Electrically conductive adhesive
View Patent ↗Disclosed is an electrically conductive adhesive that includes an electrically conductive powder, a heat-curable silicone resin, and a solvent.
1. An electrically conductive adhesive comprising: an electrically conductive powder, a heat-curable silicone resin, and a solvent,
wherein the heat-curable silicone resin comprises an alkyl group having 1 to 10 carbon atoms or a phenyl group, wherein the heat-curable silicone resin undergoes a hydrolysispolymerization reaction at 150 degrees or higher, and wherein the heat-curable silicone resin has a polysiloxane oligomer for backbone of the heat-curable silicone resin.
2. The electrically conductive adhesive according to claim 1 , wherein the amount of the heat-curable silicone resin added is 2% by weight to 50% by weight based on the total weight of the electrically conductive powder.
3. The electrically conductive adhesive according to claim 1 , wherein the electrically conductive powder is one or more types of metal selected from the group consisting of gold, silver, copper, aluminum, nickel, palladium, platinum, rhodium, stainless steel and alloys thereof, glass powder plated with any of the above metals, ceramic powder plated with any of the above metals, resin powder plated with any of the above metals, graphite and mixtures thereof.
4. The electrically conductive adhesive according to claim 1 , wherein the electrically conductive powder is selected from the group consisting of spherical silver powder, flaked silver powder, colloidal metal powder or precious metal resinate powder.
5. The electrically conductive adhesive according to claim 1 , further comprising an inorganic substance having a thermal conductivity of 20 W/km or more.
6. The electrically conductive adhesive according to claim 1 , wherein an organic solvent having a boiling point of 100 degrees or higher is contained at 4% by weight to 30% by weight based on the total weight of the electrically conductive powder.
7. An electric circuit board comprising: a substrate; an electric circuit formed on the substrate; the electrically conductive adhesive according to claim 1 applied onto the electric circuit; and an adhered object adhered to the electrically conductive adhesive.
8. An electric circuit board comprising: a substrate; an electric circuit formed on the substrate; the electrically conductive adhesive according to claim 1 applied onto a portion where the electric circuit is not formed; an adhered object adhered to the electrically conductive adhesive; and an electrically conductive connecting material that connects the adhered object to the electric circuit.
9. An electric circuit board comprising: a substrate; the electrically conductive adhesive according to claim 1 applied onto an electric circuit pattern on the substrate; and, an adhered object adhered to the electrically conductive adhesive.
10. The electrically conductive adhesive according to claim 1 , wherein the amount of the electrically conductive powder is 70% by weight to 90% by weight based on the total weight of the electrically conductive adhesive, wherein the amount of the heat-curable silicone resin is 5% by weight to 20% by weight based on the total weight of the electrically conductive powder, and wherein the amount of the solvent is 4% by weight to 30% by weight based on the total weight of the electrically conductive powder.
11. The electrically conductive adhesive according to claim 1 , wherein the electrically conductive powder comprises a nano-sized metal powder having a mean particle size of 1 nm to 100 nm and a spherical silver powder having a mean particle size of 0.3 μm to 3.0 μm.
12. The electrically conductive adhesive according to claim 1 , wherein the electrically conductive powder comprises a nano-sized metal powder having a mean particle size of 1 nm to 100 nm and a flaked silver powder having a mean particle size of 0.3 μm to 10 μm.
13. The electrically conductive adhesive according to claim 1 , wherein the electrically conductive powder comprises 80% by weight to 99% by weight of a spherical silver powder and 1% by weight to 20% by weight of a colloidal silver powder based on the total weight of the electrically conductive powder.
14. The electrically conductive adhesive according to claim 1 , wherein the electrically conductive powder comprises 90% by weight to 99% by weight of a flaked silver powder and 1% by weight to 10% by weight of a colloidal silver powder based on the total weight of the electrically conductive powder.
15. The electrically conductive adhesive according to claim 1 , wherein the electrically conductive powder comprises 70% by weight to 90% by weight of a spherical silver powder and 10% by weight to 30% by weight of a flaked silver powder based on the total weight of the electrically conductive powder.
16. The electrically conductive adhesive according to claim 1 , wherein the 70% or more of the heat-curable silicone resin changes to inorganic oxide at 300 degrees or lower.
17. An electric circuit board according to claim 7 , wherein the adhered object is a LED devise or a LED package.
18. An electric circuit board according to claim 8 , wherein the adhered object is a LED devise or a LED package.