Device and method for liquid treatment of wafer-shaped articles

1. A device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane (W 1 ), a second surface plane (W 2 ), and an edge surface; the device comprising:

a support for holding the wafer-shaped article, the support comprising at least three gripping members for securely holding said edge surface of the wafer-shaped article during operation, wherein the gripping members can be radially moved outwardly for opening; and

liquid dispensing means for dispensing liquid onto said first surface plane (W 1 ) of the wafer-shaped article not facing the support; and

a liquid guiding member mounted to the support, the liquid guiding member for guiding at least a part of said liquid around the edge surface of the wafer-shaped article towards the second surface plane (W 2 ) of the wafer-shaped article facing the support thereby wetting at least the edge surface,

wherein said liquid guiding member has the form of a ring, said ring having a liquid guiding lip that projects from a plane of symmetry (M) between the first surface plane (W 1 ) and the second surface plane (W 2 ) of the wafer-shaped article with respect to the support, and

wherein a diameter (dL) of the liquid guiding lip is greater than a diameter of the wafer-shaped article (dW).

2. The device according to claim 1 , wherein an inwardly facing surface of the guiding lip and an upper surface of the guiding lip include an acute angle.

3. The device according to claim 1 , wherein said liquid guiding lip projects from said first surface plane (W 1 ) with respect to the support.

4. The device according to claim 1 , wherein,

said ring has an outer diameter (dl) greater than the diameter (dw) of the wafer-shaped article,

said ring has an inner diameter (d 2 ) smaller than the diameter (dw) of the wafer-shaped article, and

said ring comprises an annular lip formed in a surface facing the same direction as the first surface plane (W 1 ) of the wafer-shaped article.

5. The device according to claim 3 , wherein the difference of the diameter (dw) of the wafer-shaped article and said ring has an inner diameter (d 2 ) is not more than 3 mm (dw−d 2 ≦3 mm).

6. The device according to claim 1 , wherein,

said ring has an inner surface facing the edge surface of wafer-shaped article when treated, and

said ring inner surface forms a gap between said ring inner surface and the edge surface of wafer-shaped article with a gap distance (g) of not more than 2 mm (g≦2 mm).

7. The device according to claim 6 , wherein said gap distance g is not more than 1 mm.

8. The device according to claim 1 , wherein the ring has a first ring part facing the edge surface of the wafer-shaped article and a second ring part facing the second surface plane (W 2 ) of the wafer-shaped article.

9. The device according to claim 1 , wherein said support is rotatable mounted for rotating the wafer-shaped article around an axis perpendicular to a surface plane.

10. The device according to claim 1 , further comprising:

a gas supply means provided in the support, the gas supply means configured to direct gas onto the second surface plane (W 2 ) of the wafer-shaped article when treated.

11. A method for wet treatment of a defined peripheral edge-region of a wafer-shaped article having a first surface plane (W 1 ), a second surface plane (W 2 ), and an edge surface, said method comprising the steps of:

holding the wafer-shaped article on the edge surface with a support by gripping members, wherein there are at least three such gripping members arranged and for picking and placing the wafer-shaped article, and the gripping members are moved radially outward for opening;

dispensing liquid onto said first surface plane (W 1 ); and

guiding said liquid around the edge surface of the wafer-shaped article towards the second surface plane (W 2 ) with liquid guiding member and thereby wetting said defined peripheral edge-region,

wherein said liquid guiding member has the form of a ring, and said ring has a liquid guiding lip that projects from a plane of symmetry (M) between the first surface plane (W 1 ) and the second surface plane (W 2 ) of the wafer-shaped article with respect to the support, and

wherein a diameter (dL) of the liquid guiding lip is greater than a diameter (dW) of the wafer-shaped article.

12. The method according to claim 11 , wherein an inwardly facing surface of the guiding lip and an upper surface of the guiding lip include an acute angle.

13. The method according to claim 11 , wherein the wafer is rotated by rotating the support.

14. A device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane (W 1 ), a second surface plane (W 2 ), and an edge surface; the device comprising:

a support arranged for holding the wafer-shaped article, the support comprising at least three gripping members for securely holding said edge surface of the wafer-shaped article during operation, wherein the gripping members are radially moved outwardly for opening, said support rotatable mounted for rotating the wafer-shaped article around an axis perpendicular to a surface plane; and

liquid dispenser arranged for dispensing liquid onto said first surface plane (W 1 ) of the wafer-shaped article, the first surface plane (W 1 ) positioned not facing the support; and

a liquid guiding member mounted to the support and arranged for guiding at least a part of said liquid around the edge surface of the wafer-shaped article towards the second surface plane (W 2 ) of the wafer-shaped article, the second surface plane (W 2 ) positioned facing the support, thereby wetting at least the edge surface,

wherein said liquid guiding member comprises a ring, said ring having a liquid guiding lip that projects from a plane of symmetry (M) between the first surface plane (W 1 ) and the second surface plane (W 2 ) of the wafer-shaped article with respect to the support, and

wherein an inside, upper surface diameter (dL) of the liquid guiding lip is greater than an outside most diameter of the wafer-shaped article (dW).