Three-dimensional microstructures and methods of formation thereof
View Patent ↗Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
1. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element formed of a first material;
a second microstructural element formed of a second material;
a substrate over which the first microstructural element and the second microstructural element are disposed; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
wherein, the first microstructural element comprises a patterned locking portion disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element.
2. The three-dimensional microstructure of claim 1 , wherein the patterned locking portion is rounded.
3. The three-dimensional microstructure of claim 1 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
4. The three-dimensional microstructure of claim 3 , wherein the non-solid volume is under vacuum or in a gas state, and is disposed between the center conductor and the outer conductor.
5. The three-dimensional microstructure of claim 3 , wherein the coaxial transmission line has a generally rectangular coaxial geometry.
6. The three-dimensional microstructure of claim 3 , wherein the dielectric support member comprises at least one patterned locking portion at opposing ends of the dielectric support member in mechanically locking engagement with opposing surfaces of the outer conductor.
7. The three-dimensional microstructure of claim 1 , wherein the patterned locking portion comprises an aperture extending at least partially through the first microstructural element.
8. The three-dimensional microstructure of claim 7 , wherein metal material is disposed in the aperture affixing the first microstructural element to the second microstructural element.
9. The three-dimensional microstructure of claim 8 , wherein the second microstructural element comprises metal material and the metal material in the aperture is of the same metal material as the metal material of the second microstructural element.
10. The three-dimensional microstructure of claim 7 , wherein the aperture has a reentrant shape.
11. The three-dimensional microstructure of claim 7 , wherein the aperture extends completely through the first microstructural element from a first surface to a second surface thereof.
12. The three-dimensional microstructure of claim 1 , wherein the patterned locking portion comprises a reentrant profile.
13. A method of forming a three-dimensional microstructure by a sequential build process, comprising:
forming a plurality of layers over a substrate, wherein the layers comprise at least one of a first material, a second material and a sacrificial material;
forming a first microstructural element comprising the first material and including a patterned locking portion;
forming a second microstructural element comprising the second material; and
removing the sacrificial material to form a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
wherein, the patterned locking portion is disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element.
14. The method of claim 13 , wherein the patterned locking portion comprises a reentrant profile.
15. The method of claim 13 , wherein the patterned locking portion comprises an aperture extending at least partially therethrough.
16. The method of claim 15 , comprising depositing a metal material in the aperture, affixing the first microstructural element to the second microstructural element.
17. The method of claim 13 , wherein the first material is a dielectric material and the second material is a metal material.
18. The method of claim 13 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
19. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element formed of a first material;
a second microstructural element formed of a second material; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
the first microstructural element comprising a patterned locking portion including a reentrant profile and disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element.
20. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element formed of a first material;
a second microstructural element formed of a second material; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
the first microstructural element comprising a patterned locking portion disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element,
the microstructure including a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, the dielectric support member being the first microstructural element, and the inner conductor and/or the outer conductor being the second microstructural element,
the dielectric support member comprising a patterned locking portion at opposing ends of the dielectric support member in mechanically locking engagement with opposing surfaces of the outer conductor.
21. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element formed of a first material;
a second microstructural element formed of a second material; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
the first microstructural element comprising a patterned locking portion disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element,
the patterned locking portion comprising an aperture extending at least partially through the first microstructural element and including a reentrant shape.
22. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element formed of a first material;
a second microstructural element formed of a second material; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
the first microstructural element comprising a patterned locking portion disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element,
the patterned locking portion comprising an aperture extending at least partially through the first microstructural element,
wherein metal material is disposed in the aperture affixing the first microstructural element to the second microstructural element.
23. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element formed of a first material;
a second microstructural element formed of a second material; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
the first microstructural element comprising a patterned locking portion disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element,
the patterned locking portion comprising an aperture extending completely through the first microstructural element from a first surface to a second surface thereof.