Polishing end point detection method, polishing end point detection apparatus and polishing apparatus
A polishing end point detection method is to detect a polishing end point of a workpiece having a multilayer structure. The method is performed by emitting a first light and a second light to a surface of the workpiece at a first angle of incidence and a second angle of incidence, respectively, receiving the first light and the second light reflected from the surface through a polarizing filter, performing a first analyzing process of analyzing a brightness and a saturation of the surface from the first light received, performing a second analyzing process of analyzing a brightness and a saturation of the surface from the second light received, and determining removal of the upper layer based on changes in the brightness and the saturation of the surface.
1. A method of detecting a polishing end point of a workpiece having an upper layer and an underlying lower layer, said method comprising:
emitting a first light and a second light to a surface of the workpiece at a first angle of incidence and a second angle of incidence, respectively;
receiving the first light and the second light reflected from the surface through a polarizing filter;
performing a first analyzing process of analyzing a brightness and a saturation of the surface from the first light received;
performing a second analyzing process of analyzing a brightness and a saturation of the surface from the second light received; and
determining removal of the upper layer based on changes in the brightness and the saturation of the surface.
2. The method according to claim 1 , wherein:
the first angle of incidence is an angle selected from a range of a first Brewster's angle ±10 degrees, the first Brewster's angle depending on the upper layer; and
the second angle of incidence is an angle selected from a range of a second Brewster's angle ±10 degrees, the second Brewster's angle depending on the lower layer.
3. The method according to claim 1 , wherein said determining of removal of the upper layer comprises determining removal of the upper layer by detecting an abrupt changes in the brightness and the saturation of the surface analyzed from at least one of the first light and the second light.
4. The method according to claim 1 , wherein said determining of removal of the upper layer comprises determining removal of the upper layer by detecting that the brightness and the saturation of the surface analyzed from the first light exceed the brightness and the saturation of the surface analyzed from the second light.
5. The method according to claim 1 , wherein each of said first analyzing process and said second analyzing process includes:
decomposing a color of the surface into a R component, a G component, and a B component; and
quantifying the brightness and the saturation of the surface from the R component, the G component, and the B component.
6. The method according to claim 5 , wherein each of said first analyzing process and said second analyzing process further includes:
obtaining a R value, a G value, and a B value representing the quantified R component, the G component, and the B component, respectively;
calculating a RGB assessment value which is an average, a root mean square, variance, or standard deviation of the R value, the G value, and the B value, or a value given by multiplying the R value, the G value, and the B value by predetermined coefficients, respectively, and summing the resultant values; and
defining the RGB assessment value as the brightness of the surface.
7. The method according to claim 6 , wherein each of said first analyzing process and said second analyzing process further includes:
calculating a difference between the R value, the G value, and the B value; and
defining the difference as the saturation of the surface.
8. An apparatus for detecting a polishing end point of a workpiece having an upper layer and an underlying lower layer, said apparatus comprising:
a light emitter configured to emit a first light and a second light to a surface of the workpiece at a first angle of incidence and a second angle of incidence, respectively;
a light receiver configured to receive the first light and the second light reflected from the surface;
a polarizing filter located between the surface of the workpiece and said light receiver; and
a processing section configured to perform a first analyzing process of analyzing a brightness and a saturation of the surface from the first light received by said light receiver and to perform a second analyzing process of analyzing a brightness and a saturation of the surface from the second light received by said light receiver,
said processing section being configured to determine removal of the upper layer based on changes in the brightness and the saturation of the surface.
9. The apparatus according to claim 8 , wherein:
the first angle of incidence is an angle selected from a range of a first Brewster's angle ±10 degrees, the first Brewster's angle depending on the upper layer; and
the second angle of incidence is an angle selected from a range of a second Brewster's angle ±10 degrees, the second Brewster's angle depending on the lower layer.
10. The apparatus according to claim 8 , wherein said processing section determines removal of the upper layer by detecting abrupt changes in the brightness and the saturation of the surface analyzed from at least one of the first light and the second light.
11. The apparatus according to claim 8 , wherein said processing section determines removal of the upper layer by detecting that the brightness and the saturation of the surface analyzed from the first light exceed the brightness and the saturation of the surface analyzed from the second light.
12. The apparatus according to claim 8 , wherein said processing section is configured:
to decompose a color of the surface into a R component, a G component, and a B component; and
to quantify the brightness and the saturation of the surface from the R component, the G component, and the B component.
