IP Library Granted Patent US 8,018,767
Granted Patent B2
US 8,018,767 · App. 12/275,121 · Granted Sep 13, 2011

Semiconductor device and method of controlling the same

Assignee: Spansion, LLC
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,018,767
App. No.
12/275,121
Granted
Sep 13, 2011
Kind
B2
Abstract

The present invention provides a semiconductor device that includes: a memory cell array that includes non-volatile memory cells; a first selecting circuit that connects or disconnects a source and a drain of a transistor that forms one of the memory cells, to or from a data line DATAB connected to a first power supply; and a second selecting circuit that connects or disconnects the source and drain to or from a ground line ARVSS connected to a second power supply. In this semiconductor device, the first selecting circuit and the second selecting circuit are arranged on the opposite sides of the memory cell array. The present invention also provides a method of controlling the semiconductor device.

Claims (33)

1. A semiconductor device comprising:

a memory cell array that includes non-volatile memory cells;

bit lines that are connected to sources and drains of transistors that form the memory cells;

word lines that are connected to gates of the transistors;

a plurality of divided regions that are contained in the memory cell array, each of the divided regions having memory cells connected to the same one of the word lines;

a plurality of sub divided regions that are contained in each of the divided regions, each of the sub divided regions having memory cells connected to the same one of the word lines;

a plurality of cell blocks each having at least one bit contained in each of the divided regions, memory cells in each of the cell blocks being physically adjacent to one another; and

a connecting circuit that connects bit lines connected to neighboring memory cells to each other in the divided region;

wherein a first bit line connected to a first memory cell that is one of the memory cells in which data is to be written is precharged before the data is written in the first memory cell;

when the first bit line is precharged, the connecting circuit connects the first bit line to a second bit line connected to a second memory cell that is a memory cell neighboring the first memory cell in the divided region; and

before the data is written in the first memory cell, the connecting circuit disconnects the first bit line from the second bit line.

2. The semiconductor device of claim 1 , wherein, when the data is written in the first memory cell, the connecting circuit disconnects the first bit line from the second bit line.

3. The semiconductor device of claim 1 , wherein the connecting circuit comprising:

a selecting transistor that is connected to a first connecting line connected to the first bit line, and to a second connecting line connected to the second bit line.

4. The semiconductor device of claim 1 , wherein the plurality of divided regions that are contained in the memory cell array, each of the divided regions having memory cells connected to the same one of the word lines, data being read simultaneously from the memory cells of the same one of the divided regions.

5. The semiconductor device of claim 4 , wherein the plurality of sub divided regions that are contained in each of the divided regions, each of the sub divided regions having memory cells connected to the same one of the word lines, data being written simultaneously in the memory cells of the same one of the sub divided regions.

6. The semiconductor device of claim 1 , wherein the plurality of sub divided regions that are contained in each of the divided regions, each of the sub divided regions having memory cells connected to the same one of the word lines, data being written simultaneously in the memory cells of the same one of the sub divided regions.

7. The semiconductor device of claim 1 , wherein the semiconductor device is flash memory.

8. The semiconductor device of claim 1 , wherein the semiconductor device is NOR flash memory.

9. The semiconductor device of claim 1 , wherein the semiconductor device is NAND flash memory.

10. A method of controlling a semiconductor device that includes: a memory cell array that includes non-volatile memory cells; bit lines that are connected to sources and drains of transistors that form the memory cells; word lines that are connected to gates of the transistors; a plurality of divided regions that are contained in the memory cell array, each of the divided regions having memory cells connected to the same one of the word lines; a plurality of sub divided regions that are contained in each of the divided regions, each of the sub divided regions having memory cells connected to the same one of the word lines; and a plurality of cell blocks each having at least one bit contained in each of the divided regions, memory cells in each of the cell blocks being physically adjacent to one another,

the method comprising:

connecting a first bit line connected to a first memory cell that is a memory cell in which data is to be written, to a second bit line connected to a second memory cell that is a memory cell adjacent to the first memory cell in the divided region;

precharging the first bit line and the second bit line;

disconnecting the first bit line from the second bit line; and

after the disconnecting, writing the data in the first memory cell.

11. The method of claim 10 , wherein the plurality of divided regions that are contained in the memory cell array, each of the divided regions having memory cells connected to the same one of the word lines, data being read simultaneously from the memory cells of the same one of the divided regions.

12. The method of claim 11 , wherein the plurality of sub divided regions that are contained in each of the divided regions, each of the sub divided regions having memory cells connected to the same one of the word lines, data being written simultaneously in the memory cells of the same one of the sub divided regions.

13. The method of claim 10 , wherein the plurality of sub divided regions that are contained in each of the divided regions, each of the sub divided regions having memory cells connected to the same one of the word lines, data being written simultaneously in the memory cells of the same one of the sub divided regions.

14. The method of claim 10 , wherein the non-volatile memory cells are virtual ground memory cells.

15. The method of claim 10 , wherein the semiconductor device is flash memory.

16. The method of claim 10 , wherein the semiconductor device is NOR flash memory.

17. The method of claim 10 , wherein the semiconductor device is NAND flash memory.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036050/0514 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Continuity (3)
Division 11637260 · Dec 11, 2006
Continuation PCTJP2005023021 · Dec 15, 2005
Related Publication 20090109757A1 · Apr 30, 2009