IP Library Granted Patent US 8,021,489
Granted Patent B2
US 8,021,489 · App. 13/016,836 · Granted Sep 20, 2011

Substrate treatment process

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Quick Facts
Patent No.
US 8,021,489
App. No.
13/016,836
Granted
Sep 20, 2011
Kind
B2
Abstract

A method of forming a plasma to physicochemically modify properties of a fluid spray in a substrate treatment processes includes providing an applicator in proximity to the substrate. The applicator comprises an electrically insulated main body portion containing a cavity, a tube axially positioned within the cavity for transporting a first fluid, an annular electric-field generator positioned within the cavity between the main body portion and the tube, a region between the tube and the generator for transporting a second fluid, and a nozzle connected to the main body portion for mixing the first fluid with the second fluid to form the fluid spray. The tube, the nozzle or the substrate are selectively grounded. Upon activating the electric-field generator, plasma is formed within the tube or about the region between the tube and the generator when the tube is grounded, within the nozzle when the nozzle is grounded or between the nozzle and the substrate when the substrate is grounded.

Claims (47)

1. A method of forming a plasma to physicochemically modify properties of a fluid spray in a substrate treatment processes, the method comprising:

providing a substrate to be treated;

providing an applicator in proximity to the substrate, the applicator comprising:

an electrically insulated main body portion containing a cavity therethrough;

a tube axially positioned within the cavity of the main body portion for transporting a first fluid;

an annular electric-field generator positioned within the cavity between the main body portion and the tube;

a region between the tube and the generator for transporting a second fluid; and

a convergent-divergent nozzle connected to the main body portion for mixing the first fluid with the second fluid and directing the resulting fluid spray onto a substrate;

grounding the tube, the nozzle or the substrate;

supplying the tube with the first fluid;

supplying the region with the second fluid; and

activating the electric-field generator to form the plasma to physicochemically modify properties of the first fluid, the second fluid or the fluid spray, wherein the plasma is formed within or about the region between the tube and the generator when the tube is grounded, wherein the plasma is formed within the nozzle when the nozzle is grounded, wherein the plasma is formed between the nozzle and the substrate when the substrate is grounded.

2. The method of claim 1 wherein the applicator further includes a non-conductive spacer positioned between the generator and the nozzle.

3. The method of claim 1 wherein the nozzle is constructed of semi-conductive material, the plasma being formed within a convergent portion of the nozzle.

4. The method of claim 1 wherein the nozzle is constructed of a non-conductive material, the plasma being formed between a nozzle opening and the substrate.

5. The method of claim 1 wherein the plasma is selectively formed within the tube or between the nozzle and the substrate when or about the region between the tube and the generator and the substrate are grounded.

6. The method of claim 5 wherein the nozzle is conductive.

7. A method of forming a plasma to physicochemically modify properties of a fluid spray in a substrate treatment processes, the method comprising:

providing an applicator, the applicator comprising:

an electrically insulated main body portion containing a cavity therethrough;

a tube axially positioned within the cavity of the main body portion for transporting a first fluid;

an annular electric-field generator positioned within the cavity between the main body portion and the tube;

a region between the tube and the generator for transporting a second fluid; and

a nozzle connected to the main body portion for mixing the first fluid with the second fluid and directing the resulting fluid spray onto a substrate;

grounding the tube;

grounding the nozzle;

supplying the tube with the first fluid;

supplying the region with the second fluid; and

activating the electric-field generator whereupon a plasma is formed within the nozzle, within or about the region between the tube and the generator.

8. The method of claim 7 wherein the nozzle is constructed of semi-conductive material, the plasma being formed within a convergent portion of the nozzle.

9. The method of claim 7 wherein the nozzle is constructed of a non-conductive material, the plasma being formed between a nozzle opening and the substrate.

10. The method of claim 7 and further comprising grounding the substrate, wherein the plasma is formed between the nozzle and the substrate.

11. A method of forming a plasma to physicochemically modify properties of a fluid spray in a substrate treatment processes, the method comprising:

providing a substrate to be treated;

providing an applicator in proximity to the substrate, the applicator comprising:

an electrically insulating main body portion containing a through-bore;

an electrically insulated tube centrally positioned within the main body portion for transporting a first fluid;

an annular electric-field generator positioned within the main body portion;

a region between an outer wall of the tube and the generator for transporting a second fluid; and

a convergent-divergent nozzle positioned for receiving the first fluid and the second fluid to form the fluid spray;

grounding the nozzle;

supplying the tube with the first fluid;

supplying the region with the second fluid;

mixing the first fluid with the second fluid within the nozzle to form the fluid spray; and

activating the electric-field generator to form the plasma within the nozzle, the plasma modifying the first fluid, the second fluid or the fluid spray.

12. The method of claim 11 wherein the substrate is supported by a grounded conductor, wherein activating the electric-field generator the plasma is formed between the nozzle and the grounded conductor to modify the fluid spray.

13. The method of claim 11 and further comprising grounding the tube, wherein activating the electric-field generator the plasma is formed within or about the region between the tube and the generator.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2020
From: CLEANLOGIX LLC
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052966/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2019
From: JACKSON, DAVID PETER, MR.
To: CLEANLOGIX LLC
Reel/Frame 051125/0935 →
Continuity (4)
Division 11465762 · Aug 18, 2006
Division 10362598
Provisional Application 60226882 · Aug 23, 2000
Related Publication 20110132395A1 · Jun 9, 2011