Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

1. A method of making a semiconductor device, comprising:

providing a semiconductor wafer having a plurality of semiconductor die with a first surface and a second surface opposite the first surface;

providing a peripheral region around the semiconductor die between the first and second surfaces;

depositing an insulating material in the peripheral region around the semiconductor die between the first and second surfaces;

removing a portion of the insulating material to form a through hole via (THV);

depositing a conductive material in the THV to form a conductive THV;

forming a conductive layer between the conductive THV and contact pads of the semiconductor die;

depositing noise absorbing material in the peripheral region around the conductive THV to isolate the semiconductor die from intra-device interference; and

singulating the semiconductor wafer through the peripheral region to separate the semiconductor die.

2. The method of claim 1 , wherein the noise absorbing material extends through the peripheral region from the first surface of the semiconductor die to the second surface of the semiconductor die.

3. The method of claim 1 , wherein the noise absorbing material has an angular, semi-circular, or rectangular shape.

4. The method of claim 1 , further including forming a plurality of conductive THVs and dispersing the noise absorbing material in the peripheral region between the plurality of conductive THVs.

5. The method of claim 1 , further including forming the noise absorbing material completely around the conductive THV in the peripheral region.

6. The method of claim 1 , further including forming the noise absorbing material around a plurality of conductive THVs in the peripheral region.

7. The method of claim 1 , further including forming a barrier layer between the noise absorbing material and conductive THV in the peripheral region.

8. A method of making a semiconductor device, comprising:

providing a semiconductor wafer having a plurality of semiconductor die with a first surface and a second surface opposite the first surface;

providing a peripheral region around the semiconductor die;

depositing an insulating material in the peripheral region around the semiconductor die between the first and second surfaces;

removing a portion of the insulating material to form a plurality of through hole via (THVs);

depositing a conductive material in the THVs to form conductive THVs;

forming a conductive layer between the conductive THVs and contact pads of the semiconductor die; and

forming a shielding region in the peripheral region between the conductive THVs to isolate the semiconductor die with respect to intra-device interference.

9. The method of claim 8 , wherein the shielding region extends through the peripheral region from a first side of the semiconductor die to a second side of the semiconductor die.

10. The method of claim 8 , wherein the shielding region has an angular, semi-circular, or rectangular shape.

11. The method of claim 8 , further including dispersing shielding material in the peripheral region between the conductive THVs.

12. The method of claim 8 , further including forming the shielding region around the conductive THVs in the peripheral region.

13. The method of claim 8 , further including forming a barrier layer between the shielding region and conductive THVs in the peripheral region.

14. A method of making a semiconductor device, comprising:

providing a semiconductor wafer having a first and second semiconductor die;

forming a through hole via (THV) in a peripheral region between the first and second semiconductor die;

depositing a conductive material in the THV to form a conductive THV;

forming a conductive layer between the conductive THV and contact pads of the first semiconductor die; and

depositing a shielding material in the peripheral region between the conductive THV to isolate the first semiconductor die with respect to interference.

15. The method of claim 14 , wherein the shielding material extends through the peripheral region from a first side of the first semiconductor die to a second side of the first semiconductor die.

16. The method of claim 14 , wherein the shielding material has an angular, semi-circular, or rectangular shape.

17. The method of claim 14 , further including dispersing the shielding material in the peripheral region between the conductive THV.

18. The method of claim 14 , further including depositing the shielding material around the conductive THV in the peripheral region.

19. The method of claim 14 , further including forming a barrier layer between the shielding material and conductive THV in the peripheral region.

20. A method of making a semiconductor device, comprising:

providing a semiconductor wafer having a plurality of semiconductor die vertically aligned with a first level;

forming conductive through hole vias (THVs) in a peripheral region of the semiconductor die vertically aligned with the first level;

forming a conductive layer between the conductive THVs and a contact pad of the semiconductor die; and

forming a shielding region in the peripheral region between the conductive THVs to isolate the semiconductor die with respect to interference.

21. The method of claim 20 , wherein the shielding region extends through the peripheral region from a first side of the semiconductor die to a second side of the semiconductor die.

22. The method of claim 20 , wherein the shielding region has an angular, semi-circular, or rectangular shape.

23. The method of claim 20 , further including dispersing shielding material in the peripheral region among the conductive THVs.

24. The method of claim 20 , further including forming the shielding region around the conductive THVs in the peripheral region.

25. The method of claim 20 , further including forming a barrier layer between the shielding region and conductive THVs in the peripheral region.

26. A method of making a semiconductor device, comprising:

providing a semiconductor wafer having a plurality of semiconductor die with a first surface and a second surface opposite the first surface;

providing a peripheral region around the semiconductor die;

forming a conductive through hole via (THV) in the peripheral region around the semiconductor die between the first and second surfaces;

forming a conductive layer between the conductive THV and a contact pad of the semiconductor die; and

forming a shielding region in the peripheral region around the conductive THV to isolate the semiconductor die with respect to interference.

27. The method of claim 26 , wherein the shielding region extends through the peripheral region from the first and second surfaces.

28. The method of claim 26 , wherein the shielding region has an angular, semi-circular, or rectangular shape.

29. The method of claim 26 , further including forming a plurality of conductive THVs and forming the shielding region in the peripheral region between the plurality of conductive THV.

30. The method of claim 26 , further including forming the shielding region completely around the conductive THV in the peripheral region.

31. The method of claim 26 , further including forming the shielding region around a plurality of conductive THVs in the peripheral region.

32. The method of claim 26 , further including forming a barrier layer between the shielding region and conductive THV in the peripheral region.