IP Library Granted Patent US 8,023,310
Granted Patent B2
US 8,023,310 · App. 12/320,008 · Granted Sep 20, 2011

Nonvolatile memory cell including carbon storage element formed on a silicide layer

Assignee: SanDisk 3D LLC
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Quick Facts
Patent No.
US 8,023,310
App. No.
12/320,008
Granted
Sep 20, 2011
Kind
B2
Abstract

A nonvolatile memory cell includes a storage element, the storage element comprising a carbon material, a steering element located in series with the storage element, and a metal silicide layer located adjacent to the carbon material. A method of making a device includes forming a metal silicide over a silicon layer, forming a carbon layer over the metal silicide layer, forming a barrier layer over the carbon layer, and patterning the carbon layer, the metal silicide layer, and the silicon layer to form an array of pillars.

Claims (40)

1. A nonvolatile memory cell, comprising:

a storage element, the storage element comprising a carbon material;

a steering element located in series with the storage element wherein the steering element comprises a p-i-n polysilicon diode; and

a metal silicide layer located adjacent to the carbon material.

2. The nonvolatile memory cell of claim 1 , wherein the metal silicide layer comprises at least one of titanium silicide, platinum silicide, cobalt silicide, tungsten silicide, or nickel silicide.

3. The nonvolatile memory cell of claim 1 , wherein the metal silicide layer comprises titanium silicide.

4. The nonvolatile memory cell of claim 1 , wherein the carbon material comprises at least one of carbon nanotube, amorphous carbon, polycrystalline carbon, graphene resistivity switching material, or a combination thereof.

5. The nonvolatile memory cell of claim 4 , wherein the carbon material comprises polycrystalline carbon, amorphous carbon, or a combination thereof.

6. The nonvolatile memory cell of claim 1 , wherein the nonvolatile memory cell is a read/write memory cell or a rewritable memory cell.

7. The nonvolatile memory cell of claim 1 , wherein the nonvolatile memory cell is located in a monolithic three dimensional array of memory cells.

8. The nonvolatile memory cell of claim 1 , wherein:

the nonvolatile memory cell further comprises a bottom electrode located underneath the steering element and an upper electrode located over the storage element;

the steering element comprises a cylindrical pillar diode;

the storage element comprises a carbon layer having a substantial cylindrical pillar shape; and

the metal silicide layer has a substantial cylindrical pillar shape and is located between the steering element and the storage element.

9. The nonvolatile memory cell of claim 8 , wherein the cylindrical pillar diode, the carbon layer, and the metal silicide layer have a substantially same diameter.

10. A nonvolatile memory cell, comprising:

a storage element, the storage element comprising a carbon material, wherein the carbon material comprises polycrystalline carbon, amorphous carbon, or a combination thereof;

a steering element located in series with the storage element; and

a metal silicide layer located adjacent to the carbon material.

11. The nonvolatile memory cell of claim 10 , wherein the carbon material comprises amorphous carbon.

12. The nonvolatile memory cell of claim 10 , wherein the carbon material comprises polycrystalline carbon.

13. The nonvolatile memory cell of claim 10 , wherein the metal silicide layer comprises at least one of titanium silicide, platinum silicide, cobalt silicide, tungsten silicide, or nickel silicide.

14. The nonvolatile memory cell of claim 10 , wherein the metal silicide layer comprises titanium silicide.

15. The nonvolatile memory cell of claim 10 , wherein the steering element comprises a diode or a transistor.

16. The nonvolatile memory cell of claim 14 , wherein the steering element comprises a p-i-n polysilicon diode.

17. The nonvolatile memory cell of claim 10 , wherein the nonvolatile memory cell is a read/write memory cell or a rewritable memory cell.

18. The nonvolatile memory cell of claim 10 , wherein the nonvolatile memory cell is located in a monolithic three dimensional array of memory cells.

19. A nonvolatile memory cell, comprising:

a storage element, the storage element comprising a carbon material;

a steering element located in series with the storage element; and

a metal silicide layer located adjacent to the carbon material,

wherein the nonvolatile memory cell is located in a monolithic three dimensional array of memory cells.

20. The nonvolatile memory cell of claim 19 , wherein the metal silicide layer comprises at least one of titanium silicide, platinum silicide, cobalt silicide, tungsten silicide, or nickel silicide.

21. The nonvolatile memory cell of claim 19 , wherein the metal silicide layer comprises titanium silicide.

22. The nonvolatile memory cell of claim 19 , wherein the steering element comprises a diode or a transistor.

23. The nonvolatile memory cell of claim 22 , wherein the steering element comprises a p-i-n polysilicon diode.

24. The nonvolatile memory cell of claim 19 , wherein the carbon material comprises at least one of carbon nanotube, amorphous carbon, polycrystalline carbon, graphene resistivity switching material, or a combination thereof.

25. The nonvolatile memory cell of claim 24 , wherein the carbon material comprises polycrystalline carbon, amorphous carbon, or a combination thereof.

26. The nonvolatile memory cell of claim 19 , wherein the nonvolatile memory cell is a read/write memory cell or a rewritable memory cell.

Assignments (4)
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0600 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT LISTED PATENT NUMBER 8853569 TO THE CORRECT PATENT NUMBER 8883569 PREVIOUSLY RECORDED ON REEL 038300 FRAME 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2009
From: FU, CHU-CHEN; KUMAR, TANMAY; PING, ER-XUAN; XU, HUIWAN
To: SANDISK 3D LLC
Reel/Frame 022158/0035 →
Continuity (1)
Related Publication 20100176366A1 · Jul 15, 2010