IP Library Granted Patent US 8,003,017
Granted Patent B2
US 8,003,017 · App. 12/314,882 · Granted Aug 23, 2011

Adhesive composition and anisotropic conductive film using the same

Assignee: Cheil Industries, Inc.
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Quick Facts
Patent No.
US 8,003,017
App. No.
12/314,882
Granted
Aug 23, 2011
Kind
B2
Abstract

An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.

Claims (24)

1. An adhesive composition, comprising:

about 10 to about 40% by weight of an ethylene-vinyl acetate copolymer;

about 5 to about 20% by weight of a copolymer of maleimide and styrene;

about 1 to about 20% by weight of a binder resin;

about 30 to about 60% by weight of a radical polymerizable material; and

about 0.5 to about 5% by weight of a radical initiator.

2. An anisotropic conductive film produced using the composition as claimed in claim 1 .

3. The composition as claimed in claim 1 , further comprising conductive particles.

4. The composition as claimed in claim 3 , wherein the conductive particles are present in an amount of about 0.01 to about 3% by weight.

5. The composition as claimed in claim 1 , further comprising about 0.1 to about 5% by weight of a coupling agent.

6. The composition as claimed in claim 1 , further comprising about 0.05 to about 0.5% by weight of an additive including at least one of a polymerization inhibitor, an antioxidant, and a heat stabilizer.

7. The composition as claimed in claim 1 , wherein the ethylene-vinyl acetate copolymer contains vinyl acetate units in an amount of about 20 to about 80% by weight, based on the total weight of the ethylene-vinyl acetate copolymer.

8. An adhesive composition, comprising:

an ethylene-vinyl acetate copolymer;

a copolymer of maleimide and styrene;

a binder resin;

a radical polymerizable material;

a radical initiator;

conductive particles; and

a coupling agent.

9. The composition as claimed in claim 1 , wherein the copolymer of maleimide and styrene has a styrene content of about 50% or greater, based on the total weight of the copolymer.

10. The composition as claimed in claim 1 , wherein the binder resin has a weight average molecular weight of about 10,000 to about 1,000,000 and includes at least one of a polyvinyl butyral resin, a polyvinyl formal resin, a polyester resin, a phenolic resin, an epoxy resin, a phenoxy resin, a urethane resin, and an acrylic resin.

11. The composition as claimed in claim 1 , wherein the radical polymerizable material includes at least one of an acrylate, a methacrylate, a maleimide compound, and a compound having a phosphate ester structure.

12. The composition as claimed in claim 1 , wherein the radical initiator includes at least one of a photopolymerization initiator and a heat curing initiator.

Assignments (5)
MERGER Recorded Mar 26, 2025
From: KUKDO ADVANCED MATERIALS CO., LTD.
To: KUKDO CHEMICAL CO., LTD.
Reel/Frame 070646/0572 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2022
From: KUKDO CHEMICAL CO., LTD.
To: KUKDO ADVANCED MATERIALS CO., LTD.
Reel/Frame 060940/0414 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2019
From: SAMSUNG SDI CO., LTD.
To: KUDKO CHEMICAL CO., LTD.
Reel/Frame 050640/0740 →
MERGER AND CHANGE OF NAME Recorded Oct 7, 2019
From: CHEIL INDUSTRIES INC.; SAMSUNG SDI CO., LTD.; SAMSUNG SDI CO., LTD.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 050646/0718 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2008
From: JEON, BYEONG HWAN; PARK, KYOUNG SOO; KIM, BONG YONG; KWON, YOUNG JIN; YOON, KANG BAE; SHIN, KYONG HUN; NAMKUNG, HYUN HEE; SEO, HYUN JOO; LEE, CHEON SEOK
To: CHEIL INDUSTRIES, INC.
Reel/Frame 022057/0591 →
Priority Claims (1)
KR 10-2007-0133085 · Dec 18, 2007 · national
Continuity (1)
Related Publication 20090152505A1 · Jun 18, 2009