13. The apparatus according to claim 12 , wherein said processing section is configured:
to obtain a R value, a G value, and a B value representing the quantified R component, the G component, and the B component, respectively;
to calculate a RGB assessment value which is an average, a root mean square, variance, or standard deviation of the R value, the G value, and the B value, or a value given by multiplying the R value, the G value, and the B value by predetermined coefficients, respectively, and summing the resultant values; and
to define the RGB assessment value as the brightness of the surface.
14. The apparatus according to claim 13 , wherein said processing section is configured:
to calculate a difference between the R value, the G value, and the B value; and
to define the difference as the saturation of the surface.
15. The apparatus according to claim 8 , wherein:
said light emitter includes a light source, a first lens configured to convert a light from said light source into a parallel light containing the first light and the second light, and a second lens configured to focus the parallel light on a point on the surface of the workpiece; and
said light receiver is configured to receive the reflected light that has been converted into a parallel light by passing through said second lens.
16. The apparatus according to claim 8 , wherein:
said light emitter includes a light source and two light-emitting optical fibers configured to direct the first light and the second light, respectively, to the surface of the workpiece; and
said light receiver includes two light-receiving optical fibers arranged at angles corresponding to angles of reflection of the first light and the second light, and two light-receiving devices coupled to said two light-receiving optical fibers, respectively.
17. An apparatus for polishing a workpiece having an upper layer and an underlying lower layer, said apparatus comprising:
a polishing table configured to support a polishing pad having the polishing surface and a through-hole;
a top ring configured to press the workpiece against the polishing surface of the polishing pad; and
a polishing end point detection unit,
said polishing end point detection unit including
(i) a light emitter configured to emit a first light and a second light through the through-hole to a surface of the workpiece at a first angle of incidence and a second angle of incidence, respectively,
(ii) a light receiver configured to receive the first light and the second light reflected from the surface,
(iii) a polarizing filter located between the surface of the workpiece and said light receiver, and
(iv) a processing section configured to perform a first analyzing process of analyzing a brightness and a saturation of the surface from the first light received and to perform a second analyzing process of analyzing a brightness and a saturation of the surface from the second light received,
wherein said processing section is configured to determine removal of the upper layer based on changes in the brightness and the saturation of the surface.
18. The apparatus according to claim 17 , wherein:
the first angle of incidence is an angle selected from a range of a first Brewster's angle ±10 degrees, the first Brewster's angle depending on the upper layer; and
the second angle of incidence is an angle selected from a range of a second Brewster's angle ±10 degrees, the second Brewster's angle depending on the lower layer.
19. The apparatus according to claim 17 , wherein said processing section determines removal of the upper layer by detecting abrupt changes in the brightness and the saturation of the surface analyzed from at least one of the first light and the second light.
20. The apparatus according to claim 17 , wherein said processing section determines removal of the upper layer by detecting that the brightness and the saturation of the surface analyzed from the first light exceed the brightness and the saturation of the surface analyzed from the second light.
21. The apparatus according to claim 17 , wherein said processing section is configured:
to decompose a color of the surface into a R component, a G component, and a B component; and
to quantify the brightness and the saturation of the surface from the R component, the G component, and the B component.
22. The apparatus according to claim 21 , wherein said processing section is configured:
to obtain a R value, a G value, and a B value representing the quantified R component, the G component, and the B component, respectively;
to calculate a RGB assessment value which is an average, a root mean square, variance, or standard deviation of the R value, the G value, and the B value, or a value given by multiplying the R value, the G value, and the B value by predetermined coefficients, respectively, and summing the resultant values; and
to define the RGB assessment value as the brightness of the surface.
23. The apparatus according to claim 22 , wherein said processing section is configured:
to calculate a difference between the R value, the G value, and the B value; and
to define the difference as the saturation of the surface.
24. The apparatus according to claim 17 , wherein:
said light emitter includes a light source, a first lens configured to convert a light from said light source into a parallel light containing the first light and the second light, and a second lens configured to focus the parallel light on a point on the surface of the workpiece; and
said light receiver is configured to receive the reflected light that has been converted into a parallel light by passing through said second lens.
25. The apparatus according to claim 17 , wherein:
said light emitter includes a light source and two light-emitting optical fibers configured to direct the first light and the second light, respectively, to the surface of the workpiece; and
said light receiver includes two light-receiving optical fibers arranged at angles corresponding to angles of reflection of the first light and the second light, and two light-receiving devices coupled to said two light-receiving optical fibers, respectively.
26. The apparatus according to claim 17 , further comprising:
a liquid supply source configured to supply a liquid into a space defined by the through-hole and the surface of the workpiece.