to 60:1;

a first radio frequency power source for providing a power signal at a first frequency, electrically connected to the second electrode;

a second radio frequency power source for providing a power signal at a second frequency, electrically connected to the second electrode, wherein the first frequency is different than the second frequency;

a first modulation control connected to the first radio frequency power source, to provide a controlled modulation of the first radio frequency power source at a frequency of between 1 kHz to 100 kHz; and

a second modulation control connected to the second radio frequency power source, to provide a controlled modulation of the second radio frequency power source at a frequency of between about 1 kHz to about 100 kHz.

7. The apparatus, as recited in claim 6 , wherein the second electrode is spaced apart from the first electrode by between about 0.5 and 4 cm.

8. The apparatus, as recited in claim 7 , wherein the second radio frequency is greater than ten times the first radio frequency.

9. The apparatus, as recited in claim 6 , further comprising at least one confinement ring within the process chamber, wherein the at least one confinement ring defines a plasma volume.

10. The apparatus, as recited in claim 6 , further comprising a controller controllably connected to the first modulation control and the second modulation control.

11. The apparatus, as recited in claim 6 , wherein the second electrode forms a substrate holder for supporting a wafer and wherein the first radio frequency power source and the second radio frequency power source are electrically connected to the second electrode, wherein the first modulation control and the second modulation control provide frequency modulation to the second electrode.

12. The apparatus, as recited in claim 11 , wherein the first electrode is grounded.

13. The apparatus, as recited in claim 1 , wherein the first electrode is grounded.

14. The apparatus of claim 1 , wherein the controlled modulations of the first and second radio frequency power source are designed to cause an increase in a plasma sheath size such that the plasma sheath takes up a significant portion of the gap between the first electrode and the second electrode.

15. The apparatus of claim 6 , wherein the controlled modulations of the first and second radio frequency power source are designed to cause an increase in a plasma sheath size such that the plasma sheath takes up a significant portion of the gap between the first electrode and the second electrode.

16. The apparatus, as recited in claim 1 , wherein the second radio frequency power source provides a radio frequency between about 27 MHz to 200 MHz.

17. The apparatus, as recited in claim 1 , wherein the second radio frequency power source provides a radio frequency of about 27 MHz.