Integrated circuit package system with a heat sink

1. A method for manufacture of an integrated circuit package system comprising:

forming a substrate having an integrated circuit die thereon;

thermally connecting a heat slug and the integrated circuit die by a resilient thermal structure having multiple coils and a base positioned between the heat slug and the integrated circuit die, and the base is in direct uninterrupted contact with the integrated circuit die with a lateral distance larger than a width of each of the multiple coils; and

encapsulating the integrated circuit die and the resilient thermal structure with a molding compound in and around the resilient thermal structure.

2. The method as claimed in claim 1 wherein thermally connecting the heat slug and the resilient thermal structure to the integrated circuit die comprises forming an interconnected resilient thermal structure with a coil in an array configuration connected with a top interconnect and a bottom interconnect.

3. The method as claimed in claim 1 wherein thermally connecting the heat slug and the resilient thermal structure to the integrated circuit die comprises forming a single resilient thermal structure with a coil having a plate at a bottom of the coil on the integrated circuit die.

4. The method as claimed in claim 1 wherein thermally connecting the heat slug and the resilient thermal structure to the integrated circuit die comprises forming a complementary resilient thermal structure having an alternating configuration with a spacer structure and a complementary spacer.

5. The method as claimed in claim 1 wherein thermally connecting the heat slug and the resilient thermal structure to the integrated circuit die comprises positioning a cap-type heat slug over the integrated circuit die.

6. A method for manufacture of an integrated circuit package system comprising:

forming a substrate having an integrated circuit die on the substrate with an adhesive;

forming a top thermal path with a slug surface of a heat slug and a resilient thermal structure having multiple coils and a base positioned between the heat slug and the integrated circuit die, and the base is in direct uninterrupted contact with the integrated circuit die with a lateral distance larger than a width of each of the multiple coils;

forming a bottom thermal path with a metal layer of the substrate and an external interconnect below the integrated circuit die; and

encapsulating the integrated circuit and the resilient thermal structure with a molding compound in and around the resilient thermal structure.

7. The method as claimed in claim 6 further comprising connecting an electrical interconnect between the integrated circuit die and the substrate.

8. The method as claimed in claim 6 wherein forming the top thermal path with the slug surface of the heat slug and the resilient thermal structure comprises forming the top thermal path with a flat heat slug and the resilient thermal structure.

9. The method as claimed in claim 6 wherein forming the substrate comprises forming the substrate having two layers.

10. The method as claimed in claim 6 further comprising attaching a slug end of the heat slug to the metal layer of the substrate.

11. An integrated circuit package system comprising:

a substrate having an integrated circuit die thereon;

a heat slug thermally connected to the integrated circuit die by a resilient thermal structure having multiple coils and a base positioned between the heat slug and the integrated circuit die, and the base is in direct uninterrupted contact with the integrated circuit die with a lateral distance larger than a width of each of the multiple coils; and

a molding compound encapsulating the integrated circuit die and in and around the resilient thermal structure.

12. The system as claimed in claim 11 wherein the heat slug and the resilient thermal structure thermally connected to the integrated circuit die comprises an interconnected resilient thermal structure with a coil in an array configuration connected with a top interconnect and a bottom interconnect.

13. The system as claimed in claim 11 wherein the heat slug and the resilient thermal structure thermally connected to the integrated circuit die comprises a single resilient thermal structure having a plate on the integrated circuit die.

14. The system as claimed in claim 11 wherein the heat slug and the resilient thermal structure thermally connected to the integrated circuit die comprises a complementary resilient thermal structure having an alternating configuration with a spacer structure and a complementary spacer structure.

15. The system as claimed in claim 11 wherein the heat slug and the resilient thermal structure thermally connected to the integrated circuit die is a cap-type heat slug over the integrated circuit die.

16. The system as claimed in claim 11 wherein:

the substrate having an integrated circuit die thereon has an insulator;

the heat slug and the resilient thermal structure are thermally connected to the integrated circuit die;

the molding compound to cover the resilient thermal structure is an epoxy molding compound; and

further comprising:

a top thermal path with a slug surface of the heat slug and the resilient thermal structure to the integrated circuit die; and

a bottom thermal path with a metal layer of the substrate and an external interconnect below the integrated circuit die.

17. The system as claimed in claim 16 further comprising an electrical interconnect between the integrated circuit die and the substrate.

18. The system as claimed in claim 16 wherein the top thermal path with the slug surface of the heat slug and the resilient thermal structure comprises the top thermal path with a flat heat slug and the resilient thermal structure.

19. The system as claimed in claim 16 wherein the substrate is the substrate having two layers.

20. The system as claimed in claim 16 further comprising a slug end of the heat slug attached to the metal layer of the substrate.