Methods of patterning insulating layers using etching techniques that compensate for etch rate variations
Methods of forming integrated circuit devices include forming an integrated circuit substrate having an electrically insulating layer thereon and forming a mask layer pattern having at least first and second openings of different size therein, on the electrically insulating layer. First and second portions of the electrically insulating layer extending opposite the first and second openings, respectively, are simultaneously etched at first and second different etch rates. This etching yields a first trench extending adjacent the first opening that is deeper than a second trench extending adjacent the second opening. Then, the bottoms of the first and second trenches are simultaneously etched to substantially the same depths using an etching process that compensates for the first and second different etch rates.
1. A method of forming an integrated circuit device, comprising:
forming an integrated circuit substrate having an electrically insulating layer thereon;
forming a mask layer pattern having at least first and second openings of different size therein, on the electrically insulating layer;
simultaneously etching first and second portions of the electrically insulating layer extending opposite the first and second openings, respectively, at first and second different etch rates that yield a first trench extending adjacent the first opening that is deeper than a second trench extending adjacent the second opening, by exposing the first and second portions of the electrically insulating layer to an etching gas comprising C x F y , where 2x≧y, x>0 and y>0; and then
simultaneously etching the first and second trenches to substantially the same depths using an etching process that compensates for the first and second different etch rates associated with etching the first and second portions of the electrically insulating layer, said etching process comprising exposing the first and second trenches to an etching gas comprising C x′ F y′ , where 2x′≦y′, x′>0 and y′>0;
wherein a first width of the first openings is smaller than a second width of the second openings.
2. The method of claim 1 , wherein simultaneously etching the first and second trenches comprises exposing the first and second trenches to an etching gas selected from a group consisting of CF 4 .
3. A method of forming an integrated circuit device, comprising:
forming a mask layer pattern having at least first and second openings of different size therein, on an electrically insulating layer;
simultaneously etching first and second portions of the electrically insulating layer extending opposite the first and second openings, respectively, at first and second different etch rates that yield a first trench extending adjacent the first opening that is deeper than a second trench extending adjacent the second opening, by exposing the first and second portions of the electrically insulating layer to an etching gas comprising C x F y , where 2x≧y, x>0 and y>0; and then
simultaneously etching bottoms of the first and second trenches at different rates using an etching process that compensates for the first and second different etch rates associated with etching the first and second portions of the electrically insulating layer, said etching process comprising exposing the first and second trenches to an etching gas comprising C x′ F y′ , where 2x′≦y′, x′>0 and y′>0;
wherein a first width of the first openings is smaller than a second width of the second openings.
4. A method of forming an integrated circuit device, comprising:
forming an integrated circuit substrate having an electrically insulating layer thereon;
forming a mask layer pattern having at least first and second openings of different size therein, on the electrically insulating layer, wherein a first width of the first openings is smaller than a second width of the second openings;
simultaneously etching first and second portions of the electrically insulating layer extending opposite the first and second openings, respectively, at first and second different etch rates that yield a first trench extending adjacent the first opening that is deeper than a second trench extending adjacent the second opening; and then
simultaneously etching the first and second trenches to substantially the same depths using an etching process that compensates for the first and second different etch rates associated with etching the first and second portions of the electrically insulating layer.