Substrate cleaning device and substrate cleaning method
A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction.
1. A substrate cleaning device comprising:
a rotary substrate holding device that horizontally holds a substrate;
a cleaning liquid pouring nozzle that pours a cleaning liquid onto a surface of a substrate held by the rotary substrate holding device; and
a driving device that moves the cleaning liquid pouring nozzle while the substrate is being rotated so that a region on the surface of the substrate onto which the cleaning liquid poured through the cleaning liquid pouring nozzle moves from a central part toward a circumference of the substrate,
wherein the cleaning liquid pouring nozzle has a portion which faces the surface of the substrate, the portion of the cleaning liquid pouring nozzle comprises
a recess having an opening open toward the circumference of the substrate and a V-shape in a plane view having a broader width toward the circumference of the substrate, the recess being formed of a top wall and a side wall standing from an edge of the top wall and surrounding the top wall so as to form the opening,
a nozzle opening for pouring the cleaning liquid onto the substrate, formed on the top wall of the recess, and
a liquid damming member, for damming the cleaning liquid poured out through the nozzle opening onto the substrate,
the liquid damming member being composed of
a first portion surrounding the recess, including the top wall and the side wall, and
a second portion extending from an edge of the side wall at a height lower than that of the nozzle opening.
2. The substrate cleaning device according to claim 1 , wherein the height of the liquid damming member decreases gradually in the rotating direction of the substrate.
3. The substrate cleaning device according to claim 1 , wherein the substrate is at a stage after being processed by an immersion exposure process that coats the surface of the substrate with a liquid for exposure and before being subject to a heating process.
4. The substrate cleaning device according to claim 1 , wherein the substrate is rotated at a rotating speed of 500 rpm or below.
5. The substrate cleaning device according to claim 1 , wherein the recess is substantially V-shaped in a direction in which the cleaning liquid pouring nozzle is moved.
6. The substrate cleaning device according to claim 1 , wherein the top wall is at about 2 mm from the surface of the substrate, and the second portion is at about 1 mm from the surface of the substrate.