Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
A method is provided comprising: coating an electrically conductive core with a first removable material, creating openings in the first removable material to expose portions of the electrically conductive core, plating a conductive material onto the exposed portions of the electrically conductive core, coating the conductive material with a second removable material, removing the first removable material, electrophoretically coating the electrically conductive core with a dielectric coating, and removing the second removable material.
1. A method for coating an electrically conductive core, the method comprising:
coating an electrically conductive core with a first removable material;
creating openings in the first removable material to expose portions of the electrically conductive core;
plating a conductive material onto the exposed portions of the electrically conductive core;
coating the conductive material with a second removable material;
removing the first removable material;
electrophoretically coating the electrically conductive core with a dielectric coating; and
removing the second removable material.
2. The method of claim 1 , wherein the first and second removable materials are removed using different chemistries.
3. The method of claim 1 , wherein the first removable material comprises a negative-acting resist, and the second removable coating comprises a positive-acting resist.
4. The method of claim 1 , wherein the first removable material comprises a positive-acting resist, and the second removable coating comprises a negative-acting resist.
5. The method of claim 1 , wherein the dielectric coating is cured.
6. The method of claim 1 , further comprising:
applying a conductive layer on all surfaces.
7. The method of claim 6 , where the conductive layer is electrolessly applied.
8. The method of claim 7 , where the conductive layer is further electroplated.
9. The method of claim 6 , where the conductive layer is sputtered.
10. The method of claim 9 , where the conductive layer is further electroplated.
11. A method for coating an electrically conductive core, the method comprising:
applying a layer of a first conductive material to a substrate having a dielectric coating on a conductive core and conductive vias extending through openings in the dielectric coating;
applying a layer of a first removable material to the first conductive material;
forming openings in the first removable material to expose areas of the conductive material to be plated;
plating a second conductive material onto the exposed areas of the first conductive material;
applying a layer of a second removable material to the first and second conductive material;
forming openings in the second removable material to expose areas of the second conductive material to be plated; and
plating a third conductive material onto the exposed areas of the second conductive material.
12. The method of claim 11 , wherein of applying a layer of a first conductive material to a substrate comprises:
using electroless deposition to deposit a seed layer; and
plating the first conductive material onto the seed layer.
13. The method of claim 12 , further comprising:
removing the first removable material; and
etching the seed layer.
14. The method of claim 11 , wherein applying a layer of a first conductive material to a substrate comprises:
sputter depositing a seed layer; and
plating the first conductive material onto the seed layer.
15. The method of claim 14 , further comprising:
removing the first removable material; and
etching the seed layer.
16. The method of claim 11 , wherein the first and second removable materials are plating resists.